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72V275L10TFG8

Renesas Electronics

72V275L10TFG8 by Renesas Electronics

The Renesas Electronics 72V275L10TFG8 is a FIFO memory IC with a cycle time of 10 ns and an operating frequency of up to 100 MHz. It has a memory density of 589824 bits and is commonly used in applications requiring high-speed data buffering and storage.

Median Price

$109.968

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$109.968

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100

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VNN

France . 3,432 parts In-Stock

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Vyrian

USA . 1,166 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 263 parts In-Stock

1+ parts

$7.000

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263

$7.000

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AZTECH Wire

Italy . 745 parts In-Stock

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$15.575

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745

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Continental Prestige Electronics

USA . 5,710 parts In-Stock

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$109.968

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$107.769

5,710

$109.968

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Netroflash

USA . 100 parts In-Stock

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$109.968

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$107.769

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100

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Microchip USA

USA . 2,280 parts In-Stock

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$174.348

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2,280

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QUARKTWIN TECHNOLOGY LTD

USA . 28,344 parts In-Stock

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Argo Parts USA

USA . 1,531 parts In-Stock

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Overview

Discover the revolutionary 72V275L10TFG8 by Renesas Electronics, a high-quality FIFO device that offers unrivaled value and benefits. With its advanced technology and reliable performance, this product is perfect for a wide range of applications. Renesas Electronics, a renowned manufacturer in the industry, ensures superior craftsmanship and precision engineering in every product. Experience seamless operation with synchronous mode and a fast cycle time of 10 ns. Its compact design and low-profile package make it suitable for space-constrained environments. Don't miss out on this game-changing solution that maximizes efficiency and productivity. Upgrade to the 72V275L10TFG8 today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Makes the product lightweight and durable, suitable for various applications.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards, saving time and effort.

Cycle Time:

10 ns - Provides fast data transfer and processing, enhancing overall performance.

No. of Functions:

1 - Simplifies the design and integration process, making it cost-effective and reliable.

Package Shape:

SQUARE - Allows for efficient use of space on the circuit board, optimizing the layout.

Operating Mode:

SYNCHRONOUS - Ensures synchronized communication and data transfer, reducing errors.

Nominal Supply Voltage / Vsup (V):

3.3 - Offers a standard voltage level compatible with most systems, enhancing compatibility.

Power Supplies (V):

3.3 - Provides a reliable power source, ensuring stable and consistent operation.

No. of Terminals:

64 - Offers a sufficient number of terminals for easy connectivity and integration.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - Enables compact and space-efficient designs, suitable for compact devices.

Maximum Operating Temperature:

70 °C - Allows the product to operate in various environments without the risk of overheating.

Organization:

32KX18 - Provides a large memory capacity, allowing for the storage and retrieval of a significant amount of data.

Minimum Operating Temperature:

0 °C - Enables the product to operate in cold environments without performance degradation.

Terminal Finish:

Matte Tin (Sn) - annealed - Enhances the durability and longevity of the terminals, reducing the risk of corrosion.

Terminal Position:

QUAD - Facilitates easy and organized connectivity with other components in the circuit.

Maximum Seated Height:

1.6 mm - Allows for a low-profile design, enabling the product to fit in tight spaces.

Maximum Clock Frequency (fCLK):

100 MHz - Provides high-speed data transfer capabilities, improving overall system performance.

Width:

10 mm - Compact size allows for flexible placement and integration in various devices or systems.

Minimum Supply Voltage (Vsup):

3 V - Provides a lower voltage option for systems with specific power requirements.

Maximum Time At Peak Reflow Temperature (s):

30 - Allows for safe and efficient soldering without damaging the product.

Peak Reflow Temperature °C:

260 - Can withstand high-temperature soldering processes, ensuring product reliability.

Length:

10 mm - Compact size allows for versatile integration in different systems or devices.

Temperature Grade:

COMMERCIAL - Suitable for standard commercial applications, ensuring compatibility and availability.

Technology:

CMOS - Utilizes CMOS technology for efficient power consumption and reliable performance.

Parallel or Serial:

PARALLEL - Offers parallel data transfer, enabling fast and simultaneous processing.

Terminal Form:

GULL WING - Easy to solder and provides secure connections, ensuring reliable operation.

Maximum Supply Current:

60 mA - Efficient power consumption, reducing the strain on the power supply system.

No. of Words:

32768 words - Large memory capacity for storing extensive data, suitable for demanding applications.

Memory Width:

18 - Wide memory width allows for handling larger chunks of data simultaneously, increasing efficiency.

Terminal Pitch:

0.5 mm - Provides a narrow pitch for efficient and compact board layout, optimizing space utilization.

No. of Words Code:

32K - Identifies the memory capacity as 32K words for easy reference and compatibility.

Moisture Sensitivity Level (MSL):

3 - Indicates resistance to moisture-related damage, ensuring product reliability.

Maximum Supply Voltage (Vsup):

3.6 V - Allows for a higher voltage supply option in systems requiring increased power.

Memory Density:

589824 bit - Large memory density, facilitating the storage of vast amounts of data for complex applications.

Memory IC Type:

OTHER FIFO - Indicates the product functions as a FIFO memory, enabling efficient data handling.

Output Enable:

YES - Provides the option to enable or disable the output, offering flexibility in data transmission.

Maximum Standby Current:

0.02 Amp - Low standby current consumption, reducing power usage during idle periods.

Maximum Access Time:

6.5 ns - Fast access time enables quick retrieval and processing of data, enhancing overall performance.

Technical Specifications

FIFO 72V275L10TFG8 attributes and parameters. Explore more FIFO devices from Renesas Electronics

Specs

Maximum Access Time:

6.5 ns

Additional Features:

RETRANSMIT; AUTO POWER-DOWN

Maximum Clock Frequency (fCLK):

100 MHz

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Memory Density:

589824 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.02 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

72V275L10TFG8 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Renesas Electronics

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