Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Renesas Electronics 71V3556SA166BGGI8 is a 128Kx36 ZBT SRAM with synchronous operation at 166 MHz. It features a common I/O type, operates at 3.3V, and has a memory density of 4718592 bits. Ideal for industrial applications requiring fast access times and high-speed parallel memory functionality.
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This material offers durability and protection for the product, making it a reliable choice.
Allows for easy and convenient installation, saving time and effort during assembly.
This shape is commonly used and fits well in standard circuit designs, ensuring compatibility.
Synchronous operation ensures precise timing and coordination, improving overall performance.
Common input/output type simplifies connectivity and integration with other components.
A common voltage requirement that is easily accessible and widely supported.
Low power consumption at this voltage level helps to minimize energy usage.
Sufficient number of terminals for proper connectivity and functionality.
Grid array package style offers high density and robustness for demanding applications.
High operating temperature range ensures stable performance in various environmental conditions.
The specific organization of this product allows for efficient data handling and storage.
3-state output enhances flexibility in controlling the flow of data.
Low standby voltage requirement helps conserve power during idle periods.
Wide operating temperature range enables use in extreme cold conditions.
Quality terminal finish ensures good connectivity and reliability over time.
Bottom terminal position facilitates easy mounting and connection in circuit designs.
Low profile design saves space and allows for compact device packaging.
High clock frequency supports fast data processing and operations.
Compact width dimension allows for efficient space utilization on PCBs.
Low minimum supply voltage requirement enhances compatibility with various power sources.
Adequate reflow time for proper soldering and assembly processes.
High peak reflow temperature tolerance ensures durability during manufacturing processes.
Standard length dimension that fits well in most circuit layouts.
Industrial-grade temperature rating ensures reliable operation in harsh environments.
CMOS technology offers low power consumption and high speed performance, making it ideal for modern applications.
Parallel architecture allows for simultaneous data transfer, improving efficiency.
Ball terminal form provides secure connections and facilitates proper soldering.
Moderate supply current requirement for efficient power management.
High word capacity allows for storing large amounts of data efficiently.
With a width of 36, this memory chip is suitable for handling data of various sizes.
Standard terminal pitch for compatibility with common PCB layouts.
Code for word count facilitates easy identification and integration in system designs.
MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures.
High maximum supply voltage tolerance for added safety and reliability.
High memory density accommodates large volumes of data storage requirements.
ZBT SRAM technology offers fast access times and high reliability for critical applications.
Low standby current consumption for energy-efficient operation during idle periods.
Fast access time ensures quick retrieval of data for prompt processing and response.
SRAM 71V3556SA166BGGI8 attributes and parameters. Explore more SRAM devices from Renesas Electronics
Maximum Access Time:
Maximum Clock Frequency (fCLK):
Input/Output Type:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
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Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
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Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
71V3556SA166BGGI8 Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
PCN Design/Specification - All Dev Label Chg 1/Dec/2022 PBGA Substrate 21-May-2022
NC7WZ17P6X
Onsemi
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
LM107H/883C
National Semiconductor
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Allegro MicroSystems
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Ksl Microdevices
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
FDD5614P
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
Db Lectro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
5962-9461110HMA
White Microelectronics
SRAM MODULE; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFP; Package Shape: SQUARE; Memory Density: 16777216 bit;
AS6C1008-55PCN
Alliance Memory
Alliance Memory's AS6C1008-55PCN is a 128Kx8 SRAM with 55ns access time, operating at 3V. It features asynchronous mode, 3-state output, and common I/O type. Ideal for applications requiring fast read/write operations in commercial temperature environments.
7028L20PFGI8
Renesas Electronics
Renesas Electronics' 7028L20PFGI8 is a 64KX16 SRAM with 5V supply voltage, operating in asynchronous mode. It features a flatpack, low profile package style and offers 20ns max access time. Ideal for industrial applications requiring fast and reliable memory storage with common I/O type and 3-STATE output characteristics.
IDT71V547S100PFGI
The Renesas Electronics IDT71V547S100PFGI is a 128Kx36 ZBT SRAM with synchronous operation, 10ns access time, and 3.3V nominal voltage. It is ideal for industrial applications requiring high-speed parallel memory solutions in a compact flatpack package with low profile design.
CY14B101Q2A-SXIT
Infineon Technologies
Infineon's CY14B101Q2A-SXIT is a 128Kx8 non-volatile SRAM with synchronous operation and 3V nominal voltage. It features a small outline package, industrial temperature grade, and serial interface. Ideal for applications requiring reliable memory storage in harsh environments.
IS66WVH8M8BLL-100B1LI
Integrated Silicon Solution
IS66WVH8M8BLL-100B1LI by Integrated Silicon Solution is an 8MX8 SRAM with 100 MHz clock frequency, operating at 3.6V max. It features a thin profile grid array package and is ideal for industrial applications requiring fast access times of 40ns in synchronous mode.
48L512-I/SN
Microchip Technology
48L512-I/SN by Microchip Technology is a 64KX8 SRAM with 66 MHz clock frequency, operating at -40 to 85 °C. It features 3-STATE output characteristics and operates on CMOS technology. Ideal for industrial applications requiring high-speed synchronous memory with common I/O type in a small outline package.
CY62136EV30LL-45ZSXI
Infineon's CY62136EV30LL-45ZSXI is a 128Kx16 SRAM with 3.6V max supply voltage, 45ns access time, and operates in industrial temperature range. It features common I/O type, 44 terminals in small outline package for parallel applications like networking equipment and industrial automation systems.
CY62128ELL-45SXIT
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
IDT71V016SA15PHGI8
Integrated Device Technology
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
23K640-I/SN
23K640-I/SN by Microchip Technology is an 8Kx8 SRAM with a memory density of 65536 bits. Operating at a max clock frequency of 20 MHz, it has a synchronous mode and separate I/O type. Ideal for industrial applications requiring reliable memory storage in compact designs.
5962-8855203YA
Defense Logistics Agency
Defense Logistics Agency's 5962-8855203YA is a MIL-STD-883 compliant SRAM chip with 32KX8 organization, operating at 5V. It features a ceramic, metal-sealed co-fired package in rectangular shape, suitable for military applications. With a memory density of 262144 bit and max access time of 55 ns, it offers reliable performance in harsh environments.
X2004J-25
Xicor
X2004J-25 by Xicor is a 512x8 NMOS SRAM chip with 3-STATE output. Operating at 5V, it has a max access time of 250ns and supports asynchronous mode. Ideal for commercial applications requiring non-volatile memory with parallel organization and output enable feature.
CY7C1051DV33-10ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
CY7C1061G30-10ZSXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 10 ns;
5962-8685923YA
Micron Technology
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T22;
IS61WV51216BLL-10TLI
IS61WV51216BLL-10TLI by Integrated Silicon Solution is a 512Kx16 SRAM with 10ns access time, operating at 3.3V. It features a small outline package, industrial temperature grade, and asynchronous operation. Ideal for applications requiring fast and reliable memory storage in industrial environments.
The Renesas Electronics IDT71V016SA15PHGI8 is a 64KX16 SRAM with 3.3V supply voltage, operating in industrial temperature range. It features asynchronous operation, 15ns access time, and 3-STATE output type. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.
IDT71024S20YGI
The Renesas Electronics IDT71024S20YGI is a 128Kx8 SRAM with asynchronous operation and common I/O type. It operates at 5V, has a max access time of 20ns, and features 3-STATE output characteristics. This small outline package memory IC is suitable for industrial applications requiring fast and reliable data storage.
71V416L10PHG
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3 V;
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71V3576S150PFGI
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: QFF; Package Shape: RECTANGULAR; Technology: CMOS;
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: QFF; Package Shape: RECTANGULAR; Package Equivalence Code: QFP100,.63X.87;
71V3576S150PFGI8
The Renesas Electronics 71V3576S150PFGI8 is a synchronous SRAM with an organization of 128KX36 and a memory density of 4718592 bit. It operates at a max clock frequency of 150 MHz and has a min access time of 3.8 ns. This memory IC type is commonly used in cache applications.
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
71V35761S200PFG
CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Package Equivalence Code: QFP100,.63X.87;
71V35761S183PFGI
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; No. of Words: 131072 words;
71V3556S133PFGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
71V3556SA133BGGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3.135 V;
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Current: 310 mA;
71V3556SA133BQGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Technology: CMOS;
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3.135 V;
71V3556SA166BGGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
71V3556SA166BQGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
71V3557S75PFGI8
ZBT SRAM; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
71V3557S85PFGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Package Style (Meter): FLATPACK, LOW PROFILE;
71V3556SA166BQI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
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