Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIFO 7206L15PDGG attributes and parameters. Explore more FIFO devices from Renesas Electronics
Memory IC Type:
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
BAV99
Zetex Plc
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Silicon Standard
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N2222A
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
BAV99-7-F
Multicomp Pro
1N4148
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
STMicroelectronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
Rectron
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
7203L12J8
Integrated Device Technology
7203L12J8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 50 MHz clock frequency. It features a cycle time of 20 ns and can handle memory width of 9 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V3680L7-5PFGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
CY7C4235-15AXCT
Cypress Semiconductor
CY7C4235-15AXCT by Cypress Semiconductor is a 2Kx18 FIFO with 15ns cycle time, operating at 5V. It features synchronous mode and GULL WING terminals. Ideal for applications requiring fast data transfer in commercial temperature environments.
7202LA25JI8
7202LA25JI8 by Integrated Device Technology is a FIFO chip with 1KX9 organization, operating at 5V. It features a cycle time of 35ns and max clock frequency of 28.5MHz, suitable for industrial applications requiring fast data processing in parallel mode.
SN74V263PZAEP
Texas Instruments
SN74V263PZAEP by Texas Instruments is a FIFO memory with 8Kx18 organization, operating at 133 MHz. It features a cycle time of 7.5 ns and synchronous operation, suitable for military-grade applications requiring fast data processing and low power consumption. With a package style of flatpack and low profile design, it offers high memory density of 147456 bits in a compact form factor.
CY7C4275V-15ASXC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; No. of Words Code: 32K;
SN74ABT3611-15PCB
SN74ABT3611-15PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 15ns cycle time, and 66.7MHz clock frequency. It operates synchronously at 5V and has a low profile flatpack package style. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7204
Teledyne E2v (Uk)
FIFOs;
5962-9560901NXX
Texas Instruments' 5962-9560901NXX FIFO features a cycle time of 20ns, operating at 5V with an organization of 1KX36. Ideal for military applications due to its MIL-PRF-38535 Class N screening level and CMOS technology, this synchronous device offers fast access times and a memory density of 36864 bits.
SN74ACT7201LA-15DVR
SN74ACT7201LA-15DVR by Texas Instruments is a FIFO with 512x9 organization, 25 ns cycle time, and 15 ns max access time. It operates asynchronously at a nominal voltage of 5V. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V3632L10PFG8
Renesas Electronics
Renesas Electronics' 72V3632L10PFG8 FIFO operates synchronously with a cycle time of 10 ns and a clock frequency up to 100 MHz. With a memory density of 18432 bit, it is ideal for applications requiring fast data processing such as networking equipment and telecommunications systems. The device features a low profile flatpack package with 120 terminals and operates within the commercial temperature grade range of 0-70°C.
IDT72801L35PF
IDT72801L35PF FIFO by Integrated Device Technology features a cycle time of 35ns, synchronous operation, and 512x9 organization. Ideal for applications requiring fast data storage and retrieval, with a max clock frequency of 28.6MHz. This low-profile flatpack device operates at temperatures b/w 0-70°C, making it suitable for commercial-grade projects.
IDT72801L15PF
IDT72801L15PF by Integrated Device Technology is a FIFO memory with 256x9 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. Suitable for commercial applications, it features synchronous operation, parallel interface, and low profile flatpack package style.
SN54LS222W
SN54LS222W by Texas Instruments is a 16x4 FIFO memory IC operating at 5V, with a temperature range of -55°C to 125°C. It features asynchronous operation, flatpack package style, and dual terminal position. Ideal for military-grade applications requiring reliable data storage and retrieval in harsh environments.
7201LA12JG8
Renesas Electronics 7201LA12JG8 FIFO chip features 512x9 organization, operates at 50 MHz clock frequency, and has a cycle time of 20 ns. Ideal for applications requiring fast data storage and retrieval in commercial-grade temperature environments.
SN74ACT72235-40FN
SN74ACT72235-40FN by Texas Instruments is a FIFO chip with 1Kx9 organization, 40ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems. The chip comes in a square chip carrier package with surface mount capability.
SN74ACT7202LA25DV
SN74ACT7202LA25DV by Texas Instruments is a FIFO memory with 1Kx9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates asynchronously at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT72221L-50RJ
SN74ACT72221L-50RJ by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 20MHz clock frequency and 50ns cycle time. It has a memory density of 9216 bits and can operate in synchronous mode. This chip is commonly used in applications requiring fast data storage and retrieval in parallel processing systems.
SN74ACT2235-60PM
SN74ACT2235-60PM by Texas Instruments is a FIFO memory IC with 1Kx9 organization, operating at 60ns cycle time and 16.7MHz clock frequency. It features a 64-terminal flatpack package suitable for commercial temperature grades, ideal for parallel data storage applications requiring fast access times.
IDT72V845L15PFI8
IDT72V845L15PFI8 by Integrated Device Technology is a FIFO memory with 4Kx18 organization, 15ns cycle time, and operates at 3.3V. It is suitable for industrial applications requiring fast access times and parallel data transfer, featuring a low profile flatpack package with gull wing terminals.
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7206L15JG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
7206L15PDG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 40 MHz;
7206L12PDG
7206L15DGI8
7206L15LG
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Package Body Material: UNSPECIFIED;
7206L15DG8
7206L12DG8
7206L12TPG
7206L15JGI8
FIFOs; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
7206L15JG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Access Time: 15 ns;
7206L15DG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T28;
7206L15LG8
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Access Time: 15 ns; Minimum Supply Voltage (Vsup): 4.5 V;
7206L12JG8
FIFOs; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3;
7206L15DGI
7206L12DG
7206L12JG
FIFOs; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
7206L12TPG8
7206L15JGI
FIFOs; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
7206FRPFB-20
Maxwell Technologies
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DFP; Package Shape: RECTANGULAR; Maximum Seated Height: 3.937 mm;
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