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74VHC238MTR

STMicroelectronics

74VHC238MTR by STMicroelectronics

74VHC238MTR from STMicroelectronics is a CMOS decoder with a fast propagation delay of 11.5 ns, operating b/w 2-5.5 V. It features a compact SO package and supports up to 8 A output current, making it ideal for high-speed digital applications. Its robust design ensures reliability in military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Inventory MP

USA . 7,226 parts In-Stock

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Bristol Electronics

USA . 7,176 parts In-Stock

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Vyrian

USA . 3,103 parts In-Stock

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Anansix

USA . 2,690 parts In-Stock

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Digiode

USA . 1,200 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 475 parts In-Stock

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$5.280

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475

$5.280

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Microchip USA

USA . 129 parts In-Stock

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$7.303

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129

$7.303

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AZTECH Wire

Italy . 1,096 parts In-Stock

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$8.980

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$8.980

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IDEA Electronic Components Group

UK . 1,605 parts In-Stock

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$25.489

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$22.940

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$25.489

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$22.940

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MKK Technologies

India . 1,985 parts In-Stock

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$47.930

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$47.930

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DigiPath Technology Company

USA . 1,985 parts In-Stock

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$47.930

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$47.930

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Component Stockers USA

USA . 770 parts In-Stock

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$99.990

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Corphita

USA . 2,430 parts In-Stock

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Assy Fe

Spain . 2,316 parts In-Stock

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Kepictronics

USA . 1,876 parts In-Stock

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Parana Technologies

USA . 1,681 parts In-Stock

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$30.476

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Perfect Parts

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Northwest PG Solutions

USA . 410 parts In-Stock

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$5.174

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$5.174

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Overview

Unlock exceptional performance with the 74VHC238MTR from STMicroelectronics—a top-tier decoder and driver solution crafted for reliability and efficiency. Renowned for their commitment to innovation and quality, STMicroelectronics delivers unmatched value through advanced technology that enhances your designs. Whether in industrial automation, consumer electronics, or automotive applications, this compact powerhouse ensures swift operations and superior adaptability, empowering your projects to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package material enhances durability and protects the internal components from environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 11.5 ns

This low propagation delay allows for faster signal transmission, improving overall system performance and responsiveness.

Surface Mount: YES

Supports surface mount technology, enabling easier integration into compact circuit designs and reducing PCB space.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, enhancing system versatility.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout on circuit boards, facilitating improved routing and space optimization.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3 V makes it compatible with modern digital circuits, promoting energy efficiency.

Load Capacitance (CL): 50 pF

Lower load capacitance improves switching speed and reduces power consumption, making it ideal for high-speed applications.

Power Supplies (V): 2/5.5

Flexible power supply voltage range provides adaptability for different application requirements.

No. of Terminals: 16

With 16 terminals, this decoder/driver supports a variety of configurations and connectivity options, enhancing its utility.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact footprint, ideal for space-constrained designs.

Maximum I (ol): 8 Amp

A high maximum output current of 8 Amps allows it to drive significant loads, making it versatile for various applications.

Propagation Delay (tpd): 18 ns

Despite being slightly higher than nominal supply propagation delay, it remains competitive in signal processing speeds.

Maximum Operating Temperature: 125 °C

A wide maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -55 °C

Operational stability at low temperatures makes it suitable for military and automotive applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish improves solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions provide flexibility in layout design and connection options.

Maximum Seated Height: 1.75 mm

A low seated height allows for better integration in tight spaces, accommodating more components on the PCB.

Width: 3.9 mm

A narrow width further optimizes board space utilization, making it ideal for miniature applications.

Output Polarity: TRUE

True output polarity ensures predictable behavior in logic circuits, making integration simpler.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum supply voltage of 2 V enhances flexibility for low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for controlled reflow soldering processes, reducing the risk of damage to sensitive components.

Peak Reflow Temperature °C: 260

The high reflow temperature capability ensures compatibility with lead-free soldering processes.

Length: 9.9 mm

Compact length contributes to efficient utilization of PCB real estate, facilitating high-density designs.

Temperature Grade: MILITARY

MILITARY-grade components ensure reliability and robustness in extreme conditions, suitable for defense applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, beneficial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint strength and improves reliability of connections.

Packing Method: TR

Tape and reel packing facilitates automated assembly, increasing efficiency in manufacturing.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with various circuit board layouts and assembly processes.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity ensures adequate protection and handling procedures during manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for higher operational flexibility while still being compliant with various power supply standards.

Technical Specifications

Decoder & Drivers 74VHC238MTR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Additional Features:

3 ENABLE INPUTS

Family:

AHC/VHC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74VHC238MTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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