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HCF40257BE

STMicroelectronics

HCF40257BE by STMicroelectronics

HCF40257BE by STMicroelectronics is a CMOS multiplexer with 4 functions, 2 inputs, and 16 terminals. It has a propagation delay of 300 ns at 3/15 V power supplies. This industrial-grade device operates b/w -40 to 85 °C and is ideal for applications requiring high-speed signal switching.

Median Price

$0.487

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,945 parts In-Stock

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Vyrian

USA . 3,047 parts In-Stock

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Anansix

USA . 896 parts In-Stock

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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Sinequanon

UK . 147 parts In-Stock

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Electronic Expediters

USA . 80 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 70 parts In-Stock

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Bristol Electronics

USA . 50 parts In-Stock

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$0.487

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ECAB

Sweden . 30 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

. 9 parts In-Stock

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GES GmbH

Germany . 8 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,731 parts In-Stock

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$12.243

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$11.019

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MKK Technologies

India . 1,227 parts In-Stock

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$23.023

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DigiPath Technology Company

USA . 1,227 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,956 parts In-Stock

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Corphita

USA . 4,718 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,637 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Northwest PG Solutions

USA . 2,115 parts In-Stock

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Native Components

USA . 947 parts In-Stock

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RC Electronics

USA . 525 parts In-Stock

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Assy Fe

Spain . 183 parts In-Stock

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Perfect Parts

USA . 157 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 70 parts In-Stock

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Parana Technologies

USA . 14 parts In-Stock

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$14.639

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Overview

Enhance your electronic projects with the HCF40257BE by STMicroelectronics, a high-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. With its durable plastic/epoxy package body material and advanced CMOS technology, this product ensures seamless operation in industrial-grade environments. Perfect for a variety of applications, this versatile component features 4 functions, 2 inputs, and a quick propagation delay of 300ns. Trust STMicroelectronics to deliver cutting-edge solutions that exceed your expectations and bring value to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 300 ns

With a fast propagation delay of 300 ns, this multiplexer/demultiplexer ensures efficient data transmission and processing.

No. of Functions: 4

Having 4 functions allows for multiple operations to be carried out simultaneously, making the product versatile and flexible.

No. of Inputs: 2

With 2 inputs, the multiplexer/demultiplexer can handle multiple data streams efficiently.

Package Shape: RECTANGULAR

The rectangular package shape ensures easy mounting and integration into existing systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures stable signal transmission and reception, reducing signal distortion.

Power Supplies (V): 3/15

Support for dual power supplies at 3V and 15V provides flexibility in voltage requirements for different applications.

No. of Terminals: 16

With 16 terminals, the multiplexer/demultiplexer can easily connect to other components in a circuit, enabling seamless data transfer.

Package Style (Meter): IN-LINE

The in-line package style allows for space-efficient integration, making it suitable for compact systems or applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this product suitable for a wide range of industrial and automotive applications.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good conductivity and solderability, ensuring reliable connections in the circuit.

Terminal Position: DUAL

Having dual terminal positions allows for easy installation and connection to other components, enhancing the overall efficiency of the product.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this temperature grade ensures reliable performance under harsh conditions.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high speed operation, making it ideal for digital circuits and data processing applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy and secure mounting on PCBs, enhancing overall durability and reliability.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, the multiplexer/demultiplexer can be easily integrated into standard breadboards or PCB layouts.

Technical Specifications

Multiplexer & Demultiplexer HCF40257BE attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Propagation Delay At Nominal Supply:

300 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF40257BE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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