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74LCX14MTC

Onsemi

74LCX14MTC by Onsemi

74LCX14MTC by Onsemi is a CMOS logic gate with 6 functions, 7.8 ns propagation delay, and operates at a supply voltage of 2.5V to 3.6V. It is ideal for industrial applications requiring Schmitt trigger functionality and has a compact small outline package suitable for surface mount assembly.

Median Price

$0.181

Lifecycle Status

Suppliers In-Stock

44

In-Stock Inventory

1k+

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Arrow

USA . 5,005 parts In-Stock

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Farnell

UK . 3,030 parts In-Stock

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$0.270

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$0.145

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$0.126

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$0.270

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$0.126

Element14

Singapore . 3,349 parts In-Stock

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$0.714

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$0.462

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Rochester

USA . 256,600 parts In-Stock

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DigiKey

USA . 26,270 parts In-Stock

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Verical

USA . 3,541 parts In-Stock

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Chip1Stop

Japan . 2,297 parts In-Stock

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Distributors (In-Stock)

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Flip Electronics

USA . 37,600 parts In-Stock

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$0.090

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Digiode

USA . 1,483 parts In-Stock

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DF Sales Co.

USA . 920 parts In-Stock

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DF Sales Co.

USA . 920 parts In-Stock

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Nova Conductors

Japan . 71 parts In-Stock

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Bristol Electronics

USA . 376 parts In-Stock

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Vyrian

USA . 47,650 parts In-Stock

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LIBRA Elektronik GmbH

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Inventory MP

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LWI Electronics Inc

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North Shore Components

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Beltway Electronics Company

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Holdelec - ElecDif-Pro

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Semi Source

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Speed Components Ltd

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First Choice Components Inc.

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EMSNET

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Cogito LLC

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Distributors (Availability)

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Ampacity Inc.

Singapore . 48,461 parts In-Stock

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$0.085

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Semicontronic

India . 48,613 parts In-Stock

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$0.088

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$0.086

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Corphita

USA . 3,378 parts In-Stock

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Corohmni

South Africa . 456 parts In-Stock

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Bastille Electronics

Australia . 26 parts In-Stock

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$0.273

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$0.259

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$0.255

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Argo Parts USA

USA . 390 parts In-Stock

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$0.278

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Continental Prestige Electronics

USA . 3,461 parts In-Stock

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$0.584

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$0.308

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$0.186

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Aztec Data Supply Inc.

USA . 5,896 parts In-Stock

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$25.998

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Perfect Parts

USA . 31,740 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Metaverse IC Inc.

Canada . 9,520 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 6,837 parts In-Stock

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Microchip USA

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Germany . 5,778 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 3,771 parts In-Stock

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Supply Digital

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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Problanco Electronics

Mexico . 1,522 parts In-Stock

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Brazil . 950 parts In-Stock

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Lucentia Tech

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UHIMA Technologies

Türkiye . 736 parts In-Stock

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GreenTree Electronics

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iodParts Technologies Inc.

India . 47 parts In-Stock

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Overview

Unlock the power of advanced technology with the 74LCX14MTC logic gates by Onsemi. Crafted with precision and expertise, Onsemi ensures top-notch quality and reliability in every product. Perfect for a wide range of applications, these logic gates offer lightning-fast propagation delays and low power consumption, making them ideal for high-speed digital systems. With Onsemi's commitment to excellence, you can trust that the 74LCX14MTC will deliver exceptional performance and value, setting you apart from the competition. Elevate your projects with the best in the industry, choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight, durable, and cost-effective, making the product practical for various applications.

Propagation Delay At Nominal Supply: 6.5 ns

Low propagation delay ensures fast signal transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Functions: 6

Having multiple functions in a single component reduces the need for additional components, saving space and simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 2.5

Low nominal supply voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable performance and reliable operation of the product.

Power Supplies (V): 3.3

Support for multiple power supplies offers flexibility in voltage requirements for different applications.

No. of Terminals: 14

Having a sufficient number of terminals allows for easy connectivity and interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and slim package design with shrink pitch enhances space-saving and enables dense PCB layouts for compact electronic devices.

Propagation Delay (tpd): 7.8 ns

Even with slightly increased propagation delay, the overall performance of the product remains competitive for most applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the product to operate reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range support ensures the product functions optimally even in extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and ensures long-term reliability of the terminals.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and enhances connectivity options for the product.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact and slim designs, ideal for space-constrained applications.

Width: 4.4 mm

Narrow width enables efficient space utilization on the PCB and facilitates compact electronic device designs.

Minimum Supply Voltage (Vsup): 2 V

Support for low supply voltage operation makes the product suitable for battery-powered applications and extends battery life.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and reliability during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper soldering and strong joint formation during PCB assembly.

Length: 5 mm

Compact length contributes to a space-saving design and enables efficient PCB layout integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Schmitt Trigger: YES

Presence of Schmitt trigger functionality provides hysteresis and clean signal transitions, improving noise immunity and signal integrity.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital circuits, making it a versatile choice.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mounting and soldering, ensuring reliable electrical connections on the PCB.

Packing Method: RAIL

Rail packing method provides convenient handling, storage, and automated assembly of the product on PCBs during mass production.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting on the PCB, enabling compact and space-efficient circuit designs.

Maximum Supply Voltage (Vsup): 3.6 V

Support for maximum supply voltage of 3.6 V expands the operational range of the product for diverse voltage requirements in different applications.

Technical Specifications

Logic Gates 74LCX14MTC attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

7.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LCX14MTC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-606-9424, 5962016069424, 5962-01-603-9320, 5962016039320

NIIN

016069424, 016039320

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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