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74VHCU04TTR

STMicroelectronics

74VHCU04TTR by STMicroelectronics

74VHCU04TTR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 8 ns, operating b/w 2-5.5 V. It features six functions in a compact 14-terminal package, ideal for military applications requiring high reliability and performance. Its robust design supports temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,000 parts In-Stock

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6,000

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Digiode

USA . 4,776 parts In-Stock

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4,776

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Anansix

USA . 1,909 parts In-Stock

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1,909

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,287 parts In-Stock

1+ parts

$14.393

100+ parts

-

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$12.954

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-

2,287

$14.393

-

$12.954

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$21.790

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276

$21.790

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MKK Technologies

India . 2,316 parts In-Stock

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$27.066

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2,316

$27.066

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DigiPath Technology Company

USA . 2,316 parts In-Stock

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$27.066

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2,316

$27.066

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QUARKTWIN TECHNOLOGY LTD

USA . 8,140 parts In-Stock

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8,140

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Kepictronics

USA . 5,000 parts In-Stock

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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Microchip USA

USA . 4,081 parts In-Stock

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Corphita

USA . 2,740 parts In-Stock

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2,740

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Parana Technologies

USA . 1,030 parts In-Stock

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$17.210

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1,030

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$17.210

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Northwest PG Solutions

USA . 889 parts In-Stock

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$3.576

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$3.576

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Native Components

USA . 686 parts In-Stock

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$3.539

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686

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$3.539

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Overview

Elevate your designs with the 74VHCU04TTR by STMicroelectronics, a pinnacle of reliability and performance in logic gates. Renowned for its superior quality, this versatile component excels in various applications, from consumer electronics to military systems. With low power consumption and fast propagation delays, it enhances efficiency while simplifying integration. Trust in STMicroelectronics' legacy of innovation and empower your projects with unmatched value and precision!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and resistant to environmental factors, enhancing durability.

Propagation Delay At Nominal Supply: 8 ns

With a fast propagation delay, this logic gate ensures quick signal processing, ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easier and more compact PCB designs, saving space in electronic devices.

No. of Functions: 6

Offering multiple functions in one component increases versatility and reduces the need for multiple parts.

Package Shape: RECTANGULAR

A rectangular shape aids in efficient layout on circuit boards, improving space management in design.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes it compatible with a wide range of modern electronic devices.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF is suitable for high-performance applications, optimizing speed and power consumption.

Power Supplies (V): 2/5.5

The product supports a wide range of power supplies, making it flexible for various circuit applications.

No. of Terminals: 14

With 14 terminals, the product facilitates multiple connections, enabling complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This design minimizes space usage and allows for high-density mounting on printed circuit boards.

Maximum I (ol): 8 Amp

The ability to handle up to 8 Amps makes this product suitable for high-current applications.

Propagation Delay (tpd): 13 ns

A maximum propagation delay of 13 ns ensures that the logic operations are conducted rapidly, enhancing performance.

Maximum Operating Temperature: 125 °C

This wide temperature range allows the product to operate in extreme conditions, making it reliable for harsh environments.

Minimum Operating Temperature: -55 °C

The capability to function at very low temperatures increases its applicability in specialized military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finishes improve reliability and reduce oxidation, ensuring better electrical connectivity over time.

Terminal Position: DUAL

Dual terminal positioning allows for versatile placement on PCB, optimizing space and layout flexibility.

Maximum Seated Height: 1.2 mm

A low seated height ensures a slim profile, allowing for compact designs and integration into tighter spaces.

Width: 4.4 mm

A slim width aids in space-efficient designs, providing options for miniaturized circuits.

Minimum Supply Voltage (Vsup): 2 V

Support for a minimum of 2V enables the use of the product in low-power applications, increasing energy efficiency.

Length: 5 mm

A compact length enhances design flexibility and enables easy integration into space-restricted environments.

Temperature Grade: MILITARY

A military temperature grade indicates high reliability and performance in demanding conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form provides reliable soldering, enhancing assembly efficiency and strength.

Packing Method: TR

Through-hole packing is suited for automated assembly processes, ensuring consistency in manufacturing.

Terminal Pitch: 0.65 mm

A compact terminal pitch allows for higher density component placement on circuit boards.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting up to 5.5V ensures compatibility with a variety of logic circuits and applications.

Technical Specifications

Logic Gates 74VHCU04TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHCU04TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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