Loading...

HCF40257BF

STMicroelectronics

HCF40257BF by STMicroelectronics

HCF40257BF by STMicroelectronics is a CMOS multiplexer with 4 functions and 2 inputs. It has a propagation delay of 300 ns at 3/15V, operating b/w -40 to 85 °C. Ideal for industrial applications, this IC comes in a ceramic package with 16 terminals and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,792

-

-

-

-

Vyrian

USA . 1,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,739

-

-

-

-

Anansix

USA . 263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

263

-

-

-

-

LWI Electronics Inc

India . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 461 parts In-Stock

1+ parts

$11.273

100+ parts

-

1k+ parts

$10.145

10k+ parts

-

461

$11.273

-

$10.145

-

MKK Technologies

India . 543 parts In-Stock

1+ parts

$21.198

100+ parts

-

1k+ parts

-

10k+ parts

-

543

$21.198

-

-

-

DigiPath Technology Company

USA . 543 parts In-Stock

1+ parts

$21.198

100+ parts

-

1k+ parts

-

10k+ parts

-

543

$21.198

-

-

-

Corphita

USA . 3,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,350

-

-

-

-

Parana Technologies

USA . 1,528 parts In-Stock

1+ parts

-

100+ parts

$13.478

1k+ parts

-

10k+ parts

-

1,528

-

$13.478

-

-

Native Components

USA . 819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

819

-

-

-

-

Northwest PG Solutions

USA . 45 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45

-

-

-

-

Overview

Unlock the power of efficient signal routing with the HCF40257BF from STMicroelectronics, a leading manufacturer known for top-quality components. As a multiplexer/demultiplexer in a durable ceramic package, this versatile device offers seamless integration in various applications. With low propagation delay and high functionality, this product allows for smooth data transmission and optimal performance. Trust in STMicroelectronics to deliver reliable solutions that enhance your systems with precision and reliability. Elevate your projects with the HCF40257BF and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high durability and reliability, making this product suitable for long-term use in various environments.

Propagation Delay At Nominal Supply: 300 ns

Low propagation delay ensures fast processing of signals, making this product ideal for applications that require quick response times.

No. of Functions: 4

Having multiple functions in a single device offers versatility and efficiency, reducing the need for additional components.

No. of Inputs: 2

With multiple inputs, this product can handle various input signals simultaneously, providing flexibility in signal processing.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and other electronic systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures compatibility with a wide range of external components and systems.

Power Supplies (V): 3/15

Support for multiple power supplies allows for diverse operational requirements, making this product versatile in different setups.

No. of Terminals: 16

Having a sufficient number of terminals enables easy connectivity with other components, facilitating integration within a larger system.

Package Style (Meter): IN-LINE

In-line package style simplifies the installation and connection of the multiplexer/demultiplexer within a circuit or system.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows this product to function effectively in both extreme cold and hot environments.

Terminal Finish: TIN LEAD

Tin lead finish enhances conductivity and solderability, ensuring secure and stable connections with other components.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and connection options, accommodating various circuit layouts.

Output Polarity: TRUE

True output polarity ensures accurate signal processing and consistent performance, making this product reliable for data transmission.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance enhances the product's reliability and longevity in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in signal processing.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support, ensuring secure and stable connections in various applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows easy integration and compatibility with commonly used connectors and sockets, simplifying installation and maintenance.

Technical Specifications

Multiplexer & Demultiplexer HCF40257BF attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Propagation Delay At Nominal Supply:

300 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF40257BF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17