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74VCXH32245LBR

STMicroelectronics

74VCXH32245LBR by STMicroelectronics

74VCXH32245LBR by STMicroelectronics is a low-profile bus driver with a propagation delay of just 2.5 ns, supporting up to 32 functions. It operates b/w 1.65V and 3.6V, making it ideal for industrial applications requiring fast data transfer. With a compact design and robust temperature range (-40 °C to 85°C), it's perfect for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,432 parts In-Stock

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2,432

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Digiode

USA . 309 parts In-Stock

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309

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Anansix

USA . 127 parts In-Stock

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127

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Distributors (Availability)

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Andel Nordic

Denmark . 1,148 parts In-Stock

1+ parts

$1.516

100+ parts

-

1k+ parts

$1.456

10k+ parts

$1.456

1,148

$1.516

-

$1.456

$1.456

AZTECH Wire

Italy . 595 parts In-Stock

1+ parts

$18.010

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-

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595

$18.010

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Ampacity Inc.

Singapore . 720 parts In-Stock

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$19.000

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720

$19.000

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IDEA Electronic Components Group

UK . 1,038 parts In-Stock

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$26.256

100+ parts

-

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$23.630

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1,038

$26.256

-

$23.630

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Microchip USA

USA . 122 parts In-Stock

1+ parts

$31.095

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122

$31.095

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MKK Technologies

India . 1,760 parts In-Stock

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$49.372

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1,760

$49.372

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DigiPath Technology Company

USA . 1,760 parts In-Stock

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$49.372

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1,760

$49.372

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Component Stockers USA

USA . 602 parts In-Stock

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$99.990

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602

$99.990

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Corphita

USA . 3,618 parts In-Stock

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3,618

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Parana Technologies

USA . 1,368 parts In-Stock

1+ parts

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$31.393

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1,368

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$31.393

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Northwest PG Solutions

USA . 1,051 parts In-Stock

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1,051

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Native Components

USA . 577 parts In-Stock

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577

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Overview

Unlock seamless connectivity and reliable performance with the 74VCXH32245LBR from STMicroelectronics—a trusted leader in quality and innovation. This advanced bus driver & transceiver enhances your system’s efficiency across diverse applications, from industrial automation to consumer electronics. With its low propagation delay and robust design, you’ll experience optimal power management and exceptional signal integrity, ensuring your projects thrive with unmatched value and dependability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 2.5 ns

A low propagation delay enhances the speed of data transmission, enabling faster communication between connected devices.

Surface Mount: YES

Being surface mount compatible allows for easier integration on modern PCBs, saving space and improving assembly efficiency.

No. of Functions: 32

Offering 32 functions means greater flexibility and a wider range of applications, catering to various design requirements.

Package Shape: RECTANGULAR

The rectangular package shape aids in better layout optimization on circuit boards, facilitating space-efficient designs.

Nominal Supply Voltage / Vsup (V): 2.3

A nominal supply voltage of 2.3V provides compatibility with low-voltage systems, making it energy-efficient.

Load Capacitance (CL): 30 pF

A low load capacitance ensures minimal signal distortion, improving the integrity of the signal transmitted.

Power Supplies (V): 3.3

With a power supply of 3.3V, this product is ideal for modern digital circuits that often operate at this standard voltage level.

No. of Terminals: 96

Having 96 terminals increases connectivity options, allowing for more robust circuit designs and greater functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The low-profile grid array design enables compact installations and saves space in dense electronic assemblies.

Maximum I (ol): 24 Amp

A maximum output current of 24 Amps allows this device to handle significant load requirements, making it suitable for high-performance applications.

Propagation Delay (tpd): 3.2 ns

With a propagation delay of 3.2 ns, the device maintains high-speed performance crucial for demanding digital applications.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C enhances reliability in high-temperature environments, ensuring stable performance.

Output Characteristics: 3-STATE

The 3-state output capability provides versatility in communication protocols, allowing for easy integration in complex systems.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures functionality in extreme cold conditions, ideal for industrial environments.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish provides excellent solderability and corrosion resistance, ensuring durability and reliability.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easy routing and connections on PCBs, making assembly more straightforward.

No. of Ports: 2

Having 2 ports allows for bidirectional data flow, enhancing communication capabilities in connected devices.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm supports low-profile designs, essential for space-constrained applications.

Width: 5.5 mm

The narrow width allows for denser packing of components on a circuit board, optimizing space usage.

Output Polarity: TRUE

TRUE output polarity indicates compatibility with standard logic levels, simplifying integration with other components.

Minimum Supply Voltage (Vsup): 1.65 V

A minimum supply voltage of 1.65V provides extended compatibility with a wider range of low-voltage applications.

Length: 13.5 mm

The compact length contributes to the overall low-profile footprint of the device, making it suitable for space-constrained environments.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in harsh operating conditions, suitable for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption characteristics and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form enhances thermal and electrical performance, ensuring efficient heat dissipation and signal integrity.

Packing Method: TR

The tape and reel packing method supports automated assembly processes, making it ideal for high-volume production scenarios.

Terminal Pitch: 0.9 mm

A terminal pitch of 0.9 mm allows for compact layouts and high-density designs, perfect for modern electronic applications.

Count Direction: BIDIRECTIONAL

Bidirectional count direction enables versatile operation in a variety of applications, enhancing system flexibility.

Control Type: COMMON CONTROL

Common control type simplifies circuit design and implementation, providing ease of use in complex systems.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V allows for robust performance while ensuring safety in high-voltage environments.

Technical Specifications

Bus Driver & Transceivers 74VCXH32245LBR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

32

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

2.5 ns

Propagation Delay (tpd):

3.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.9 mm

Terminal Position:

BOTTOM

Translation:

N/A

Width:

5.5 mm

Trade Compliance

74VCXH32245LBR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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