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A2C25S12M3-F

STMicroelectronics

A2C25S12M3-F by STMicroelectronics

STMicroelectronics A2C25S12M3-F is an N-CHANNEL IGBT for POWER CONTROL applications. With VCEsat of 2.45V, IC of 25A, and toff of 338ns, it offers efficient power management. Operating b/w -40°C to 150°C, this transistor has a max VCE of 1200V in a RECTANGULAR package with 35 terminals.

Median Price

$68.748

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$60.720

1k+ parts

$54.330

10k+ parts

$51.140

6

-

$60.720

$54.330

$51.140

Verical

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$76.775

1k+ parts

$69.425

10k+ parts

-

6

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$76.775

$69.425

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Distributors (In-Stock)

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Digiode

USA . 4,758 parts In-Stock

1+ parts

$62.073

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4,758

$62.073

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Vyrian

USA . 3,913 parts In-Stock

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Anansix

USA . 981 parts In-Stock

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981

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VNN

France . 311 parts In-Stock

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311

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Nova Conductors

Japan . 83 parts In-Stock

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Rutronik

Germany . 10 parts In-Stock

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$51.160

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10

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$51.160

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IDEA Electronic Components Group

UK . 1,036 parts In-Stock

1+ parts

$0.368

100+ parts

-

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$0.331

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1,036

$0.368

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$0.331

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MKK Technologies

India . 2,221 parts In-Stock

1+ parts

$0.692

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2,221

$0.692

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DigiPath Technology Company

USA . 2,221 parts In-Stock

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$0.692

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2,221

$0.692

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Ampacity Inc.

Singapore . 6 parts In-Stock

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$55.540

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6

$55.540

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Corphita

USA . 2,164 parts In-Stock

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$58.806

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$58.806

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Microchip USA

USA . 2,192 parts In-Stock

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$142.048

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2,192

$142.048

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Parana Technologies

USA . 268 parts In-Stock

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$0.440

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$0.440

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Perfect Parts

USA . 116 parts In-Stock

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Netroflash

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Overview

Elevate your power control applications with the A2C25S12M3-F by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor offers a complex configuration with 7 elements, making it ideal for a wide range of power control tasks. With a maximum VCEsat of 2.45V and a nominal turn-off time of 338ns, this transistor provides exceptional performance and efficiency. Trust STMicroelectronics to bring value and innovation to your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs offer better conduction characteristics and lower on-state voltage drop compared to P-CHANNEL, making it a more efficient choice for power control applications.

Configuration: COMPLEX

Complex configurations provide improved performance in high voltage and high current applications, making this IGBT suitable for demanding power control tasks.

Maximum VCEsat: 2.45 V

Low maximum VCE saturation voltage ensures minimal power loss and increased efficiency in power control applications.

Package Shape: RECTANGULAR

Rectangular package shapes allow for easier mounting and integration into electronic systems, making this IGBT a convenient choice for various applications.

Nominal Turn Off Time (toff): 338 ns

Fast turn off time ensures quick switching capability, making this IGBT suitable for high-frequency power control applications.

Maximum Power Dissipation (Abs): 197 W

High maximum power dissipation capability allows for handling large power loads, making this IGBT ideal for high-power applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance ensures the IGBT can withstand heat generated during operation, making it suitable for industrial environments.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for handling high voltage levels, making this IGBT suitable for high voltage power control applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage specification ensures proper gate control, enabling precise switching in power control applications.

Maximum Collector Current (IC): 25 A

High maximum collector current rating allows for handling large currents, making this IGBT suitable for high-current power control applications.

Nominal Turn On Time (ton): 125.2 ns

Fast turn on time ensures quick response and switching speed, making this IGBT suitable for applications requiring rapid on-off transitions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) A2C25S12M3-F attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

338 ns

Nominal Turn On Time (ton):

125.2 ns

Maximum VCEsat:

2.45 V

Trade Compliance

A2C25S12M3-F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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