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NTY100N10

Onsemi

NTY100N10 by Onsemi

NTY100N10 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, 369A IDM, and 0.01 ohm RDS. Ideal for SWITCHING applications due to its 313W Pdiss, EAS of 500mJ, and ENHANCEMENT MODE operation. Package style is IN-LINE with TIN LEAD finish for THROUGH-HOLE mounting.

Median Price

$8.230

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 24 parts In-Stock

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$8.230

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$7.360

10k+ parts

$6.930

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$8.230

$7.360

$6.930

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Digiode

USA . 991 parts In-Stock

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$9.139

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Vyrian

USA . 3,584 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 36 parts In-Stock

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A&K Electronics

USA . 25 parts In-Stock

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Rotakorn

Sweden . 25 parts In-Stock

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Bristol Electronics

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Prism Electronics

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Corphita

USA . 1,538 parts In-Stock

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$8.658

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$8.658

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Corohmni

South Africa . 50 parts In-Stock

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$9.620

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AZTECH Wire

Italy . 277 parts In-Stock

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$14.020

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Kepictronics

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Problanco Electronics

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SupplyDigital Components

Austria . 4,125 parts In-Stock

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Kulean Microsystems

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TANS Electronics

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UHIMA Technologies

Türkiye . 850 parts In-Stock

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Perfect Parts

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Futuretech Components

Singapore . 503 parts In-Stock

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Overview

Experience the power of reliable performance with the NTY100N10 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-of-the-line Power Field Effect Transistors for various applications. With its N-CHANNEL polarity and SINGLE configuration with a built-in diode, this transistor is perfect for SWITCHING tasks. Offering a minimum DS Breakdown Voltage of 100V and a Maximum Drain Current of 123A, this product ensures efficiency and durability. Trust Onsemi to provide quality products that deliver exceptional value and benefits to meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation properties, helping to protect the transistor from external factors such as moisture and dust.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistances and higher mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and helps to protect the transistor from reverse voltage spikes, increasing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high currents and fast switching speeds effectively.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100 V, this FET can handle high voltage applications with ease.

Maximum Pulsed Drain Current (IDM): 369 A

The high pulsed drain current rating allows this FET to handle sudden spikes in current effectively, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 313 W

The high power dissipation rating ensures that the FET can handle high power applications without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good temperature stability and low leakage current, making this FET reliable in various operating conditions.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperature environments without compromising performance.

Maximum Drain-Source On Resistance: 0.01 ohm

The low ON resistance of 0.01 ohm ensures minimal power loss and efficient operation in switching circuits.

Technical Specifications

Power Field Effect Transistors (FET) NTY100N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

500 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

123 A

Maximum Drain Current (ID):

123 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-264AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

369 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTY100N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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