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STK681-360-E

Onsemi

STK681-360-E by Onsemi

STK681-360-E by Onsemi is a Motion Control IC with 24V nominal voltage, 5.8A max output current, and HYBRID technology. It is used as a BRUSH DC MOTOR CONTROLLER in applications requiring precise motion control. The IC features an IN-LINE package style with 19 terminals in ZIG-ZAG position for compact design and efficient heat dissipation.

Median Price

$12.790

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 10 parts In-Stock

1+ parts

$12.790

100+ parts

$9.580

1k+ parts

$7.250

10k+ parts

$7.000

10

$12.790

$9.580

$7.250

$7.000

Distributors (In-Stock)

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Digiode

USA . 994 parts In-Stock

1+ parts

$12.150

100+ parts

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994

$12.150

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Vyrian

USA . 6,171 parts In-Stock

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6,171

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Chip Stock

USA . 2,680 parts In-Stock

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2,680

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Distributors (Availability)

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AZTECH Wire

Italy . 736 parts In-Stock

1+ parts

$11.030

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736

$11.030

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Corphita

USA . 1,100 parts In-Stock

1+ parts

$11.511

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1,100

$11.511

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Corohmni

South Africa . 250 parts In-Stock

1+ parts

$12.790

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250

$12.790

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Component Stockers USA

USA . 548 parts In-Stock

1+ parts

$99.990

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548

$99.990

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TANS Electronics

Latvia . 7,436 parts In-Stock

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7,436

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Kulean Microsystems

USA . 4,800 parts In-Stock

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4,800

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UHIMA Technologies

Türkiye . 866 parts In-Stock

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866

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Problanco Electronics

Mexico . 473 parts In-Stock

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473

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Microchip USA

USA . 345 parts In-Stock

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345

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SupplyDigital Components

Austria . 303 parts In-Stock

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303

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Perfect Parts

USA . 133 parts In-Stock

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133

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Overview

Unlock the power of precision and efficiency with the STK681-360-E by Onsemi. As a leading manufacturer in Motion Control ICs, Onsemi delivers unparalleled quality and reliability in every product. Designed for brush DC motor control applications, this hybrid IC offers a maximum output current of 5.8 A, ensuring optimal performance in your projects. With a nominal supply voltage of 24 V and a compact rectangular package shape, the STK681-360-E provides exceptional value and benefits to customers seeking seamless motion control solutions. Experience superior technology and versatility with Onsemi's STK681-360-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Nominal Supply Voltage (Vsup): 24 V

The nominal supply voltage of 24 V provides a stable power source for the IC, ensuring consistent performance.

Maximum Output Current: 5.8 A

The high maximum output current of 5.8 A allows the IC to drive motors with sufficient power, making it suitable for a variety of applications.

Technology: HYBRID

The use of hybrid technology in this IC combines the advantages of different technologies, resulting in improved efficiency and performance.

Technical Specifications

Motion Control ICs STK681-360-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

SEATED HT-CALCULATED

Other IC type:

JESD-30 Code:

R-PZIP-T19

JESD-609 Code:

e3

Length:

29.2 mm

No. of Functions:

1

No. of Terminals:

19

Maximum Output Current:

5.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, HEAT SINK/SLUG, SHRINK PITCH

Maximum Seated Height:

18.2 mm

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Width (mm):

4.5 mm

Trade Compliance

STK681-360-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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