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74AC541SC

Onsemi

74AC541SC by Onsemi

Onsemi's 74AC541SC is an 8-bit bus driver with a propagation delay of 9ns at 3.3V, featuring a small outline package for industrial applications. It has a max operating temperature of 85°C, output polarity is true, and supports surface mount installation.

Median Price

$0.544

Lifecycle Status

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49

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1k+

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Chip1Stop

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Arrow

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Farnell

UK . 1,039 parts In-Stock

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Mouser Electronics

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DigiKey

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Verical

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Ampacity Inc.

Singapore . 3,332 parts In-Stock

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Semicontronic

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Continental Prestige Electronics

USA . 4,671 parts In-Stock

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Argo Parts USA

USA . 3,265 parts In-Stock

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Netroflash

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Andel Nordic

Denmark . 5,182 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,838 parts In-Stock

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Overview

Enhance your electronic designs with the 74AC541SC by Onsemi, a top-tier manufacturer known for quality and reliability. This Bus Driver & Transceiver excels in applications requiring efficient signal transmission. With a low propagation delay of just 9 ns and 3-STATE output characteristics, this product ensures fast and reliable data transfer. The compact package style and wide operating temperature range make it ideal for industrial use. Experience seamless performance and unmatched value with the 74AC541SC, setting new standards in electronic connectivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 9 ns

With a low propagation delay, the bus driver & transceivers can transmit data quickly and efficiently, making it suitable for high-speed communication systems.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it convenient for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this product is energy-efficient and compatible with standard voltage levels in many electronic systems.

Load Capacitance (CL): 50 pF

With a low load capacitance, this product can drive capacitive loads effectively, ensuring reliable signal transmission.

Power Supplies (V): 3.3/5

Supporting multiple power supply voltages (3.3V/5V), this product offers flexibility in different operating environments.

Maximum I (ol): 12 Amp

With a high maximum output current, this product can drive demanding loads without any risk of overheating or damage.

Output Characteristics: 3-STATE

Featuring 3-state output characteristics, this product allows the bus driver & transceivers to control the bus lines effectively, enabling multi-drop or multi-point communication.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range (-40°C to 85°C), this product can operate reliably in harsh environments with temperature fluctuations.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Bus Driver & Transceivers 74AC541SC attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74AC541SC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-453-8240, 5962014538240

NIIN

014538240

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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