Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Renesas Electronics 71V3556SA166BGGI8 is a 128Kx36 ZBT SRAM with synchronous operation at 166 MHz. It features a common I/O type, operates at 3.3V, and has a memory density of 4718592 bits. Ideal for industrial applications requiring fast access times and high-speed parallel memory functionality.
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This material offers durability and protection for the product, making it a reliable choice.
Allows for easy and convenient installation, saving time and effort during assembly.
This shape is commonly used and fits well in standard circuit designs, ensuring compatibility.
Synchronous operation ensures precise timing and coordination, improving overall performance.
Common input/output type simplifies connectivity and integration with other components.
A common voltage requirement that is easily accessible and widely supported.
Low power consumption at this voltage level helps to minimize energy usage.
Sufficient number of terminals for proper connectivity and functionality.
Grid array package style offers high density and robustness for demanding applications.
High operating temperature range ensures stable performance in various environmental conditions.
The specific organization of this product allows for efficient data handling and storage.
3-state output enhances flexibility in controlling the flow of data.
Low standby voltage requirement helps conserve power during idle periods.
Wide operating temperature range enables use in extreme cold conditions.
Quality terminal finish ensures good connectivity and reliability over time.
Bottom terminal position facilitates easy mounting and connection in circuit designs.
Low profile design saves space and allows for compact device packaging.
High clock frequency supports fast data processing and operations.
Compact width dimension allows for efficient space utilization on PCBs.
Low minimum supply voltage requirement enhances compatibility with various power sources.
Adequate reflow time for proper soldering and assembly processes.
High peak reflow temperature tolerance ensures durability during manufacturing processes.
Standard length dimension that fits well in most circuit layouts.
Industrial-grade temperature rating ensures reliable operation in harsh environments.
CMOS technology offers low power consumption and high speed performance, making it ideal for modern applications.
Parallel architecture allows for simultaneous data transfer, improving efficiency.
Ball terminal form provides secure connections and facilitates proper soldering.
Moderate supply current requirement for efficient power management.
High word capacity allows for storing large amounts of data efficiently.
With a width of 36, this memory chip is suitable for handling data of various sizes.
Standard terminal pitch for compatibility with common PCB layouts.
Code for word count facilitates easy identification and integration in system designs.
MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures.
High maximum supply voltage tolerance for added safety and reliability.
High memory density accommodates large volumes of data storage requirements.
ZBT SRAM technology offers fast access times and high reliability for critical applications.
Low standby current consumption for energy-efficient operation during idle periods.
Fast access time ensures quick retrieval of data for prompt processing and response.
SRAM 71V3556SA166BGGI8 attributes and parameters. Explore more SRAM devices from Renesas Electronics
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71V3556SA166BGGI8 Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
PCN Design/Specification - All Dev Label Chg 1/Dec/2022 PBGA Substrate 21-May-2022
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Hitano Enterprise
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
MMBT2907ALT1G
Onsemi
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
2N2222A
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
LM358AN
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
General Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
Taiwan Semiconductor
261
Deltrol Controls
Other Relays;
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
BAV99
ROHM
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
5962-8866204NA
Renesas Electronics
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 45 ns;
71V3576S150PFGI
Integrated Device Technology
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: QFF; Package Shape: RECTANGULAR; Package Equivalence Code: QFP100,.63X.87;
DS1270Y-70-IND
Dallas Semiconductor
DS1270Y-70-IND by Dallas Semiconductor is a 2MX8 SRAM with 85mA max supply current, 70ns access time, and 5V nominal voltage. Ideal for industrial applications requiring non-volatile memory storage in a compact MICROELECTRONIC ASSEMBLY package.
IDT71016S15PHGI8
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
5962-8685908LA
Defense Logistics Agency
Defense Logistics Agency's 5962-8685908LA SRAM features 16KX4 organization, CMOS technology, and 45 ns max access time. Ideal for military applications with MIL-STD-883 screening level, this memory IC operates asynchronously at temperatures ranging from -55 to 125 °C.
CY62128EV30LL-45ZXI
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
5962-8685910LA
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
71321SA55JG8
Renesas Electronics 71321SA55JG8 is a 2Kx8 MULTI-PORT SRAM with 55ns access time, operating at 5V. It features a 3-STATE output and supports asynchronous mode. Ideal for commercial applications requiring fast memory access and low standby current consumption.
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Screening Level: 38535Q/M;38534H;883B;
AS6C4008-55BIN
Alliance Memory
Alliance Memory's AS6C4008-55BIN is a 512Kx8 SRAM with 55ns access time, operating at 3V. It features a thin profile grid array package and common I/O type. Ideal for industrial applications requiring fast and reliable memory performance.
CY62148GN-45SXI
Infineon Technologies
CY62148GN-45SXI by Infineon Technologies is a 512Kx8 SRAM with 45ns access time, operating at 5V. It features a small outline package, GULL WING terminals, and industrial temperature grade. Ideal for applications requiring fast and reliable parallel memory storage in harsh environments.
CY7C1061G30-10ZXI
Infineon's CY7C1061G30-10ZXI is a 1MX16 SRAM with 10ns access time, operating at 3V. Ideal for industrial applications, it offers parallel operation, 1048576 words capacity, and a compact form factor of 18.4mm x 12mm x 1.2mm.
M48Z12-70PC1
STMicroelectronics
M48Z12-70PC1 by STMicroelectronics is a 2Kx8 SRAM with 3-STATE output, operating at 5V. It features a rectangular package style, asynchronous mode, and common I/O type. Ideal for applications requiring standard SRAM memory technology in commercial temperature grades.
Teledyne E2v (uk)
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
70V3589S133BCI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Minimum Standby Voltage: 3.15 V;
IDT71V3576S150PFGI8
The Renesas Electronics IDT71V3576S150PFGI8 is a 128Kx36 SRAM with synchronous operation at 150 MHz. It features a 3-STATE output and operates at an industrial temperature range of -40 to 85°C. Ideal for applications requiring fast access times and high memory density.
CY7C1071DV33-12BAXIT
CY7C1071DV33-12BAXIT by Infineon Technologies is a 2MX16 SRAM with 3.3V supply, 12ns access time, and 48 terminals. It operates in industrial temperatures and has a thin profile grid array package. Ideal for applications requiring fast parallel memory access in harsh environments.
CY62148EV30LL-45BVXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 36; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 45 ns;
X2004J-25
Xicor
X2004J-25 by Xicor is a 512x8 NMOS SRAM chip with 3-STATE output. Operating at 5V, it has a max access time of 250ns and supports asynchronous mode. Ideal for commercial applications requiring non-volatile memory with parallel organization and output enable feature.
CY62128ELL-45SXIKT
STANDARD SRAM;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: QFF; Package Shape: RECTANGULAR; Technology: CMOS;
71V3576S150PFGI8
The Renesas Electronics 71V3576S150PFGI8 is a synchronous SRAM with an organization of 128KX36 and a memory density of 4718592 bit. It operates at a max clock frequency of 150 MHz and has a min access time of 3.8 ns. This memory IC type is commonly used in cache applications.
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
71V35761S200PFG
CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Package Equivalence Code: QFP100,.63X.87;
71V35761S183PFGI
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; No. of Words: 131072 words;
71V3556S133PFGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
71V3556SA133BGGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3.135 V;
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Current: 310 mA;
71V3556SA133BQGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Technology: CMOS;
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3.135 V;
71V3556SA166BGGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
71V3556SA166BQGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
71V3557S75PFGI8
ZBT SRAM; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
71V3557S85PFGI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Package Style (Meter): FLATPACK, LOW PROFILE;
71V3556SA166BQI8
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
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