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H5TQ4G63AFR-PBC

Sk Hynix

H5TQ4G63AFR-PBC by Sk Hynix

Sk Hynix's H5TQ4G63AFR-PBC is a 256MX16 DDR3 DRAM with 256M words and 4294967296 bit memory density. Operating at 800 MHz, it features a max clock frequency of fCLK and supports multi-bank page burst access mode. With a package style of GRID ARRAY, THIN PROFILE, FINE PITCH, this synchronous DRAM is ideal for high-performance computing applications.

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Vyrian

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EPE Components Inc.

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Bristol Electronics

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Nova Conductors

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ComSIT Distribution GmbH

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AZTECH Wire

Italy . 555 parts In-Stock

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Lixinc

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Bastille Electronics

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Overview

Elevate your device's performance with the H5TQ4G63AFR-PBC by Sk Hynix, a top-quality DDR3 DRAM chip designed to optimize speed and efficiency. Manufactured by the reputable brand Sk Hynix, this memory module offers seamless synchronous operation and self-refresh capabilities for reliable performance. Ideal for a wide range of applications, this rectangular-shaped chip is perfect for those seeking high-speed data processing and multitasking abilities. Upgrade your system today with the H5TQ4G63AFR-PBC and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DRAM, ensuring long-term reliability.

Operating Mode: SYNCHRONOUS

Allows for data to be transferred in sync with a clock signal, improving overall performance and efficiency.

Nominal Supply Voltage / Vsup (V): 1.5

Provides a stable voltage supply for the DRAM to operate efficiently without risking damage from voltage fluctuations.

Maximum Clock Frequency (fCLK): 800 MHz

High clock frequency allows for faster data transfer rates and overall improved system performance.

Memory IC Type: DDR3 DRAM

DDR3 technology offers a good balance of performance, power efficiency, and cost-effectiveness for various computing applications.

Technical Specifications

DRAM H5TQ4G63AFR-PBC attributes and parameters. Explore more DRAM devices from Sk Hynix

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

.225 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

800 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B96

Length:

13 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

4,8

Maximum Standby Current:

.017 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

220 mA

Maximum Supply Voltage (Vsup):

1.575 V

Minimum Supply Voltage (Vsup):

1.425 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Trade Compliance

H5TQ4G63AFR-PBC Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Sk Hynix

A Solution Provider Leading the Global ICT Ecosystem With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees. SK hynix is committed to becoming a solution provider, which leads the global ICT ecosystem through paradigm-shifting hyper collaboration with our global partners. Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in search of more social value and a healthier governance structure. SK hynix will rise to become a “Global Top-Tier Technology Company”, which contributes to humanity and society.

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