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74VHC00MTCX

Onsemi

74VHC00MTCX by Onsemi

74VHC00MTCX by Onsemi is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 2-5.5V, with a propagation delay of 8.5ns at nominal supply. This small outline package is ideal for industrial applications requiring fast signal processing in a compact form factor.

Median Price

$0.180

Lifecycle Status

Suppliers In-Stock

36

In-Stock Inventory

1k+

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Arrow

USA . 885 parts In-Stock

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Mouser Electronics

USA . 1,216 parts In-Stock

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Rochester

USA . 106,209 parts In-Stock

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DigiKey

USA . 106,209 parts In-Stock

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Verical

USA . 34,825 parts In-Stock

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Future Electronics

Canada . 15,000 parts In-Stock

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Chip1Stop

Japan . 2,058 parts In-Stock

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Digiode

USA . 2,069 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Bristol Electronics

USA . 15,166 parts In-Stock

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Chip Stock

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IBS Electronics

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Vyrian

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NAC Semi

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Flip Electronics

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Cyclops Electronics Ltd

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Lantek

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Semi Source

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Atlantic Semiconductor

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Legend Electronics Inc.

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

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Prism Electronics

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Corohmni

South Africa . 401 parts In-Stock

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Corphita

USA . 2,592 parts In-Stock

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Continental Prestige Electronics

USA . 106,203 parts In-Stock

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Semicontronic

India . 39,735 parts In-Stock

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Component Stockers USA

USA . 49 parts In-Stock

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Argo Parts USA

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Netroflash

USA . 1,000 parts In-Stock

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Modulus Dynamics

Lithuania . 918 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,033 parts In-Stock

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Metaverse IC Inc.

Canada . 120,600 parts In-Stock

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Perfect Parts

USA . 53,282 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Microchip USA

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Problanco Electronics

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TANS Electronics

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GreenTree Electronics

Israel . 4,924 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 4,790 parts In-Stock

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Infinite Electronics LLP (Excess)

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Supply Digital

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SupplyDigital Components

Austria . 2,001 parts In-Stock

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Glotronic Ltd.

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UHIMA Technologies

Türkiye . 971 parts In-Stock

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Kulean Microsystems

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Kepictronics

USA . 353 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Onsemi with the 74VHC00MTCX logic gates. Perfect for a variety of applications, these logic gates offer superior performance and efficiency. With a nominal supply voltage of 3.3V and a propagation delay of just 8.5ns, this product is designed to meet your needs with precision. Trust Onsemi to deliver cutting-edge technology in a compact and durable package. Elevate your projects with the 74VHC00MTCX and experience the difference that quality and innovation can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast signal processing, making this product efficient for quick operations.

Surface Mount: YES

Surface mount capability allows for easy and flexible installation on circuit boards.

No. of Functions: 4

Having 4 functions in one device saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable performance in various circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance even in harsh industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in both hot and cold conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates 74VHC00MTCX attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74VHC00MTCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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