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74VCXH16244TTR

STMicroelectronics

74VCXH16244TTR by STMicroelectronics

74VCXH16244TTR by STMicroelectronics is a high-speed bus driver with a propagation delay of just 3.1 ns and operates at supply voltages b/w 2.3V to 3.6V. It features 4 functions, supports dual ports, and is ideal for military applications due to its robust temperature range (-55 °C to 125°C). Its compact design (12.5mm x 6.1mm) ensures efficient space utilization in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 14,000 parts In-Stock

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Digiode

USA . 4,977 parts In-Stock

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Vyrian

USA . 2,093 parts In-Stock

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Anansix

USA . 406 parts In-Stock

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Prism Electronics

USA . 101 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 360 parts In-Stock

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$0.581

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360

$0.581

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Northwest PG Solutions

USA . 1,507 parts In-Stock

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$0.639

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1,507

$0.639

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Andel Nordic

Denmark . 2,128 parts In-Stock

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$7.771

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$7.460

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$7.460

2,128

$7.771

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$7.460

$7.460

AZTECH Wire

Italy . 65 parts In-Stock

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$19.800

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65

$19.800

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IDEA Electronic Components Group

UK . 342 parts In-Stock

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$23.938

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$21.545

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342

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Microchip USA

USA . 343 parts In-Stock

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$34.710

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MKK Technologies

India . 463 parts In-Stock

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$45.015

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DigiPath Technology Company

USA . 463 parts In-Stock

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$45.015

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Component Stockers USA

USA . 599 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 20,136 parts In-Stock

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Corphita

USA . 4,609 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Parana Technologies

USA . 1,293 parts In-Stock

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$28.622

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$28.622

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Overview

Unlock the power of seamless connectivity with the 74VCXH16244TTR from STMicroelectronics. Renowned for their unwavering quality and innovation, STMicroelectronics delivers this robust bus driver & transceiver that excels in high-performance applications. With lightning-fast propagation delays and exceptional temperature resilience, it ensures reliable data transmission for your most demanding projects. Elevate your designs while enjoying the confidence that comes from a trusted manufacturer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making this product suitable for a variety of applications.

Propagation Delay At Nominal Supply: 3.1 ns

A low propagation delay enables fast data transmission, improving overall system performance and responsiveness.

Surface Mount: YES

Surface-mount technology allows for smaller and more efficient circuit designs, saving space on the PCB.

No. of Functions: 4

Having multiple functions in one chip reduces component count and simplifies design, which can lead to lower costs and increased reliability.

Package Shape: RECTANGULAR

The rectangular shape is well-suited for efficient space usage, allowing for better placement on PCBs.

No. of Bits: 4

With a capacity for 4 bits, this product can handle a reasonable amount of data, making it effective for various digital applications.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V allows for lower power consumption, which is essential for battery-operated devices.

Load Capacitance (CL): 30 pF

A load capacitance of 30 pF supports fast switching speeds, making this driver suitable for high-frequency applications.

Power Supplies (V): 3.3

Dual power supply options of 3.3V provide flexibility for integration into various systems while maintaining compatibility.

No. of Terminals: 48

With 48 terminals, this device allows for extensive connectivity, accommodating more complex configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile reduce space usage on PCB and enable more compact design layouts.

Maximum I (ol): 24 Amp

A maximum output current of 24 Amps allows for the driving of high-power loads, suitable for robust applications.

Propagation Delay (tpd): 3.6 ns

This low propagation delay ensures that signal integrity is maintained, crucial for high-speed digital circuits.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature indicates reliability and performance in harsh environments.

Output Characteristics: 3-STATE

3-state output characteristics improve flexibility in digital communication, allowing for more efficient signal control.

Minimum Operating Temperature: -55 °C

A broad temperature range ensures performance in extreme conditions, making this part suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances solderability and corrosion resistance, which prolongs the component's lifespan.

Terminal Position: DUAL

Dual terminal positioning enables easier and more versatile PCB layout options.

No. of Ports: 2

Having 2 ports allows for flexible interfacing with multiple components, enhancing system design capabilities.

Maximum Seated Height: 1.2 mm

A low seated height is critical in compact designs where space is a premium.

Width: 6.1 mm

The compact width allows for denser PCB layouts, maximizing the use of available space.

Output Polarity: TRUE

True output polarity ensures consistent behavior in certain applications, enhancing circuit reliability.

Minimum Supply Voltage (Vsup): 2.3 V

A low minimum supply voltage support facilitates operation in low-power applications, contributing to energy efficiency.

Length: 12.5 mm

The small length contributes to a compact footprint on PCBs, making it easier to fit into space-constrained designs.

Temperature Grade: MILITARY

MILITARY-grade temperature specifications ensure reliability and performance in extreme conditions and critical applications.

Technology: CMOS

CMOS technology enables low power consumption with high-speed operation, making it ideal for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly processes, ensuring reliable connections.

Packing Method: TR

The Tape and Reel packing method simplifies automated assembly processes while reducing handling damage.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density connection options, accommodating tighter layouts on PCBs.

Control Type: ENABLE LOW

Low-enable control simplifies the integration with microcontrollers and other digital devices.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V allows for compatibility with a wide range of digital logic levels, enhancing versatility.

Technical Specifications

Bus Driver & Transceivers 74VCXH16244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.1 ns

Propagation Delay (tpd):

3.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74VCXH16244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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