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74VCX16245LBR

STMicroelectronics

74VCX16245LBR by STMicroelectronics

74VCX16245LBR by STMicroelectronics is a high-speed bus driver with a propagation delay of just 3.4 ns and operates at supply voltages from 1.8V to 3.6V. It features 2 functions, supports bidirectional data flow, and is ideal for military applications due to its robust temperature range (-55 °C to 125 °C). With a compact design (5.5mm x 8mm), it ensures efficient space utilization in advanced electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,706 parts In-Stock

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Vyrian

USA . 2,266 parts In-Stock

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2,266

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Anansix

USA . 426 parts In-Stock

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426

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Distributors (Availability)

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Native Components

USA . 223 parts In-Stock

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$0.863

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223

$0.863

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Northwest PG Solutions

USA . 641 parts In-Stock

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$0.950

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641

$0.950

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Andel Nordic

Denmark . 302 parts In-Stock

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$6.816

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$6.543

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$6.543

302

$6.816

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$6.543

$6.543

AZTECH Wire

Italy . 737 parts In-Stock

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$18.770

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737

$18.770

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IDEA Electronic Components Group

UK . 1,925 parts In-Stock

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$27.705

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$24.934

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$27.705

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Microchip USA

USA . 268 parts In-Stock

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$45.750

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MKK Technologies

India . 1,659 parts In-Stock

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$52.097

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$52.097

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DigiPath Technology Company

USA . 1,659 parts In-Stock

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$52.097

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$52.097

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Corphita

USA . 3,030 parts In-Stock

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Parana Technologies

USA . 1,876 parts In-Stock

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$33.125

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Overview

Elevate your designs with the STMicroelectronics 74VCX16245LBR, a robust bus driver and transceiver that seamlessly integrates high-speed performance with exceptional reliability. Engineered for efficiency, this versatile component supports a wide range of applications, from advanced computing systems to automotive electronics. Trust in STMicroelectronics’ legacy of quality and innovation to enhance your projects, ensuring they meet the demands of tomorrow while delivering unparalleled value today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body contributes to durability and resistance to environmental stresses.

Propagation Delay At Nominal Supply: 3.4 ns

Fast propagation delay ensures that data is transmitted quickly, improving overall system performance.

Surface Mount: YES

Surface mount technology enables compact designs and efficient use of board space.

No. of Functions: 2

With two functions, this device offers versatility in applications, reducing the need for multiple components.

Package Shape: RECTANGULAR

The rectangular package shape is standard, allowing for easier integration into existing designs.

No. of Bits: 8

An 8-bit configuration allows for more extensive data handling within a single device.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at 2.5V makes this device energy efficient, suitable for low-power applications.

Load Capacitance (CL): 30 pF

Lower load capacitance enables faster switching speeds and efficient power usage.

Power Supplies (V): 3.3

Compatible with common power supply voltages, making it easy to integrate into existing systems.

No. of Terminals: 54

A higher number of terminals increases connectivity options and flexibility in application design.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This advanced packaging style supports high-density mounting and enhances thermal performance.

Maximum I (ol): 24 Amp

A high output current capability allows this device to handle demanding applications efficiently.

Propagation Delay (tpd): 7 ns

An additional low propagation delay enhances the ability to process high-speed signals effectively.

Maximum Operating Temperature: 125 °C

This temperature rating ensures reliability and performance in harsh operating conditions.

Output Characteristics: 3-STATE

3-state output allows for greater data flow control, making the device suitable for bus systems.

Minimum Operating Temperature: -55 °C

Operating at very low temperatures extends the use of this component in extreme environments.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, enhancing overall performance.

Terminal Position: BOTTOM

Bottom terminal positioning can improve soldering efficiency and thermal management on PCBs.

No. of Ports: 2

Having two ports allows for bidirectional data transmission, increasing versatility in communication.

Maximum Seated Height: 1.2 mm

The reduced height is beneficial for applications where space is a constraint.

Width: 5.5 mm

This compact width makes it suitable for space-sensitive designs.

Output Polarity: TRUE

True output polarity ensures predictable signal integrity during communication tasks.

Minimum Supply Voltage (Vsup): 1.8 V

The ability to operate at a low voltage improves energy efficiency and compatibility with various systems.

Length: 8 mm

A short length fits standard layouts and promotes space savings in circuit designs.

Temperature Grade: MILITARY

The military grade ensures high reliability and performance in rigorous conditions, suitable for defense applications.

Technology: CMOS

CMOS technology enhances power efficiency, making this device ideal for battery-operated applications.

Terminal Form: BALL

Ball terminal form allows for better soldering and mechanical stability on PCBs.

Packing Method: TR

Tape and reel packing is convenient for automated assembly processes, facilitating high-volume production.

Terminal Pitch: 0.8 mm

A smaller terminal pitch is suitable for high-density packaging, enabling compact designs.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability makes the device flexible for various communication protocols.

Control Type: COMMON CONTROL

Common control enhances synchronization and simplifies circuit design for complex systems.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage provides flexibility in design, accommodating a range of power sources.

Technical Specifications

Bus Driver & Transceivers 74VCX16245LBR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

8 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.4 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Translation:

N/A

Width:

5.5 mm

Trade Compliance

74VCX16245LBR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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