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74VCX162374DTR

Onsemi

74VCX162374DTR by Onsemi

74VCX162374DTR by Onsemi is a bus driver & transceiver with 3.4ns propagation delay, 8-bit data width, and 12A max I (ol). It is ideal for industrial applications requiring fast signal transmission over short distances in compact electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,369 parts In-Stock

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2,369

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Vyrian

USA . 117 parts In-Stock

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117

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 213 parts In-Stock

1+ parts

$14.040

100+ parts

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213

$14.040

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Northwest PG Solutions

USA . 85 parts In-Stock

1+ parts

$15.444

100+ parts

$13.900

1k+ parts

-

10k+ parts

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85

$15.444

$13.900

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Kulean Microsystems

USA . 6,773 parts In-Stock

1+ parts

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6,773

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TANS Electronics

Latvia . 3,622 parts In-Stock

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3,622

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SupplyDigital Components

Austria . 2,667 parts In-Stock

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2,667

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Corphita

USA . 1,145 parts In-Stock

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1,145

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Problanco Electronics

Mexico . 338 parts In-Stock

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338

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UHIMA Technologies

Türkiye . 316 parts In-Stock

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316

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Corohmni

South Africa . 82 parts In-Stock

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82

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Overview

Enhance your electronic designs with the high-quality 74VCX162374DTR by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge Bus Driver & Transceivers that guarantee superior performance and reliability. This versatile component is ideal for various applications, offering customers unmatched value with its fast propagation delay, low power consumption, and compact design. Upgrade your projects today with the 74VCX162374DTR and experience seamless operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for long-lasting use.

Propagation Delay At Nominal Supply: 3.4 ns

Low propagation delay ensures fast and efficient data transmission, making this product ideal for bus driver and transceiver applications that require quick signal processing.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation onto circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single component simplifies circuit design and reduces the need for additional components, making the product more cost-effective.

Package Shape: RECTANGULAR

Rectangular package shape is standard and easy to work with, making it compatible with various existing designs and layouts.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V makes this product compatible with many systems and ensures reliable performance within the specified voltage range.

Load Capacitance (CL): 30 pF

The specified load capacitance of 30 pF ensures stable operation and minimizes signal distortion, maintaining signal integrity in high-speed applications.

Power Supplies (V): 3.3

Consistent power supply of 3.3V ensures reliable and efficient operation of the product in various bus driver and transceiver applications.

No. of Terminals: 48

Having 48 terminals provides flexibility for connecting to other components and peripherals, accommodating complex circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make the product compact and space-saving, ideal for applications with limited board space.

Maximum I (ol): 12 Amp

With a maximum output current of 12A, this product can drive high-power loads, making it suitable for driving bus lines and transmitting signals over long distances.

Propagation Delay (tpd): 9.6 ns

The propagation delay of 9.6 ns ensures fast data transmission and signal processing, essential for high-speed communication in bus driver and transceiver applications.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of up to 85 °C allows the product to operate reliably in various environmental conditions, making it suitable for industrial applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor feature allows for high impedance when the driver is disabled, preventing signal conflicts and enhancing signal integrity in bus systems.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures accurate and synchronized data transmission, making this product suitable for applications requiring precise timing control.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in harsh and cold environments, extending the product's applicability across a wide range of operating conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and ensures secure connections, enhancing the reliability and longevity of the product in diverse applications.

Terminal Position: DUAL

Having dual terminal positions facilitates easy PCB layout and soldering, offering flexibility in installation and enhancing overall usability.

No. of Ports: 2

Featuring 2 ports allows for versatile connectivity options and signal routing capabilities, making this product suitable for multi-channel communication and data exchange.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm minimizes space requirements on the PCB, enabling compact and efficient design integration in tight layout constraints.

Width: 6.1 mm

The narrow width of 6.1 mm contributes to space optimization on the PCB, allowing for efficient utilization of available board real estate in densely populated systems.

Output Polarity: TRUE

Having true output polarity ensures accurate signal transmission and reception, eliminating misunderstandings or errors in communication systems where signal integrity is critical.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement of 1.65V enables operation in low-power scenarios, making the product energy-efficient and suitable for battery-powered applications.

Length: 12.5 mm

The compact length of 12.5 mm contributes to the overall small form factor of the product, allowing for space-efficient integration and layout flexibility in circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature ranges, this product offers robust performance and reliability in demanding environments, making it suitable for industrial automation and control applications.

Maximum Frequency At Nominal Supply: 250000000 Hz

With a maximum frequency of 250MHz at nominal supply, this product supports high-speed data transmission and processing, making it suitable for applications requiring rapid signal exchange.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this product efficient and versatile for various applications.

Terminal Form: GULL WING

The gull wing terminal form enables reliable and robust solder connections, enhancing the mechanical strength of the assembly and ensuring secure attachment to the PCB.

Packing Method: TR

The TR packing method ensures safe and secure packaging of the product during transportation and storage, protecting it from damage and environmental influences.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting on the PCB, enabling efficient use of board space and facilitating compact system designs.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides a safety margin for voltage variations, ensuring reliable operation and protection against overvoltage conditions in the system.

Technical Specifications

Bus Driver & Transceivers 74VCX162374DTR attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.4 ns

Propagation Delay (tpd):

9.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74VCX162374DTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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