Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIFOs; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
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FIFO 7206L12JG attributes and parameters. Explore more FIFO devices from Renesas Electronics
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Peak Reflow Temperature (C):
Terminal Finish:
Maximum Time At Peak Reflow Temperature (s):
7206L12JG Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
STM8S003F3P6TR
STMicroelectronics
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
LM107H/883
LM107H/883 by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 3000uV max input offset voltage, 80dB common mode reject ratio, and 250kHz unity gain bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and robust metal package body material.
MURS160T3G
Onsemi
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
SS14
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; No. of Phases: 1; Config: SINGLE; Maximum Operating Temperature: 125 Cel;
1N4148
Toshiba
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
Temic Semiconductors
LL4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS3200T3G
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
Diodes Incorporated
MMBF170LT1G
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
OPA2277UA
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
SN74ACT2236-20FNR
SN74ACT2236-20FNR by Texas Instruments is a 2Kx9 FIFO chip with 20ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V82L20PAGI8
Renesas Electronics
Renesas Electronics' 72V82L20PAGI8 is a FIFO memory IC with 1Kx9 organization, operating at 3.3V. It features a max access time of 20ns, suitable for industrial applications requiring fast data processing in parallel mode. The device comes in a small outline package with dual terminals and can operate b/w -40 to 85°C temperature range.
SN74ABT3613-15PQ
SN74ABT3613-15PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, 15 ns cycle time, and 66.7 MHz max clock frequency. It operates synchronously at 5V, suitable for commercial applications requiring fast data storage and retrieval in a compact flatpack package.
IDT72V235L10TFG8
Integrated Device Technology
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;
SN74ABT7819-12PHR
SN74ABT7819-12PHR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 12.5ns, synchronous mode, and 3-STATE output characteristics. This device is ideal for applications requiring fast data transfer and storage in commercial temperature environments.
7201LA25JGI8
Renesas Electronics 7201LA25JGI8 FIFO chip features 512x9 organization, 35ns cycle time, and operates at 5V. Ideal for industrial applications requiring fast parallel access memory with a memory density of 4608 bits. The chip is designed in a rectangular chip carrier package style for surface mount assembly.
SN74ACT72221L-20RJ
SN74ACT72221L-20RJ by Texas Instruments is a FIFO chip with 1KX9 organization, 20 ns cycle time, and 50 MHz clock frequency. It operates synchronously at 5V and has a memory density of 9216 bit. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT7202LA25TPI
Rochester Electronics
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
IDT7203L15TPI
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SN74ACT3632-20PQR
SN74ACT3632-20PQR by Texas Instruments is a FIFO with 512x36 organization, operating at 20 ns cycle time. It features synchronous operation, 3-STATE output characteristics, and a memory density of 18432 bit. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ABT3614-20PQR
SN74ABT3614-20PQR by Texas Instruments is a FIFO with 64x36 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and temporary storage in digital systems.
SN74V263PZAEP
SN74V263PZAEP by Texas Instruments is a FIFO memory with 8Kx18 organization, operating at 133 MHz. It features a cycle time of 7.5 ns and synchronous operation, suitable for military-grade applications requiring fast data processing and low power consumption. With a package style of flatpack and low profile design, it offers high memory density of 147456 bits in a compact form factor.
IDT7203L25PI
IDT7203L25PI by Integrated Device Technology is a FIFO memory chip with 2Kx9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is designed for industrial applications requiring fast and reliable data storage and retrieval in parallel mode.
SN74ALVC7804-25DLR
SN74ALVC7804-25DLR by Texas Instruments is a 512x18 FIFO memory IC with a cycle time of 25 ns and max clock frequency of 40 MHz. It operates at a nominal voltage of 3.3V and is commonly used in applications requiring high-speed data buffering and storage.
7203L15J8
7203L15J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 25 ns and an operating frequency of up to 40 MHz. It has a memory capacity of 2Kx9 and is commonly used in applications that require high-speed data buffering and storage.
SN74ACT3638-20PCBR
SN74ACT3638-20PCBR by Texas Instruments is a FIFO with 512x32 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments, it features a low profile flatpack package with gull wing terminals.
SN74ACT7202LA-50DVR
SN74ACT7202LA-50DVR by Texas Instruments is a FIFO with 1KX9 organization, 65 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer, such as buffering and caching in computer systems.
SN74ACT72211L35RJ
SN74ACT72211L35RJ by Texas Instruments is a 512x9 FIFO chip with synchronous operation and 5V nominal voltage. It features a memory density of 4608 bits, operates in commercial temperature grade up to 70°C, and supports parallel data transfer. This chip is commonly used in applications requiring high-speed data buffering and storage.
SN74ACT72235-30FN
SN74ACT72235-30FN by Texas Instruments is a FIFO chip with 1KX9 organization, 30.3 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems. The chip comes in a square plastic/epoxy package with 44 terminals for surface mount installation.
SN54ACT3632HFPR
SN54ACT3632HFPR by Texas Instruments is a FIFO with 512x36 organization, operating at 5V. It features a cycle time of 20ns and offers 3-STATE output characteristics. Ideal for military applications due to its MILITARY temperature grade and CMOS technology.
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7206L15JG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
7206L15PDG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 40 MHz;
7206L12PDG
FIFOs;
7206L15DGI8
7206L15LG
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Package Body Material: UNSPECIFIED;
7206L15DG8
BI-DIRECTIONAL FIFO;
7206L15PDGG
7206L12DG8
7206L12TPG
7206L15JGI8
FIFOs; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
7206L15JG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Access Time: 15 ns;
7206L15DG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T28;
7206L15LG8
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Access Time: 15 ns; Minimum Supply Voltage (Vsup): 4.5 V;
7206L12JG8
FIFOs; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3;
7206L15DGI
7206L12DG
7206L12TPG8
7206L15JGI
FIFOs; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
7206L12JG
FIFOs; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed;
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