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74AC16245TTR

STMicroelectronics

74AC16245TTR by STMicroelectronics

74AC16245TTR by STMicroelectronics is a dual 8-bit bus driver with a propagation delay of just 9 ns, operating at supply voltages of 3.3V to 5V. It features a compact SOIC package and supports bidirectional data flow, ideal for high-speed digital applications. With military-grade temperature tolerance from -55 °C to 125 °C, it ensures reliability in demanding environments.

Median Price

$0.921

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,951 parts In-Stock

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3,951

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Lakeland Logistics Inc

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Bristol Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.921

1k+ parts

$0.811

10k+ parts

-

2,000

-

$0.921

$0.811

-

Digiode

USA . 802 parts In-Stock

1+ parts

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802

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Anansix

USA . 491 parts In-Stock

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491

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 587 parts In-Stock

1+ parts

$0.374

100+ parts

-

1k+ parts

-

10k+ parts

$0.359

587

$0.374

-

-

$0.359

Northwest PG Solutions

USA . 816 parts In-Stock

1+ parts

$0.411

100+ parts

-

1k+ parts

-

10k+ parts

$0.362

816

$0.411

-

-

$0.362

Andel Nordic

Denmark . 4,939 parts In-Stock

1+ parts

$8.371

100+ parts

-

1k+ parts

$8.036

10k+ parts

$8.036

4,939

$8.371

-

$8.036

$8.036

AZTECH Wire

Italy . 1,031 parts In-Stock

1+ parts

$17.820

100+ parts

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1,031

$17.820

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IDEA Electronic Components Group

UK . 1,731 parts In-Stock

1+ parts

$18.542

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$16.688

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1,731

$18.542

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$16.688

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Microchip USA

USA . 402 parts In-Stock

1+ parts

$22.458

100+ parts

-

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402

$22.458

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Ampacity Inc.

Singapore . 248 parts In-Stock

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$27.000

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248

$27.000

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MKK Technologies

India . 235 parts In-Stock

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$34.866

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235

$34.866

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DigiPath Technology Company

USA . 235 parts In-Stock

1+ parts

$34.866

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235

$34.866

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Component Stockers USA

USA . 608 parts In-Stock

1+ parts

$99.990

100+ parts

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608

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 16,624 parts In-Stock

1+ parts

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16,624

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Corphita

USA . 2,417 parts In-Stock

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2,417

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Parana Technologies

USA . 2,212 parts In-Stock

1+ parts

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$22.169

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2,212

-

$22.169

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-

Overview

Unlock unparalleled performance with the 74AC16245TTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality bus driver and transceiver ensures robust data transfer while minimizing power consumption, making it perfect for demanding applications across automotive, industrial, and consumer electronics. With its compact design and exceptional reliability, elevate your projects to new heights, emphasizing efficiency and precision for superior results that drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 9 ns

A low propagation delay of 9 ns allows for fast signal transmission, making this product ideal for high-speed applications.

Surface Mount: YES

The surface mount design facilitates compact PCB layouts, allowing for space-efficient applications.

No. of Functions: 2

With two functions integrated, this product offers versatility and can handle multiple tasks, reducing component count.

Package Shape: RECTANGULAR

The rectangular package shape is standard and allows easy integration into most PCB designs.

No. of Bits: 8

An 8-bit data width makes this product suitable for a wide range of digital applications.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3 V makes it compatible with many modern digital systems, enhancing battery life.

Power Supplies (V): 3.3/5

Supporting both 3.3 V and 5 V power supplies offers great flexibility in design choices.

No. of Terminals: 48

With 48 terminals, this device provides ample connectivity options for complex systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for compact electronic designs where space is at a premium.

Maximum I (ol): 24 Amp

A maximum output current of 24 A allows this product to drive loads efficiently, making it capable of handling demanding applications.

Propagation Delay (tpd): 9 ns

Reiterating a fast propagation delay of 9 ns ensures optimal performance in high-speed digital circuits.

Maximum Operating Temperature: 125 °C

Designed to operate up to 125 °C, this product is suited for high-temperature applications, fitting in harsher environments.

Output Characteristics: 3-STATE

3-state output characteristics enhance flexibility in configurations, allowing multiple devices to share the same bus.

Minimum Operating Temperature: -55 °C

The ability to function down to -55 °C makes this component reliable for extreme conditions, perfect for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish ensures excellent conductivity and resistance to oxidation, enhancing reliability.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design and integrates well with various circuit configurations.

No. of Ports: 2

Having two ports allows for bidirectional communication, increasing the efficiency of data exchange.

Maximum Seated Height: 1.2 mm

The low seated height at 1.2 mm supports high-density mounting on PCBs, essential for compact electronic devices.

Width: 6.1 mm

A width of 6.1 mm ensures compatibility with standard PCB designs while optimizing space.

Output Polarity: TRUE

The true output polarity simplifies integration into various systems, making design easier.

Minimum Supply Voltage (Vsup): 2 V

Operational down to 2 V supports energy-efficient designs, valuable for battery-operated devices.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows compatibility with modern soldering processes, ensuring reliable assembly.

Length: 12.5 mm

At 12.5 mm in length, the design optimizes real estate on PCBs while delivering robust functionality.

Temperature Grade: MILITARY

The military grade ensures high reliability and performance in rigorous conditions, suitable for defense applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form provides ease of soldering and reliable mechanical stability on PCBs.

Packing Method: TR

The TR packing method facilitates easy handling and storage, ensuring efficiency in manufacturing processes.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high density in component placement, making it suitable for compact circuit designs.

Count Direction: BIDIRECTIONAL

Bidirectional count direction enhances versatility, allowing for greater control in data transmission.

Control Type: COMMON CONTROL

Common control type simplifies the design of control logic, making integration straightforward.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6 V allows for flexibility in operating conditions, accommodating various applications.

Technical Specifications

Bus Driver & Transceivers 74AC16245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74AC16245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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