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74LCX00MX

Onsemi

74LCX00MX by Onsemi

74LCX00MX by Onsemi is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 2V to 3.6V, with a propagation delay of 5.2ns and max I (ol) of 24Amp. This small outline package is ideal for industrial applications requiring fast signal processing in compact designs.

Median Price

$0.422

Lifecycle Status

Suppliers In-Stock

36

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 202 parts In-Stock

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$0.388

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$0.369

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$0.369

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$0.369

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Farnell

UK . 2,025 parts In-Stock

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$0.444

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$0.240

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$0.193

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$0.162

2,025

$0.444

$0.240

$0.193

$0.162

Newark

USA . 2,025 parts In-Stock

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$0.513

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$0.278

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$0.223

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$0.513

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Arrow

USA . 2 parts In-Stock

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$0.549

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$0.392

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$0.549

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Element14

Singapore . 2,025 parts In-Stock

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$0.876

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$0.475

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$0.381

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$0.876

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$0.309

Rochester

USA . 165,350 parts In-Stock

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$0.320

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DigiKey

USA . 165,350 parts In-Stock

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Verical

USA . 29,590 parts In-Stock

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Flip Electronics (Authorized)

USA . 2,075 parts In-Stock

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Chip1Stop

Japan . 2 parts In-Stock

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Digiode

USA . 516 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Bristol Electronics

USA . 5,438 parts In-Stock

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$0.990

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$0.396

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$0.277

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5,438

$0.990

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Vyrian

USA . 61,107 parts In-Stock

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Q Components

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ComSIT Distribution GmbH

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Chip Stock

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Semi Source

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Freddi Giovanni

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Prism Electronics

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Flip Electronics

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ACDS - Activité Composants Distribution Service

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Lighthouse Electronics, Inc.

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Anansix

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LWI Electronics Inc

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PC Components Company LLC

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Connector Distribution Corp

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Right Parts Inc.

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Speed Components Ltd

Israel . 1,130 parts In-Stock

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Zilex Electronics Inc.

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ECAB

Sweden . 981 parts In-Stock

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Cyclops Electronics Ltd

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LIBRA Elektronik GmbH

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Ampacity Inc.

Singapore . 61,103 parts In-Stock

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$0.207

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Semicontronic

India . 61,043 parts In-Stock

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$0.207

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Corphita

USA . 2,890 parts In-Stock

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$0.219

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Corohmni

South Africa . 50 parts In-Stock

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Argo Parts USA

USA . 3,890 parts In-Stock

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$0.295

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$0.286

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$0.295

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Continental Prestige Electronics

USA . 2,186 parts In-Stock

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$0.295

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$0.289

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$0.295

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Advanced Electronics

New Zealand . 202 parts In-Stock

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$0.388

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$0.369

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$0.369

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202

$0.388

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Aztec Data Supply Inc.

USA . 3,983 parts In-Stock

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$24.839

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Perfect Parts

USA . 86,800 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 59,604 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,178 parts In-Stock

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Glotronic Ltd.

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A-Z Elektronik GmbH

Germany . 7,373 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 4,865 parts In-Stock

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TANS Electronics

Latvia . 4,759 parts In-Stock

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Lixinc

USA . 4,519 parts In-Stock

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Microchip USA

USA . 4,417 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Supply Digital

USA . 1,552 parts In-Stock

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SupplyDigital Components

Austria . 1,030 parts In-Stock

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Assy Fe

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Metaverse IC Inc.

Canada . 973 parts In-Stock

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UHIMA Technologies

Türkiye . 834 parts In-Stock

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Kepictronics

USA . 817 parts In-Stock

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Kulean Microsystems

USA . 265 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.300

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$0.291

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$0.284

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Robosynatics

Brazil . 100 parts In-Stock

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$0.414

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$0.414

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$0.414

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Lucentia Tech

USA . 100 parts In-Stock

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$0.414

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$0.414

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$0.414

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$0.414

Overview

Unlock the power of innovation with the 74LCX00MX logic gate by Onsemi. As a leader in semiconductor manufacturing, Onsemi delivers unparalleled quality and reliability in every product. Perfect for a wide range of applications, this versatile logic gate offers lightning-fast propagation delay and low power consumption, making it ideal for high-speed digital systems. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the 74LCX00MX and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, perfect for portable or long-lasting applications.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast signal processing, improving overall performance of the device.

Surface Mount: YES

Surface mount capability makes installation and soldering easier, saving time during assembly.

No. of Functions: 4

Having 4 functions in one device maximizes functionality and saves space on the circuit board.

No. of Inputs: 2

Two inputs allow for basic logic operations, making this product suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 2.5

Suitable nominal supply voltage ensures compatibility with standard power sources.

Load Capacitance (CL): 50 pF

Low load capacitance helps reduce signal distortion and improve signal integrity.

Power Supplies (V): 3.3

Operating at a common voltage makes integration with other components straightforward.

No. of Terminals: 14

Sufficient terminals allow for easy connection to other components on the circuit board.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space and allows for high-density circuit designs.

Maximum I (ol): 24 Amp

High maximum output current capability allows for driving heavy loads without external components.

Propagation Delay (tpd): 6.2 ns

Although not the lowest, the propagation delay is still fast, ensuring responsive signal processing.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in various environmental conditions.

Minimum Operating Temperature: -40 °C

Capability to operate at low temperatures makes this product suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and enhances routing options.

Maximum Seated Height: 1.753 mm

Low seated height saves space and enables compact device designs.

Width: 3.9 mm

Slim width allows for efficient space utilization on the PCB.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage allows for operation in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time ensures proper soldering and component reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for lead-free soldering to comply with RoHS regulations.

Length: 8.6235 mm

Compact length complements the small outline package, contributing to a space-efficient design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for various applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and ensures mechanical strength.

Packing Method: TR

Tape and reel packing method simplifies handling, storage, and automatic pick-and-place assembly.

Terminal Pitch: 1.27 mm

Standard terminal pitch enables compatibility with commonly used PCB layouts and designs.

Maximum Supply Voltage (Vsup): 3.6 V

Safe maximum supply voltage ensures device protection and compatibility with various power sources.

Technical Specifications

Logic Gates 74LCX00MX attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.6235 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.753 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74LCX00MX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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