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71V3556SA166BGGI8

Renesas Electronics

71V3556SA166BGGI8 by Renesas Electronics

The Renesas Electronics 71V3556SA166BGGI8 is a 128Kx36 ZBT SRAM with synchronous operation at 166 MHz. It features a common I/O type, operates at 3.3V, and has a memory density of 4718592 bits. Ideal for industrial applications requiring fast access times and high-speed parallel memory functionality.

Median Price

$11.296

Lifecycle Status

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3

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< 1k

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Nova Conductors

Japan . 15 parts In-Stock

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Vyrian

USA . 160 parts In-Stock

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50

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Semicontronic

India . 929 parts In-Stock

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$2.000

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$1.950

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$1.940

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929

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AZTECH Wire

Italy . 593 parts In-Stock

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Continental Prestige Electronics

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$11.070

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Ampacity Inc.

Singapore . 1,199 parts In-Stock

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$21.000

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Microchip USA

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$33.010

100+ parts

$32.540

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$32.310

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$32.070

3,491

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$32.540

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$32.070

Component Stockers USA

USA . 670 parts In-Stock

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$174.210

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QUARKTWIN TECHNOLOGY LTD

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Overview

Experience unparalleled speed and reliability with the 71V3556SA166BGGI8 ZBT SRAM by Renesas Electronics. Renowned for its high-quality materials and cutting-edge technology, this synchronous SRAM offers seamless performance in industrial applications. With a maximum clock frequency of 166 MHz and a memory density of 4718592 bits, this memory IC provides customers with exceptional value and efficiency. Trust Renesas Electronics to deliver top-of-the-line solutions for your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the product, making it a reliable choice.

Surface Mount: YES

Allows for easy and convenient installation, saving time and effort during assembly.

Package Shape: RECTANGULAR

This shape is commonly used and fits well in standard circuit designs, ensuring compatibility.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination, improving overall performance.

Input/Output Type: COMMON

Common input/output type simplifies connectivity and integration with other components.

Nominal Supply Voltage / Vsup (V): 3.3

A common voltage requirement that is easily accessible and widely supported.

Power Supplies (V): 3.3

Low power consumption at this voltage level helps to minimize energy usage.

No. of Terminals: 119

Sufficient number of terminals for proper connectivity and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density and robustness for demanding applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures stable performance in various environmental conditions.

Organization: 128KX36

The specific organization of this product allows for efficient data handling and storage.

Output Characteristics: 3-STATE

3-state output enhances flexibility in controlling the flow of data.

Minimum Standby Voltage: 3.14 V

Low standby voltage requirement helps conserve power during idle periods.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables use in extreme cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Quality terminal finish ensures good connectivity and reliability over time.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and connection in circuit designs.

Maximum Seated Height: 2.36 mm

Low profile design saves space and allows for compact device packaging.

Maximum Clock Frequency (fCLK): 166 MHz

High clock frequency supports fast data processing and operations.

Width: 14 mm

Compact width dimension allows for efficient space utilization on PCBs.

Minimum Supply Voltage (Vsup): 3.135 V

Low minimum supply voltage requirement enhances compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate reflow time for proper soldering and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures durability during manufacturing processes.

Length: 22 mm

Standard length dimension that fits well in most circuit layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making it ideal for modern applications.

Parallel or Serial: PARALLEL

Parallel architecture allows for simultaneous data transfer, improving efficiency.

Terminal Form: BALL

Ball terminal form provides secure connections and facilitates proper soldering.

Maximum Supply Current: 360 mA

Moderate supply current requirement for efficient power management.

No. of Words: 131072 words

High word capacity allows for storing large amounts of data efficiently.

Memory Width: 36

With a width of 36, this memory chip is suitable for handling data of various sizes.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

No. of Words Code: 128K

Code for word count facilitates easy identification and integration in system designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures.

Maximum Supply Voltage (Vsup): 3.465 V

High maximum supply voltage tolerance for added safety and reliability.

Memory Density: 4718592 bit

High memory density accommodates large volumes of data storage requirements.

Memory IC Type: ZBT SRAM

ZBT SRAM technology offers fast access times and high reliability for critical applications.

Maximum Standby Current: 0.045 Amp

Low standby current consumption for energy-efficient operation during idle periods.

Maximum Access Time: 3.5 ns

Fast access time ensures quick retrieval of data for prompt processing and response.

Technical Specifications

SRAM 71V3556SA166BGGI8 attributes and parameters. Explore more SRAM devices from Renesas Electronics

Specs

Maximum Access Time:

3.5 ns

Maximum Clock Frequency (fCLK):

166 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B119

JESD-609 Code:

e1

Length:

22 mm

Memory Density:

4718592 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

119

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX36

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA119,7X17,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.36 mm

Maximum Standby Current:

.045 Amp

Minimum Standby Voltage:

3.14 V

Sub-Category:

SRAMs

Maximum Supply Current:

360 mA

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

71V3556SA166BGGI8 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Renesas Electronics

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