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TIL113SM

Onsemi

TIL113SM by Onsemi

The Onsemi TIL113SM is a single optocoupler with a Darlington output, featuring a max forward current of 0.08A and min transfer ratio of 300%. With a max operating temp of 100°C, it's ideal for applications requiring high isolation voltage (4170V) and fast response time (0.000005s) in surface mount configurations.

Median Price

$0.378

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 100 parts In-Stock

1+ parts

$0.378

100+ parts

$0.348

1k+ parts

$0.326

10k+ parts

-

100

$0.378

$0.348

$0.326

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DigiKey

USA . 317 parts In-Stock

1+ parts

$0.780

100+ parts

$0.418

1k+ parts

$0.329

10k+ parts

$0.271

317

$0.780

$0.418

$0.329

$0.271

Mouser Electronics

USA . 2,455 parts In-Stock

1+ parts

$0.810

100+ parts

$0.414

1k+ parts

$0.330

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$0.255

2,455

$0.810

$0.414

$0.330

$0.255

Verical

USA . 99,970 parts In-Stock

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$0.277

99,970

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$0.277

RS (Exports)

UK . 1,550 parts In-Stock

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$0.178

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1,550

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$0.178

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Distributors (In-Stock)

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Digiode

USA . 1,705 parts In-Stock

1+ parts

$0.359

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1,705

$0.359

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Vyrian

USA . 33,048 parts In-Stock

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33,048

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Nova Conductors

Japan . 51 parts In-Stock

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Semicontronic

India . 25,433 parts In-Stock

1+ parts

$0.176

100+ parts

$0.172

1k+ parts

$0.171

10k+ parts

-

25,433

$0.176

$0.172

$0.171

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Ampacity Inc.

Singapore . 25,324 parts In-Stock

1+ parts

$0.176

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25,324

$0.176

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Corohmni

South Africa . 443 parts In-Stock

1+ parts

$0.207

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443

$0.207

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Aztec Data Supply Inc.

USA . 255 parts In-Stock

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$0.313

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255

$0.313

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Corphita

USA . 2,247 parts In-Stock

1+ parts

$0.340

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2,247

$0.340

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.378

100+ parts

$0.348

1k+ parts

$0.326

10k+ parts

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100

$0.378

$0.348

$0.326

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Perfect Parts

USA . 28,538 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,992 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 6,799 parts In-Stock

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6,799

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A-Z Elektronik GmbH

Germany . 5,186 parts In-Stock

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Problanco Electronics

Mexico . 4,865 parts In-Stock

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TANS Electronics

Latvia . 4,337 parts In-Stock

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Argo Parts USA

USA . 1,195 parts In-Stock

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Supply Digital

USA . 1,117 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 725 parts In-Stock

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725

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SupplyDigital Components

Austria . 387 parts In-Stock

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387

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Continental Prestige Electronics

USA . 329 parts In-Stock

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329

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Computer Components Inc. - USA

USA . 100 parts In-Stock

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100

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Overview

Upgrade your electronic designs with the TIL113SM Optocoupler Transistor Output by Onsemi. With a high minimum current transfer ratio of 300% and a maximum isolation voltage of 4170 V, this single configuration optocoupler offers reliable performance in a wide range of applications. From industrial automation to power supply control, this DARLINGTON OUTPUT OPTOCOUPLER is the perfect choice for ensuring safety and precision in your circuits. Trust in Onsemi's reputation for quality and innovation, and experience the value and benefits that the TIL113SM brings to your projects.

Feature Benefit Bullets

Configuration: SINGLE

SINGLE configuration simplifies installation and reduces complexity in circuit design.

Maximum Forward Current: 0.08 A

Capable of handling high forward currents ensures reliable performance in various applications.

Optoelectronic Type: DARLINGTON OUTPUT OPTOCOUPLER

Darlington output offers high current transfer ratio and better amplification, making it suitable for demanding applications.

Maximum Operating Temperature: 100 °C

High maximum operating temperature allows for reliable operation in harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range enables usage in both cold and hot climate conditions.

Terminal Finish: TIN

Tin terminal finish provides good solderability and electrical conductivity.

Maximum Power Dissipation: 0.15 W

Efficient power dissipation ensures proper functioning without overheating.

Minimum Current Transfer Ratio: 300 %

High current transfer ratio indicates efficient signal amplification and transmission.

Maximum Dark Current: 100 nA

Low dark current minimizes leakage and enhances the overall performance of the optocoupler.

Packing Method: TUBE

Tube packaging protects the product during transport and storage, preventing damage.

Maximum Response Time: 0.000005 s

Ultra-fast response time ensures quick signal transmission and reaction to input changes.

Minimum Collector-emitter Breakdown Voltage: 30 V

High breakdown voltage provides protection against voltage spikes and ensures reliable operation.

Maximum Isolation Voltage: 4170 V

High isolation voltage safeguards against electrical interference and enhances system reliability.

Mounting Feature: SURFACE MOUNT

Surface mount configuration offers easy installation and space-saving design.

Maximum Forward Voltage: 1.5 V

Low forward voltage drop minimizes power loss and improves energy efficiency.

Maximum On State Current: 0.15 A

High on-state current capability allows for reliable switching and control of loads.

Technical Specifications

Optocoupler Transistor Outputs TIL113SM attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Minimum Collector-emitter Breakdown Voltage:

30 V

Configuration:

SINGLE

Minimum Current Transfer Ratio:

300 %

Maximum Dark Current:

100 nA

Maximum Forward Current:

.08 A

Maximum Forward Voltage:

1.5 V

Maximum Isolation Voltage:

4170 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.15 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Maximum Power Dissipation:

.15 W

Maximum Response Time:

.000005 s

Sub-Category:

Optocoupler - Transistor Outputs

Terminal Finish:

TIN

Trade Compliance

TIL113SM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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