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SCH1332

Onsemi

SCH1332 by Onsemi

SCH1332 by Onsemi is a P-CHANNEL FET with 20V DS breakdown voltage, ideal for switching applications. It features a max drain current of 2.5A and 0.095 ohm on-resistance, operating in enhancement mode at up to 150 °C. This small outline transistor with built-in diode is surface mountable and made of silicon material.

Median Price

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Lifecycle Status

Suppliers In-Stock

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1k+

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Digiode

USA . 1,890 parts In-Stock

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Vyrian

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Kepictronics

USA . 34,226 parts In-Stock

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Problanco Electronics

Mexico . 4,864 parts In-Stock

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TANS Electronics

Latvia . 4,836 parts In-Stock

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Kulean Microsystems

USA . 3,829 parts In-Stock

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Corphita

USA . 612 parts In-Stock

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Corohmni

South Africa . 450 parts In-Stock

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SupplyDigital Components

Austria . 103 parts In-Stock

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UHIMA Technologies

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Overview

Unlock the power of efficient switching with the SCH1332 by Onsemi. Crafted with precision using cutting-edge technology, this P-Channel Small Signal Field Effect Transistor offers unparalleled performance in a compact package. Ideal for a range of applications, from battery management to LED lighting, this transistor boasts a built-in diode for added convenience. Experience seamless operation and superior reliability with the SCH1332, designed to exceed your expectations every time. Elevate your projects with Onsemi's commitment to quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the internal components of the transistor, making it reliable for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors offer lower resistance and higher mobility of charge carriers compared to N-channel transistors, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects against reverse voltage, enhancing the overall functionality of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low power dissipation, making it ideal for use in various electronic circuits.

Surface Mount: YES

Surface mount capability allows for easy integration into compact PCB designs, saving space and simplifying assembly processes.

Maximum Drain Current (Abs) (ID): 2.5 A

With a high maximum drain current rating, this transistor can handle higher current loads, accommodating a wide range of applications.

Maximum Power Dissipation (Abs): 1 W

The low power dissipation of 1 W ensures efficient operation and helps prevent overheating, increasing the lifespan of the transistor.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this transistor can withstand elevated temperatures, ensuring reliability in demanding environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) SCH1332 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Maximum Drain-Source On Resistance:

.095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SCH1332 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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