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74AC541SCX

Onsemi

74AC541SCX by Onsemi

74AC541SCX by Onsemi is an 8-bit bus driver with a propagation delay of 9ns at 3.3V, suitable for industrial applications. It features a max I (ol) of 12A, operates b/w -40 to 85°C, and has a small outline package style for surface mount assembly.

Median Price

$0.470

Lifecycle Status

Suppliers In-Stock

42

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 23,235 parts In-Stock

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$0.880

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DigiKey

USA . 3,357 parts In-Stock

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$1.030

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$0.593

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$0.513

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$0.471

3,357

$1.030

$0.593

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$0.471

Future Electronics

Canada . 3,000 parts In-Stock

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Arrow

USA . 1,000 parts In-Stock

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$0.347

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Verical

USA . 1,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 518 parts In-Stock

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Rochester

USA . 364 parts In-Stock

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Distributors (In-Stock)

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Greenchips

USA . 751 parts In-Stock

1+ parts

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100+ parts

$0.273

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$0.260

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751

$0.287

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$0.235

DF Sales Co.

USA . 973 parts In-Stock

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DF Sales Co.

USA . 973 parts In-Stock

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Digiode

USA . 2,916 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Component Electronics Inc.

Canada . 61 parts In-Stock

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Standard Data Resources

USA . 110,000 parts In-Stock

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Flip Electronics

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Cyclops Electronics Ltd

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Vyrian

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IBS Electronics

USA . 3,000 parts In-Stock

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NAC Semi

USA . 2,000 parts In-Stock

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Bristol Electronics

USA . 1,733 parts In-Stock

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Pegasus Components GmbH

Germany . 1,453 parts In-Stock

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Atlantic Semiconductor

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SIE Connect GmbH - GreenChips

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Mil-Aero Solutions, Inc.

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Inventory MP

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ComSIT Distribution GmbH

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Corel Iberica Componentes, S.L.

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PC Components Company LLC

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EMSNET

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Prism Electronics

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Distributors (Availability)

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Corohmni

South Africa . 395 parts In-Stock

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$0.250

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Semicontronic

India . 5,003 parts In-Stock

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$0.392

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$0.382

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$0.380

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Ampacity Inc.

Singapore . 4,862 parts In-Stock

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$0.392

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Corphita

USA . 1,234 parts In-Stock

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Continental Prestige Electronics

USA . 5,000 parts In-Stock

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$0.519

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$0.509

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Argo Parts USA

USA . 4,404 parts In-Stock

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Component Stockers USA

USA . 570 parts In-Stock

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$1.140

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$0.250

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Aztec Data Supply Inc.

USA . 646 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 28,858 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 11,850 parts In-Stock

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SupplyDigital Components

Austria . 7,879 parts In-Stock

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Problanco Electronics

Mexico . 7,771 parts In-Stock

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Kulean Microsystems

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Authorized Procurement Solutions

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Supply Digital

USA . 2,796 parts In-Stock

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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TANS Electronics

Latvia . 2,441 parts In-Stock

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S.R.D Solutions

India . 2,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 852 parts In-Stock

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Lixinc

USA . 583 parts In-Stock

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Assy Fe

Spain . 570 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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$11.792

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$10.919

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$10.919

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$11.792

$10.919

$10.919

Lucentia Tech

USA . 500 parts In-Stock

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$11.792

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$10.919

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$10.919

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$10.919

$10.919

UHIMA Technologies

Türkiye . 209 parts In-Stock

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Metaverse IC Inc.

Canada . 141 parts In-Stock

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Overview

Upgrade your electronic designs with the 74AC541SCX by Onsemi, a top-quality bus driver & transceiver that combines reliability and performance. With a wide range of applications, this product stands out for its efficiency, speed, and versatility, making it an essential component for your projects. Trust in Onsemi's expertise to deliver cutting-edge technology that meets your needs and exceeds your expectations. Embrace innovation and enhance your circuits with the 74AC541SCX today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 9 ns

The low propagation delay of 9 ns ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and assembly of this product easy and convenient in various electronic devices.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data processing tasks effectively, making it versatile and compatible with different systems.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this product offers energy efficiency and compatibility with standard power sources.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable performance in handling capacitive loads, making this product suitable for various applications.

Power Supplies (V): 3.3/5

Supporting multiple power supply voltages (3.3V and 5V) gives flexibility in designing and integrating this product into different systems.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options, allowing for versatile and customizable configurations in different circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact integration of this product into electronic designs with limited board real estate.

Maximum I (ol): 12 Amp

With a maximum output current of 12 Amps, this product can drive heavy loads with ease, making it suitable for demanding applications.

Propagation Delay (tpd): 9 ns

The low propagation delay of 9 ns ensures minimal signal delay and high-speed performance, making this product ideal for time-critical operations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can function reliably in various environmental conditions without overheating.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for tri-state logic operation, providing flexibility in signal control and reducing power consumption when signals are not active.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 to 85°C ensures operational reliability in both extreme cold and hot conditions, making this product versatile in various environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers corrosion resistance and solderability, ensuring long-term reliability and ease of soldering during assembly.

Terminal Position: DUAL

Dual terminal positions provide flexibility in mounting and connecting this product, allowing for versatile installation and compatibility with different PCB layouts.

No. of Ports: 2

Having 2 ports allows for multiple connections and data transfers simultaneously, making this product suitable for applications that require multi-channel communication.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm allows for slim and compact design integration, saving space and enabling efficient PCB layout.

Width: 7.5 mm

The narrow width of 7.5 mm enables easy integration of this product into tight spaces and compact electronic devices, offering flexibility in design.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with standard logic levels, making this product easy to interface with other components.

Minimum Supply Voltage (Vsup): 2 V

Supporting a minimum supply voltage of 2V allows for operation in low-power scenarios and compatibility with a wide range of power sources, making this product versatile.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature allows for reliable and efficient soldering during assembly, ensuring proper connection and performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring robustness and reliability during assembly.

Length: 12.8 mm

The compact length of 12.8 mm allows for space-efficient integration of this product into electronic designs, enabling compact and streamlined circuit layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable operation in harsh environmental conditions, making this product suitable for industrial applications where durability is essential.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it an efficient and versatile choice.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable performance and ease of soldering during assembly.

Packing Method: TR

The TR packing method ensures safe and secure packaging of this product for transportation and storage, protecting it from damage and ensuring product integrity.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm offers compatibility with standard PCB layouts and components, making this product easy to integrate into existing electronic designs.

Control Type: ENABLE LOW

The enable low control type allows for easy and efficient signal control, providing flexibility in system operation and simplifying integration with other components.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures that this product is resistant to moisture damage during storage and assembly, enhancing its reliability and longevity.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6V allows for versatility in power supply options and compatibility with a wide range of voltage sources, making this product adaptable to different system requirements.

Technical Specifications

Bus Driver & Transceivers 74AC541SCX attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74AC541SCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-453-8240, 5962014538240

NIIN

014538240

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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