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74LCX32TTR

STMicroelectronics

74LCX32TTR by STMicroelectronics

STMicroelectronics' 74LCX32TTR logic gate has a propagation delay of 5.2ns at 3.3V, with 4 functions and 2 inputs. It operates in industrial temperatures from -40 to 85 °C, suitable for applications requiring fast response times and low power consumption. The package is small outline, thin profile, with shrink pitch terminals for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 10,000 parts In-Stock

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10,000

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Digiode

USA . 3,482 parts In-Stock

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3,482

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Bristol Electronics

USA . 3,019 parts In-Stock

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3,019

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Vyrian

USA . 2,506 parts In-Stock

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2,506

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R&J Components

USA . 2,500 parts In-Stock

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2,500

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Dan-Mar Components

USA . 2,261 parts In-Stock

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2,261

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Cyclops Electronics Ltd

UK . 1,050 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 340 parts In-Stock

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340

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Semi Source

USA . 272 parts In-Stock

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272

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Anansix

USA . 193 parts In-Stock

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193

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Distributors (Availability)

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Native Components

USA . 847 parts In-Stock

1+ parts

$0.477

100+ parts

-

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$0.458

847

$0.477

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$0.458

Northwest PG Solutions

USA . 1,286 parts In-Stock

1+ parts

$0.524

100+ parts

-

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$0.462

1,286

$0.524

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$0.462

Corohmni

South Africa . 55 parts In-Stock

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$10.827

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55

$10.827

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IDEA Electronic Components Group

UK . 1,786 parts In-Stock

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$10.962

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$9.866

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$10.962

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$9.866

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AZTECH Wire

Italy . 996 parts In-Stock

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$11.110

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$11.110

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MKK Technologies

India . 1,971 parts In-Stock

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$20.613

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$20.613

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DigiPath Technology Company

USA . 1,971 parts In-Stock

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$20.613

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$20.613

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Advanced Electronics

New Zealand . 49 parts In-Stock

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$22.688

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$20.646

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$18.604

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49

$22.688

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$18.604

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Perfect Parts

USA . 53,588 parts In-Stock

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Kepictronics

USA . 37,995 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,380 parts In-Stock

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Microchip USA

USA . 5,102 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Formix International (Excess)

India . 2,250 parts In-Stock

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2,250

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Parana Technologies

USA . 2,051 parts In-Stock

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$13.106

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Corphita

USA . 769 parts In-Stock

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769

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Overview

Unlock limitless possibilities with the 74LCX32TTR by STMicroelectronics. Crafted with precision and quality, this logic gate offers unparalleled performance in various applications. From industrial automation to consumer electronics, this product ensures reliable operation and efficient signal processing. With a wide supply voltage range and low propagation delay, customers can trust in the value and benefits this component brings to their projects. Experience seamless integration and superior functionality with the 74LCX32TTR - your gateway to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the logic gates, making the product reliable and long-lasting.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast processing of signals, making this product suitable for applications where quick response time is crucial.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the logic gates on PCBs, saving space and reducing assembly cost.

Nominal Supply Voltage / Vsup (V): 2.7

The low supply voltage requirement makes this product energy-efficient, suitable for battery-powered devices or applications where power consumption is a concern.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Logic Gates 74LCX32TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LCX32TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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