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74LCX02MTR

STMicroelectronics

74LCX02MTR by STMicroelectronics

STMicroelectronics' 74LCX02MTR is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 5.4 ns propagation delay at 3.3V. It operates b/w -55 to 125 °C and has a small outline package for surface mount applications.

Median Price

$0.366

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Pegasus Components GmbH

Germany . 10,000 parts In-Stock

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10,000

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Digiode

USA . 3,940 parts In-Stock

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3,940

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Bristol Electronics

USA . 3,800 parts In-Stock

1+ parts

-

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$0.366

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$0.180

10k+ parts

$0.146

3,800

-

$0.366

$0.180

$0.146

Dan-Mar Components

USA . 3,800 parts In-Stock

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3,800

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Vyrian

USA . 3,296 parts In-Stock

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Prism Electronics

USA . 2,500 parts In-Stock

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2,500

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ACDS - Activité Composants Distribution Service

France . 1,676 parts In-Stock

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1,676

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Anansix

USA . 1,403 parts In-Stock

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LWI Electronics Inc

India . 37 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 566 parts In-Stock

1+ parts

$18.770

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-

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566

$18.770

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IDEA Electronic Components Group

UK . 2,048 parts In-Stock

1+ parts

$21.011

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-

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$18.910

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2,048

$21.011

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$18.910

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Ampacity Inc.

Singapore . 1,273 parts In-Stock

1+ parts

$37.000

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$37.000

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MKK Technologies

India . 581 parts In-Stock

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$39.510

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581

$39.510

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DigiPath Technology Company

USA . 581 parts In-Stock

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$39.510

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$39.510

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QUARKTWIN TECHNOLOGY LTD

USA . 23,191 parts In-Stock

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Assy Fe

Spain . 17,500 parts In-Stock

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Microchip USA

USA . 5,229 parts In-Stock

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Native Components

USA . 784 parts In-Stock

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Perfect Parts

USA . 569 parts In-Stock

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569

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Corphita

USA . 421 parts In-Stock

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421

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Northwest PG Solutions

USA . 360 parts In-Stock

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Parana Technologies

USA . 77 parts In-Stock

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$25.122

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$25.122

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Overview

Unleash the power of cutting-edge technology with the 74LCX02MTR by STMicroelectronics. Crafted with precision and expertise, this logic gate offers unparalleled reliability and performance for a wide range of applications. With a focus on quality and innovation, STMicroelectronics delivers value and benefits that go beyond expectations. Elevate your projects with the 74LCX02MTR and experience the advantage of superior design and functionality in every use. Choose STMicroelectronics, choose excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the logic gates, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 5.4 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability enables easy integration into PCBs, saving space and streamlining the manufacturing process.

No. of Functions: 4

Having multiple functions in a single component increases efficiency and reduces the need for additional components in circuit design.

No. of Inputs: 2

With 2 inputs, this product offers flexibility in logic operations and can support various logic functions.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a low supply voltage of 2.7V makes this product energy-efficient and suitable for battery-powered applications.

Load Capacitance (CL): 50 pF

The low load capacitance ensures minimal impact on signal integrity and helps maintain signal quality in high-frequency applications.

Power Supplies (V): 3.3

Supporting a supply voltage of 3.3V makes this product compatible with a wide range of electronic systems and applications.

No. of Terminals: 14

Having 14 terminals provides sufficient connectivity options for interfacing with other components and peripherals in a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices and densely populated circuits.

Technical Specifications

Logic Gates 74LCX02MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

5.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74LCX02MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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