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QVA11233

Onsemi

QVA11233 by Onsemi

The Onsemi QVA11233 is a SINGLE Transistor Outputs Slotted Switch with 0.05A Max Forward Current. Featuring 3.18mm Nominal Slot Width and Gap Size, it operates b/w -40 °C to 85°C. Ideal for applications requiring precise optoelectronic sensing in industrial environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

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1k+

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Chip Stock

USA . 80,000 parts In-Stock

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Vyrian

USA . 2,372 parts In-Stock

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Digiode

USA . 1,616 parts In-Stock

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Kepictronics

USA . 7,878 parts In-Stock

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Kulean Microsystems

USA . 7,798 parts In-Stock

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TANS Electronics

Latvia . 6,593 parts In-Stock

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Problanco Electronics

Mexico . 6,114 parts In-Stock

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SupplyDigital Components

Austria . 1,837 parts In-Stock

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Corphita

USA . 919 parts In-Stock

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Corohmni

South Africa . 457 parts In-Stock

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UHIMA Technologies

Türkiye . 251 parts In-Stock

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Overview

Discover the superior quality and reliability of the QVA11233 by Onsemi, a leading manufacturer in the industry. This transistor output slotted switch offers unmatched performance and versatility for a wide range of applications. With a maximum forward current of 0.05 A and a nominal slot width of 3.18 mm, this product is designed to excel in any environment. From industrial automation to security systems, the QVA11233 provides value, efficiency, and peace of mind to customers looking for top-notch optoelectronic solutions. Experience the benefits of Onsemi's expertise and innovation with the QVA11233.

Feature Benefit Bullets

Configuration: SINGLE

Having a single configuration simplifies installation and troubleshooting, making this product user-friendly.

Maximum Forward Current: 0.05 A

The high maximum forward current allows for reliable performance in various applications, ensuring the product can handle demanding tasks.

Optoelectronic Type: TRANSISTOR OUTPUT SLOTTED SWITCH

This type offers a combination of optoelectronic components and switching functionality, making it versatile for different uses.

Output Circuit Type: Transistor

The transistor output circuit type provides stability and precision in signal processing, enhancing the overall performance of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions without compromising its functionality.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product remains operational even in extremely cold environments, making it reliable in various settings.

Maximum Dark Current: 100000 nA

The low maximum dark current minimizes signal interference and ensures accurate readings, making this product suitable for precise applications.

Nominal Slot Width: 3.18 mm

The specific slot width allows for precise positioning and detection, catering to applications that require accuracy and consistency.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature offers secure installation and stability, making it ideal for applications where vibration or movement is a concern.

Gap Size: 3.18 mm

The gap size is standardized, ensuring compatibility with other components and simplifying the integration process, making this product easy to incorporate into existing systems.

Technical Specifications

Transistor Outputs Slotted Switch QVA11233 attributes and parameters. Explore more Transistor Outputs Slotted Switch devices from Onsemi

Specs

Configuration:

SINGLE

Maximum Dark Current:

100000 nA

Maximum Forward Current:

.05 A

Gap Size:

3.18 mm

Mounting Feature:

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Output Circuit Type:

Transistor

Nominal Slot Width:

3.18 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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