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74VCX162374DT

Onsemi

74VCX162374DT by Onsemi

74VCX162374DT by Onsemi is a Bus Driver & Transceiver with 3.4ns Propagation Delay, 8-bit No. of Functions, and 250MHz Max Frequency. It is used in industrial applications requiring fast signal transmission and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,868 parts In-Stock

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1,868

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Vyrian

USA . 507 parts In-Stock

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507

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Distributors (Availability)

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Native Components

USA . 828 parts In-Stock

1+ parts

$24.550

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828

$24.550

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Northwest PG Solutions

USA . 2,148 parts In-Stock

1+ parts

$27.005

100+ parts

$24.304

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2,148

$27.005

$24.304

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Problanco Electronics

Mexico . 6,970 parts In-Stock

1+ parts

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6,970

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TANS Electronics

Latvia . 4,601 parts In-Stock

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4,601

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Kulean Microsystems

USA . 3,779 parts In-Stock

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3,779

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SupplyDigital Components

Austria . 3,666 parts In-Stock

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3,666

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UHIMA Technologies

Türkiye . 834 parts In-Stock

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834

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Corphita

USA . 652 parts In-Stock

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652

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Corohmni

South Africa . 453 parts In-Stock

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453

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Overview

Experience the seamless performance and superior quality of the 74VCX162374DT by Onsemi, a leading manufacturer in the field of Bus Driver & Transceivers. Perfect for a wide range of applications, this product offers unmatched reliability and efficiency. With a compact design and advanced technology, it delivers fast propagation delay and high-speed data transmission. Upgrade your systems with this innovative solution and enjoy the benefits of precise output and enhanced functionality. Trust Onsemi to provide you with the best in class products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Propagation Delay At Nominal Supply: 3.4 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication.

Surface Mount: YES

Being surface mountable makes the product easy to install on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, simplifying the design and reducing costs.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the circuit board, optimizing the layout and minimizing footprint.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V makes the product compatible with a wide range of systems and power sources.

Load Capacitance (CL): 30 pF

The specified load capacitance ensures stable performance and signal integrity in various operating conditions.

Power Supplies (V): 3.3

Consistent power supply at 3.3V helps in maintaining reliable operation and compatibility with standard voltage levels.

No. of Terminals: 48

Having a high number of terminals allows for versatile connectivity options and flexibility in system integration.

Maximum I (ol): 12 Amp

The high maximum output current capacity of 12A enables driving of heavy loads without external amplification or buffering.

Propagation Delay (tpd): 9.6 ns

Although slightly higher than the nominal value, the propagation delay of 9.6 ns still ensures fast signal transmission for efficient data communication.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand harsh environmental conditions and operate reliably in industrial settings.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor feature allows for flexible control of the output signal, enhancing signal integrity and reducing noise.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing and synchronization of signals, making this product suitable for applications requiring accurate data transfer.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40 °C, the product is suitable for use in extreme cold environments without performance degradation.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and electrical conductivity, making the product easy to assemble and reliable in operation.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting orientations and simplifies installation in various system configurations.

No. of Ports: 2

Having two ports enables multiple connections or data streams to be handled simultaneously, increasing the versatility and functionality of the product.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm allows for slim and compact design integration, ideal for space-constrained applications.

Width: 6.1 mm

With a narrow width of 6.1mm, the product can fit into tight spaces on the circuit board, optimizing the layout and saving valuable board space.

Output Polarity: TRUE

The true output polarity ensures compatibility with standard logic levels and simplifies interfacing with other components in the system.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement of 1.65V allows for operation in low-power settings or with battery-operated systems.

Length: 12.5 mm

The compact length of 12.5mm contributes to space-saving design and efficient use of board real estate, especially in compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the product meets stringent temperature and reliability standards for robust performance in demanding environments.

Maximum Frequency At Nominal Supply: 250000000 Hz

The high maximum frequency handling capability of 250MHz allows for fast data processing and communication, suitable for high-speed applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull-wing terminal form offers easy surface mountability and reliable solder connections, ensuring secure attachment to the circuit board.

Packing Method: RAIL

The rail packing method simplifies handling, storage, and transportation of the product during manufacturing and distribution processes.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for densely populated PCB designs, enabling compact and high-performance electronic systems.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage rating of 3.6V ensures compatibility with a wide range of power sources and operating conditions, enhancing system versatility.

Technical Specifications

Bus Driver & Transceivers 74VCX162374DT attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.4 ns

Propagation Delay (tpd):

9.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74VCX162374DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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