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H5TQ2G63DFR-H9C

Sk Hynix

H5TQ2G63DFR-H9C by Sk Hynix

Sk Hynix's H5TQ2G63DFR-H9C is a 128MX16 DDR3 DRAM with 667 MHz clock frequency. Operating at 1.5V, it offers 134217728 words of memory density for multi-bank page burst access mode applications. With a thin profile and fine pitch grid array package style, it suits high-performance computing needs.

Median Price

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Lifecycle Status

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9

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Chip Stock

USA . 15,900 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 6,082 parts In-Stock

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Greenchips

USA . 4,800 parts In-Stock

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Dan-Mar Components

USA . 1,920 parts In-Stock

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Vyrian

USA . 1,547 parts In-Stock

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Bristol Electronics

USA . 800 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Cyclops Electronics Ltd

UK . 35 parts In-Stock

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Semtec, LLC

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AZTECH Wire

Italy . 502 parts In-Stock

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$5.723

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Lixinc

USA . 9,093 parts In-Stock

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Kepictronics

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Bastille Electronics

Australia . 900 parts In-Stock

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ChipstoGo Electronic ltd

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Overview

Experience exceptional performance with the H5TQ2G63DFR-H9C from SK Hynix. As a leading manufacturer in the industry, SK Hynix delivers top-notch quality DRAM products that cater to various applications. This cutting-edge memory module offers seamless multitasking capabilities, faster data processing speeds, and reliable operation for your devices. Elevate your gaming experience, boost productivity, and enhance overall efficiency with this high-performance DRAM solution. Trust SK Hynix for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DRAM, ensuring long-term reliability.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfers, improving overall performance and efficiency.

Nominal Supply Voltage / Vsup (V): 1.5

Operates at an optimal voltage level for efficient power consumption and performance.

Maximum Clock Frequency (fCLK): 667 MHz

Supports high-speed data processing and transfers, ideal for demanding applications.

Memory IC Type: DDR3 DRAM

Utilizes advanced DDR3 technology for enhanced memory capabilities and performance.

Technical Specifications

DRAM H5TQ2G63DFR-H9C attributes and parameters. Explore more DRAM devices from Sk Hynix

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

.255 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

667 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B96

Length:

13 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

4,8

Maximum Standby Current:

.012 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

225 mA

Maximum Supply Voltage (Vsup):

1.575 V

Minimum Supply Voltage (Vsup):

1.425 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

H5TQ2G63DFR-H9C Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Sk Hynix

A Solution Provider Leading the Global ICT Ecosystem With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees. SK hynix is committed to becoming a solution provider, which leads the global ICT ecosystem through paradigm-shifting hyper collaboration with our global partners. Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in search of more social value and a healthier governance structure. SK hynix will rise to become a “Global Top-Tier Technology Company”, which contributes to humanity and society.

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