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74VCXH16245TTR

STMicroelectronics

74VCXH16245TTR by STMicroelectronics

74VCXH16245TTR by STMicroelectronics is a high-speed bus driver with a propagation delay of just 3.1 ns and operates at supply voltages b/w 2.3V to 3.6V. It features bidirectional data flow and supports up to 24A output current, ideal for military applications. Its compact design ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 5,297 parts In-Stock

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Anansix

USA . 2,367 parts In-Stock

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SPM Sales

USA . 1,784 parts In-Stock

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Extreme Components

USA . 1,550 parts In-Stock

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Digiode

USA . 1,251 parts In-Stock

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Connector Distribution Corp

USA . 89 parts In-Stock

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Right Parts Inc.

USA . 89 parts In-Stock

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89

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Distributors (Availability)

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Andel Nordic

Denmark . 1,102 parts In-Stock

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$7.889

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$7.573

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$7.573

1,102

$7.889

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$7.573

$7.573

IDEA Electronic Components Group

UK . 269 parts In-Stock

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$10.393

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$9.354

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Microchip USA

USA . 320 parts In-Stock

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$15.450

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AZTECH Wire

Italy . 94 parts In-Stock

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$18.680

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MKK Technologies

India . 1,996 parts In-Stock

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$19.544

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DigiPath Technology Company

USA . 1,996 parts In-Stock

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$19.544

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Corphita

USA . 3,975 parts In-Stock

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Parana Technologies

USA . 750 parts In-Stock

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$12.427

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Northwest PG Solutions

USA . 704 parts In-Stock

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Native Components

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Perfect Parts

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Overview

Elevate your designs with the 74VCXH16245TTR from STMicroelectronics, where cutting-edge technology meets exceptional reliability. This versatile bus driver and transceiver ensures seamless data communication with ultra-fast propagation delays, making it ideal for high-performance applications in computing, automotive, and industrial sectors. Trust in STMicroelectronics' renowned quality and commitment to innovation for products that deliver efficiency and dependability, empowering you to stay ahead in a competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing plastic/epoxy materials increases durability and resistance to environmental factors, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 3.1 ns

A low propagation delay enhances the speed and efficiency of data transfer, making this bus driver/transceiver ideal for high-performance applications.

Surface Mount: YES

Surface mount capability allows for compact circuit designs and improved space utilization on PCBs.

No. of Functions: 2

Having multiple functions provides versatility, allowing it to serve different roles in a circuit and optimizing component usage.

Package Shape: RECTANGULAR

The rectangular shape is standard for many applications, ensuring compatibility with various layouts and designs.

No. of Bits: 8

An 8-bit configuration strikes a balance between data throughput and circuit complexity, ideal for many bus communication applications.

Nominal Supply Voltage / Vsup: 2.5 V

The nominal supply voltage of 2.5 V indicates efficient power consumption, making it suitable for battery-powered and energy-sensitive applications.

Load Capacitance (CL): 30 pF

A low load capacitance permits faster transitions, improving signal integrity and overall performance in high-speed interfacing.

Power Supplies (V): 3.3 V

Compatible with 3.3 V power supplies, ensuring easy integration with modern digital circuits.

No. of Terminals: 48

The 48 terminals enable extensive connectivity options, facilitating complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style is beneficial for tight spaces, providing flexibility in compact designs.

Maximum I (ol): 24 Amp

A high output current capacity allows the driver/transceiver to handle demanding loads and multiple devices efficiently.

Propagation Delay (tpd): 3.8 ns

Minimizing propagation delay improves overall timing performance, essential for critical applications requiring precise communication.

Maximum Operating Temperature: 125 °C

A high operating temperature tolerance makes this component reliable in extreme conditions, suitable for industrial and military applications.

Output Characteristics: 3-STATE

The 3-state output allows for tri-state operation, providing flexibility in multi-device communication environments.

Minimum Operating Temperature: -55 °C

With a broad operational temperature range, this component can be deployed in diverse environments, including harsh temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent corrosion resistance and reliable connectivity over extended periods.

Terminal Position: DUAL

Dual terminal positions enhance the layout options on circuit boards, improving design flexibility.

No. of Ports: 2

Having two ports facilitates dual communication pathways, increasing design options for complex systems.

Maximum Seated Height: 1.2 mm

The low seated height is ideal for space-constrained designs, enabling high-density configurations.

Width: 6.1 mm

With a compact width, it fits well in narrow design layouts, enhancing overall efficiency in PCB space utilization.

Output Polarity: TRUE

True output polarity simplifies integration with standard logic families, ensuring compatibility across multiple devices.

Minimum Supply Voltage (Vsup): 2.3 V

Operating down to 2.3 V enhances flexibility in power supply options, making it adaptable to various system requirements.

Length: 12.5 mm

A manageable length makes this component easy to integrate into a wide range of PCB layouts and configurations.

Temperature Grade: MILITARY

Designed to military specifications, this component offers high reliability and durability in critical applications, ensuring long-term performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it suitable for battery-operated and sensitive applications.

Terminal Form: GULL WING

Gull wing terminals ensure reliable soldering and excellent mechanical strength during and after assembly.

Packing Method: TR

Tape and reel packing allows for automated assembly processes, boosting efficiency in manufacturing.

Terminal Pitch: 0.5 mm

A small terminal pitch is beneficial for high-density designs, allowing more components to fit in limited space.

Count Direction: BIDIRECTIONAL

Bidirectional data flow enhances flexibility in data communication protocols, making this component suitable for advanced applications.

Control Type: COMMON CONTROL

Common control type simplifies signaling control across multiple functions, improving overall design coherence.

Moisture Sensitivity Level (MSL): 3

A moderate moisture sensitivity level suggests that while care is needed during assembly, the component can withstand standard soldering processes.

Maximum Supply Voltage (Vsup): 3.6 V

With the capability to operate up to 3.6 V, it allows for compatibility with higher voltage systems while maintaining safety margins.

Technical Specifications

Bus Driver & Transceivers 74VCXH16245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.1 ns

Propagation Delay (tpd):

3.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74VCXH16245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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