Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Renesas Electronics 72V275L10TFG8 is a FIFO memory IC with a cycle time of 10 ns and an operating frequency of up to 100 MHz. It has a memory density of 589824 bits and is commonly used in applications requiring high-speed data buffering and storage.
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PLASTIC/EPOXY - Makes the product lightweight and durable, suitable for various applications.
YES - Allows for easy and efficient installation on circuit boards, saving time and effort.
10 ns - Provides fast data transfer and processing, enhancing overall performance.
1 - Simplifies the design and integration process, making it cost-effective and reliable.
SQUARE - Allows for efficient use of space on the circuit board, optimizing the layout.
SYNCHRONOUS - Ensures synchronized communication and data transfer, reducing errors.
3.3 - Offers a standard voltage level compatible with most systems, enhancing compatibility.
3.3 - Provides a reliable power source, ensuring stable and consistent operation.
64 - Offers a sufficient number of terminals for easy connectivity and integration.
FLATPACK, LOW PROFILE, FINE PITCH - Enables compact and space-efficient designs, suitable for compact devices.
70 °C - Allows the product to operate in various environments without the risk of overheating.
32KX18 - Provides a large memory capacity, allowing for the storage and retrieval of a significant amount of data.
0 °C - Enables the product to operate in cold environments without performance degradation.
Matte Tin (Sn) - annealed - Enhances the durability and longevity of the terminals, reducing the risk of corrosion.
QUAD - Facilitates easy and organized connectivity with other components in the circuit.
1.6 mm - Allows for a low-profile design, enabling the product to fit in tight spaces.
100 MHz - Provides high-speed data transfer capabilities, improving overall system performance.
10 mm - Compact size allows for flexible placement and integration in various devices or systems.
3 V - Provides a lower voltage option for systems with specific power requirements.
30 - Allows for safe and efficient soldering without damaging the product.
260 - Can withstand high-temperature soldering processes, ensuring product reliability.
10 mm - Compact size allows for versatile integration in different systems or devices.
COMMERCIAL - Suitable for standard commercial applications, ensuring compatibility and availability.
CMOS - Utilizes CMOS technology for efficient power consumption and reliable performance.
PARALLEL - Offers parallel data transfer, enabling fast and simultaneous processing.
GULL WING - Easy to solder and provides secure connections, ensuring reliable operation.
60 mA - Efficient power consumption, reducing the strain on the power supply system.
32768 words - Large memory capacity for storing extensive data, suitable for demanding applications.
18 - Wide memory width allows for handling larger chunks of data simultaneously, increasing efficiency.
0.5 mm - Provides a narrow pitch for efficient and compact board layout, optimizing space utilization.
32K - Identifies the memory capacity as 32K words for easy reference and compatibility.
3 - Indicates resistance to moisture-related damage, ensuring product reliability.
3.6 V - Allows for a higher voltage supply option in systems requiring increased power.
589824 bit - Large memory density, facilitating the storage of vast amounts of data for complex applications.
OTHER FIFO - Indicates the product functions as a FIFO memory, enabling efficient data handling.
YES - Provides the option to enable or disable the output, offering flexibility in data transmission.
0.02 Amp - Low standby current consumption, reducing power usage during idle periods.
6.5 ns - Fast access time enables quick retrieval and processing of data, enhancing overall performance.
FIFO 72V275L10TFG8 attributes and parameters. Explore more FIFO devices from Renesas Electronics
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72V275L10TFG8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - All Dev Label Chg 1/Dec/2022
PCN Assembly/Origin - Alt. Assembly Site 15/Feb/2016
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
2N2222A
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
BAV99
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
1552200253
Molex
WIRE AND CABLE;
ULN2803A
Texas Instruments
ULN2803A by Texas Instruments is a peripheral driver with 8 functions. It has a max supply voltage of 3V and can operate in temperatures ranging from -40 to 85°C. This IC is commonly used as a buffer or inverter based peripheral driver for various applications.
LM317T
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
1N4148WSF-7
Diodes Incorporated
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
Unitrode
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
NE555D
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Micro Commercial Components
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
7203L25JI8
Integrated Device Technology
7203L25JI8 by Integrated Device Technology is a FIFO chip with 2KX9 organization, operating at 5V. It has a cycle time of 35ns and max clock frequency of 28.5MHz. Ideal for industrial applications requiring fast data storage and retrieval in parallel mode.
IDT7203L12JG8
Renesas Electronics
The Renesas Electronics IDT7203L12JG8 is a FIFO chip with 2Kx9 organization, operating at 50MHz with a cycle time of 20ns. It features a parallel interface, 3-STATE output characteristics, and operates on a supply voltage of 5V. Ideal for applications requiring high-speed data buffering and storage in commercial-grade environments.
CY7C4235-15AC
Cypress Semiconductor
CY7C4235-15AC by Cypress Semiconductor is a 2Kx18 FIFO with 15ns cycle time, operating at 66.7MHz clock frequency. It is used in applications requiring fast synchronous data transfer and features a 64-terminal flatpack package suitable for surface mount assembly.
SN74ABT7815-15PQ
SN74ABT7815-15PQ by Texas Instruments is a 128x36 bi-directional FIFO memory IC with synchronous operation at 67MHz. It operates on a 5V supply, has a max access time of 10ns, and can withstand temperatures from 0 to 70°C. This device is ideal for applications requiring fast data transfer and storage in commercial-grade environments.
SN74ABT7817PQ
FIFOs;
SN74ACT72221L35RJ
SN74ACT72221L35RJ by Texas Instruments is a 1Kx9 FIFO chip with CMOS technology. It operates synchronously at 5V, has 32 terminals, and supports parallel data transfer. This rectangular chip carrier package is ideal for applications requiring high-speed data buffering and storage in commercial temperature environments.
SN74ACT7201LA50NP
SN74ACT7201LA50NP by Texas Instruments is a FIFO memory with 512x9 organization, operating at 15 MHz clock frequency. It has a cycle time of 65 ns and operates on a 5V supply voltage. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT3611-20PCBR
SN74ABT3611-20PCBR by Texas Instruments is a FIFO with 64x36 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics.
7203L15TPI
7203L15TPI by Integrated Device Technology is a FIFO with 2KX9 organization, 25 ns cycle time, and 40 MHz clock frequency. Ideal for industrial applications requiring fast data processing and storage in an asynchronous operating mode. Package style is rectangular with 28 terminals in-line, suitable for parallel operations at a max supply voltage of 5.5 V.
72V243L6BCG
The Renesas Electronics 72V243L6BCG is a FIFO with 2Kx18 organization, operating at 166MHz with a cycle time of 6ns. It features synchronous operation and a low profile grid array package shape. Ideal for applications requiring fast data processing in commercial temperature environments.
IDT72V36110L7.5PFGI
IDT72V36110L7.5PFGI FIFO operates synchronously with 7.5ns cycle time, 128Kx36 organization, and 131072 words. Suitable for industrial applications, it features a low profile flatpack package with matte tin terminal finish and gull wing form factor.
74HC40105PW,118
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 600 ns;
QS7201-35V
Rochester Electronics
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Shape: RECTANGULAR; Output Enable: NO; Minimum Operating Temperature: 0 Cel;
SN74ACT3651-30PQR
SN74ACT3651-30PQR by Texas Instruments is a FIFO with 2KX36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments.
72V221L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Length: 7 mm;
IDT7202LA20LB8
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
7203L12J8
7203L12J8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 50 MHz clock frequency. It features a cycle time of 20 ns and can handle memory width of 9 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT3632-20PQR
SN74ACT3632-20PQR by Texas Instruments is a FIFO with 512x36 organization, operating at 20 ns cycle time. It features synchronous operation, 3-STATE output characteristics, and a memory density of 18432 bit. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ACT7206L-25DVR
SN74ACT7206L-25DVR by Texas Instruments is a 16Kx9 FIFO with 35ns cycle time, operating at 5V. It features a small outline package, asynchronous mode, and 3-STATE output. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ABT3613-20PCBR
SN74ABT3613-20PCBR by Texas Instruments is a FIFO with 64x36 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems. The device features a flatpack package style with low profile and fine pitch for compact designs.
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72V2105L10PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 262144 words;
72V2113L6PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Memory Width: 18;
72V2105L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
72V2111L15PFGI
The Renesas Electronics 72V2111L15PFGI FIFO operates synchronously with a cycle time of 15 ns and a clock frequency of up to 66.7 MHz. It features a memory density of 4718592 bit, suitable for industrial applications requiring fast data processing and parallel operation at temperatures ranging from -40 to 85°C.
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 524288 words;
72V2111L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .02 Amp;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
72V211L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 512 words;
72V2111L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 1;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3.15 V;
72V211L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Memory Density: 4608 bit;
72V241L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES;
72V241L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
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