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S2N7002ET7G

Onsemi

S2N7002ET7G by Onsemi

S2N7002ET7G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.26A ID, and 2.5 ohm RDS(ON). Ideal for SWITCHING applications in small outline packages, it operates b/w -55 to 150 °C with Matte Tin finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,770 parts In-Stock

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Digiode

USA . 521 parts In-Stock

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AZTECH Wire

Italy . 124 parts In-Stock

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$12.540

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Component Stockers USA

USA . 368 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 4,180 parts In-Stock

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SupplyDigital Components

Austria . 3,424 parts In-Stock

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Corphita

USA . 1,907 parts In-Stock

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TANS Electronics

Latvia . 954 parts In-Stock

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Problanco Electronics

Mexico . 412 parts In-Stock

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Corohmni

South Africa . 373 parts In-Stock

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UHIMA Technologies

Türkiye . 312 parts In-Stock

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Overview

Enhance your electronic devices with the S2N7002ET7G Small Signal Field Effect Transistor from Onsemi. Known for their top-quality components, Onsemi delivers reliability and performance in every product. Ideal for switching applications, this N-CHANNEL transistor offers a maximum drain current of 0.26A and minimum DS breakdown voltage of 60V. With a package shape of SMALL OUTLINE and terminal finish of Matte Tin, this transistor ensures efficient operation and durability. Upgrade your projects with the trusted brand of Onsemi and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

Enhances the switching performance of the transistor, allowing for efficient control of current flow.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the transistor package.

Transistor Application: SWITCHING

Ideal for applications requiring fast switching speeds and high efficiency.

Surface Mount: YES

Facilitates easy installation on printed circuit boards, saving assembly time and costs.

Minimum DS Breakdown Voltage: 60 V

Provides a high breakdown voltage, ensuring reliable performance in various voltage conditions.

Package Shape: RECTANGULAR

Offers a compact and space-saving design, suitable for small electronic devices.

No. of Terminals: 3

Simplifies connection and integration into circuits, making installation easier.

Operating Mode: ENHANCEMENT MODE

Enables efficient and controlled operation of the transistor, enhancing overall performance.

Maximum Operating Temperature: 150 °C

Provides a wide operating temperature range, making the transistor suitable for various environmental conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Delivers high performance and reliability, ensuring consistent operation in different applications.

Terminal Position: DUAL

Allows for easy and secure connection, ensuring stable performance in different circuit configurations.

Technical Specifications

Small Signal Field Effect Transistors (FET) S2N7002ET7G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

.26 A

Maximum Drain-Source On Resistance:

2.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

S2N7002ET7G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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