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74LVXC3245MTR

STMicroelectronics

74LVXC3245MTR by STMicroelectronics

74LVXC3245MTR by STMicroelectronics is an 8-bit bus driver and transceiver with a propagation delay of just 9 ns. It operates at supply voltages from 2.7V to 5.5V, supporting both 3V and 3/5V translation. Ideal for military applications, it features a compact SO package with dual terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,166 parts In-Stock

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Digiode

USA . 3,470 parts In-Stock

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3,470

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ABC Electronics Ltd.

UK . 2,985 parts In-Stock

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Anansix

USA . 1,214 parts In-Stock

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Lantek

USA . 672 parts In-Stock

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Electronics Depot

USA . 510 parts In-Stock

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510

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R&J Components

USA . 30 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 491 parts In-Stock

1+ parts

$3.163

100+ parts

-

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$3.036

10k+ parts

$3.036

491

$3.163

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$3.036

$3.036

AZTECH Wire

Italy . 938 parts In-Stock

1+ parts

$10.740

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938

$10.740

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IDEA Electronic Components Group

UK . 604 parts In-Stock

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$16.925

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$15.233

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604

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Microchip USA

USA . 342 parts In-Stock

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$24.009

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342

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MKK Technologies

India . 1,344 parts In-Stock

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$31.827

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$31.827

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DigiPath Technology Company

USA . 1,344 parts In-Stock

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$31.827

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$31.827

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Corphita

USA . 4,094 parts In-Stock

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Northwest PG Solutions

USA . 1,692 parts In-Stock

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GreenTree Electronics

Israel . 672 parts In-Stock

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Native Components

USA . 468 parts In-Stock

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468

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Parana Technologies

USA . 234 parts In-Stock

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$20.237

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234

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$20.237

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Overview

Unlock unparalleled performance with the 74LVXC3245MTR from STMicroelectronics, a leader in semiconductor innovation. This reliable bus driver and transceiver enhances your designs with seamless 3V and 3/5V translation, making it perfect for diverse applications—from consumer electronics to industrial systems. Benefit from reduced propagation delays and robust output characteristics, ensuring efficiency and longevity in every project you undertake. Elevate your technology with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight properties, making it suitable for various applications.

Propagation Delay At Nominal Supply: 9 ns

A low propagation delay enhances data transfer speeds, making this product ideal for high-performance applications.

Surface Mount: YES

Surface mount technology allows for compact design and saves board space, facilitating easier integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape provides better space optimization on PCB layouts, simplifying manufacturing processes.

No. of Bits: 8

The capability to handle 8 bits allows for efficient data transfer in a wide range of applications, from simple to complex systems.

Translation: 3V & 3/5V

Voltage translation capabilities make this product versatile for interfacing between different logic levels.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures low power consumption, extending battery life in portable devices.

Power Supplies (V): 3/3.3, 3/5

Multiple power supply options provide flexibility in design, accommodating various system requirements.

No. of Terminals: 24

An adequate number of terminals allows for multiple inputs and outputs, enabling the product to be used in more complex applications.

Package Style (Meter): SMALL OUTLINE

SMALL OUTLINE package style is advantageous for space-constrained designs, promoting efficient use of PCB real estate.

Maximum I (ol): 24 Amp

A maximum output current capability of 24 Amps indicates robust performance, suitable for high-load applications.

Propagation Delay (tpd): 9.5 ns

The propagation delay of 9.5 ns ensures quick response times, essential for high-speed data applications.

Maximum Operating Temperature: 125 °C

Withstands high operating temperatures, ensuring reliability in demanding environmental conditions.

Output Characteristics: 3-STATE

3-state output characteristics provide more control over signal lines, making the device compatible with a variety of bus systems.

Minimum Operating Temperature: -55 °C

The ability to operate in extreme low temperatures makes this product suitable for harsh environments, particularly in military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish provides excellent corrosion resistance, enhancing longevity and reliability.

Terminal Position: DUAL

Dual terminal positioning allows for easier access for soldering and improves assembly efficiency.

No. of Ports: 2

Having 2 ports allows for simultaneous communication channels, enhancing usability in complex systems.

Maximum Seated Height: 2.65 mm

A low seated height contributes towards better integration in low-profile applications, maintaining design compactness.

Width: 7.5 mm

A narrow width is advantageous for space-sensitive designs, making it easier to fit into constrained layouts.

Output Polarity: TRUE

Positive output polarity supports standard logic levels, ensuring compatibility with a wide range of devices.

Minimum Supply Voltage (Vsup): 2.7 V

Lower minimum supply voltage ensures functionality across a wider range of supply levels, enhancing adaptability.

Maximum Time At Peak Reflow Temperature (s): 30

Maximum reflow time support ensures product reliability without degradation during assembly processes.

Peak Reflow Temperature °C: 250

High reflow temperature capabilities allow it to withstand robust soldering processes, increasing manufacturing efficiency.

Length: 15.4 mm

A compact length is beneficial for high-density designs, allowing for closer placement of components on PCBs.

Temperature Grade: MILITARY

Military-grade specifications guarantee enhanced performance and reliability in rigorous operational environments.

Technology: CMOS

CMOS technology provides low-power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals enhance soldering efficiency, providing a wider area for soldering, ensuring strong connections.

Packing Method: TR

Tape and reel packing allows for automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes an ideal balance between ease of assembly and performance, important for modern electronics.

Count Direction: BIDIRECTIONAL

Bidirectional capability allows for versatile signal transmission, making it highly adaptable to different applications.

Control Type: COMMON CONTROL

Common control type simplifies interfacing with logic systems, reducing complexity in circuit design.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity, assuring proper handling and storage to maintain reliability before assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supplies, enhancing versatility in application.

Technical Specifications

Bus Driver & Transceivers 74LVXC3245MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

PORT A OPERATES AT 4.5V TO 5.5V

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

250

Power Supplies (V):

3/3.3,3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 3/5V

Width:

7.5 mm

Trade Compliance

74LVXC3245MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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