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74VCX162244GX

Onsemi

74VCX162244GX by Onsemi

74VCX162244GX by Onsemi is a CMOS bus driver with 4 functions, 38 ns propagation delay, and operates b/w -40 to 85 °C. It features a low profile grid array package and is ideal for industrial applications requiring true output polarity and series resistor output characteristics.

Median Price

$1.536

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 27,308 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

$1.250

10k+ parts

$1.120

27,308

-

$1.510

$1.250

$1.120

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.563

10k+ parts

$1.400

10,000

-

-

$1.563

$1.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,684 parts In-Stock

1+ parts

$1.020

100+ parts

-

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-

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1,684

$1.020

-

-

-

Digiode

USA . 1,388 parts In-Stock

1+ parts

$1.178

100+ parts

-

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1,388

$1.178

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DigiKey Marketplace

USA . 29,159 parts In-Stock

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29,159

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Distributors (Availability)

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Ampacity Inc.

Singapore . 22,543 parts In-Stock

1+ parts

$0.870

100+ parts

-

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-

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22,543

$0.870

-

-

-

Corohmni

South Africa . 286 parts In-Stock

1+ parts

$1.020

100+ parts

-

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286

$1.020

-

-

-

Corphita

USA . 2,503 parts In-Stock

1+ parts

$1.116

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2,503

$1.116

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Native Components

USA . 767 parts In-Stock

1+ parts

$5.031

100+ parts

-

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767

$5.031

-

-

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Andel Nordic

Denmark . 103 parts In-Stock

1+ parts

$39.290

100+ parts

-

1k+ parts

$27.502

10k+ parts

$27.502

103

$39.290

-

$27.502

$27.502

Continental Prestige Electronics

USA . 29,159 parts In-Stock

1+ parts

-

100+ parts

$1.480

1k+ parts

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10k+ parts

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29,159

-

$1.480

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QUARKTWIN TECHNOLOGY LTD

USA . 24,013 parts In-Stock

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24,013

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TANS Electronics

Latvia . 8,197 parts In-Stock

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8,197

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Problanco Electronics

Mexico . 6,556 parts In-Stock

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6,556

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Microchip USA

USA . 4,208 parts In-Stock

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4,208

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Kulean Microsystems

USA . 2,284 parts In-Stock

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2,284

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Northwest PG Solutions

USA . 1,260 parts In-Stock

1+ parts

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100+ parts

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$4.930

10k+ parts

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1,260

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$4.930

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Supply Digital

USA . 802 parts In-Stock

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802

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UHIMA Technologies

Türkiye . 794 parts In-Stock

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794

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SupplyDigital Components

Austria . 570 parts In-Stock

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570

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Unlock seamless data transmission and superior performance with the 74VCX162244GX by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge Bus Driver & Transceivers that guarantee reliability and efficiency. Ideal for a wide range of applications, this product offers unmatched value, benefits, and advantages to customers looking for high-quality solutions. Upgrade your systems with Onsemi's innovative technology and experience unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the Bus Driver & Transceivers, ensuring reliability in various operating environments.

No. of Functions: 4

With 4 functions integrated into one device, this Bus Driver & Transceivers product offers versatility and efficiency in managing different aspects of data transmission.

Nominal Supply Voltage / Vsup (V): 1.5

The moderate supply voltage of 1.5V makes this product efficient in power consumption while maintaining reliable performance in bus driving and signal transmission.

Propagation Delay (tpd): 38 ns

The low propagation delay of 38ns ensures fast and efficient data transmission, making this Bus Driver & Transceivers product suitable for high-speed communication applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand extended use in industrial environments without overheating or compromising performance.

Technical Specifications

Bus Driver & Transceivers 74VCX162244GX attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PBGA-B54

Length:

8 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Propagation Delay (tpd):

38 ns

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

5.5 mm

Trade Compliance

74VCX162244GX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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