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HCF4512BE

STMicroelectronics

HCF4512BE by STMicroelectronics

HCF4512BE by STMicroelectronics is an 8-input CMOS multiplexer with a propagation delay of 360 ns and operates b/w -40 °C to 85 °C. It features a 3-state output and supports power supplies from 3V to 15V, ideal for industrial applications. Its dual in-line package ensures easy integration into various circuits.

Median Price

$29.249

Lifecycle Status

Suppliers In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Anansix

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Digiode

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ECAB

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Digital Electronic Gebert Verwaltungs UG

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Global Solutions Electronics Company

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Extreme Components

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ComSIT Distribution GmbH

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Standard Data Resources

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LittleDiode

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Electronic Expediters

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J2 Sourcing AB

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Bristol Electronics

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Lantek

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Corel Iberica Componentes, S.L.

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GES GmbH

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Ack Elektronik San.Tic.Ltd.Sti

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Fibra_Brandt Electronic GMBH

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Native Components

USA . 468 parts In-Stock

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Northwest PG Solutions

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IDEA Electronic Components Group

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MKK Technologies

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DigiPath Technology Company

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Perfect Parts

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Corphita

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Parana Technologies

USA . 2,288 parts In-Stock

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Overview

Unlock the potential of your designs with the HCF4512BE multiplexer from STMicroelectronics. Renowned for its industry-leading quality and reliability, this versatile component simplifies data routing in a wide range of applications, from telecommunications to industrial automation. With robust performance in extreme temperatures, it ensures seamless operations while optimizing power efficiency. Elevate your projects with a trusted partner—experience unmatched value and innovation with the HCF4512BE!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and lightweight characteristics, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 360 ns

With a propagation delay of just 360 ns, this multiplexer/demultiplexer provides fast signal switching, ideal for high-speed applications.

No. of Inputs: 8

Having 8 inputs allows for versatile data routing, which is beneficial in complex circuits that require multiple signal paths.

Package Shape: RECTANGULAR

The rectangular shape of the package maximizes board space efficiency, making it easier to design compact electronic circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF is favorable for high-speed switching without significant degradation in performance, making it suitable for high-frequency applications.

Power Supplies (V): 3/15

Operating on dual power supplies of 3V and 15V provides flexibility for different circuit designs, allowing it to be used in various applications.

No. of Terminals: 16

With 16 terminals, the product offers adequate connectivity options for input and output, ensuring compatibility with a wide range of devices.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy assembly and integration into circuit boards, reducing manufacturing complexity.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable operation in environments where heat dissipation is a concern, making it suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output features enhance design flexibility as they permit multiple devices to share the same output connection without conflict.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C makes this product robust for use in harsh environmental conditions, such as automotive or industrial settings.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and reliable connections, ensuring longevity in applications.

Terminal Position: DUAL

Dual terminal position allows for greater compatibility with different PCB layouts, making it versatile for various design requirements.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grade, this product is built to withstand demanding environments, suitable for rigorous applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an excellent choice for battery-powered and portable devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical stability on PCBs and makes repair or replacement easier, particularly in prototyping.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm (0.1 inch) is standard in the industry, ensuring compatibility with common breadboards and PCB layouts for easy integration.

Technical Specifications

Multiplexer & Demultiplexer HCF4512BE attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Propagation Delay At Nominal Supply:

360 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF4512BE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-444-4314, 5962144444314

NIIN

144444314

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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