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HCF4512BM

STMicroelectronics

HCF4512BM by STMicroelectronics

STMicroelectronics HCF4512BM is an 8-input multiplexer with a propagation delay of 360ns. Operating at temperatures from -40 to 85 °C, it features a load capacitance of 50pF and supports power supplies ranging from 3V to 15V. Ideal for industrial applications requiring CMOS technology and surface mount installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,309 parts In-Stock

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4,309

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Vyrian

USA . 2,573 parts In-Stock

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2,573

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Anansix

USA . 584 parts In-Stock

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584

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Standard Data Resources

USA . 440 parts In-Stock

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440

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,133 parts In-Stock

1+ parts

$16.470

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$14.823

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2,133

$16.470

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$14.823

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MKK Technologies

India . 1,533 parts In-Stock

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$30.970

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$30.970

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DigiPath Technology Company

USA . 1,533 parts In-Stock

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$30.970

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1,533

$30.970

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Parana Technologies

USA . 1,320 parts In-Stock

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$19.692

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$19.692

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Northwest PG Solutions

USA . 1,272 parts In-Stock

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Native Components

USA . 162 parts In-Stock

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Corphita

USA . 78 parts In-Stock

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Overview

Unlock the power of versatility and reliability with the STMicroelectronics HCF4512BM Multiplexer & Demultiplexer. Crafted by a trusted industry leader, this product offers seamless integration into a wide range of applications. With ultra-fast propagation delay, 3-STATE output characteristics, and a durable plastic/epoxy package body, customers can expect unparalleled performance and efficiency. Whether you're designing automation systems, communication devices, or industrial controls, this small outline package with dual terminal position will exceed your expectations. Embrace innovation and elevate your projects with the HCF4512BM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection to the internal components of the multiplexer & demultiplexer.

Propagation Delay At Nominal Supply: 360 ns

Low propagation delay ensures fast signal processing and minimal latency in the operation of the multiplexer & demultiplexer.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards, saving space and simplifying manufacturing processes.

No. of Inputs: 8

Having 8 inputs provides versatility and flexibility in routing multiple input signals through the multiplexer & demultiplexer.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures compatibility with various types of circuits and devices.

Power Supplies (V): 3/15

Support for multiple power supply voltages allows for compatibility with different systems and environments.

No. of Terminals: 16

Having 16 terminals enables easy connection and interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline form factor saves space and makes the multiplexer & demultiplexer suitable for compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance in various operating conditions.

Output Characteristics: 3-STATE

3-STATE output characteristics provide flexibility in controlling the output signals and bus sharing applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures that the multiplexer & demultiplexer can function in cold environments without issues.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish offers good solderability and connection reliability during installation.

Terminal Position: DUAL

Dual terminal position provides stability and secure connection points for the multiplexer & demultiplexer within the circuit.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the reliability and performance of the multiplexer & demultiplexer in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the multiplexer & demultiplexer efficient and reliable in operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and secure connection points during installation and operation of the multiplexer & demultiplexer.

Terminal Pitch: 1.27 mm

The specified terminal pitch allows for easy connection and compatibility with standard PCB layouts and mounting configurations.

Technical Specifications

Multiplexer & Demultiplexer HCF4512BM attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/15

Propagation Delay At Nominal Supply:

360 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

HCF4512BM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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