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NTY100N10TBD

Onsemi

NTY100N10TBD by Onsemi

The Onsemi NTY100N10TBD is a N-CHANNEL FET with 100V DS Breakdown Voltage and 123A ID. Ideal for SWITCHING applications, it features a built-in diode, 0.01 ohm RDS(on), and can handle up to 369A IDM. Suitable for high-power circuits requiring efficient switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,149 parts In-Stock

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Vyrian

USA . 790 parts In-Stock

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Problanco Electronics

Mexico . 5,685 parts In-Stock

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TANS Electronics

Latvia . 4,128 parts In-Stock

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SupplyDigital Components

Austria . 3,968 parts In-Stock

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Kulean Microsystems

USA . 1,792 parts In-Stock

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Corphita

USA . 1,144 parts In-Stock

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UHIMA Technologies

Türkiye . 666 parts In-Stock

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Corohmni

South Africa . 231 parts In-Stock

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Overview

Experience the unparalleled performance and reliability of the Onsemi NTY100N10TBD Power Field Effect Transistor. Crafted by a trusted manufacturer, this N-CHANNEL transistor with a built-in diode is perfect for various switching applications. With a high DS breakdown voltage of 100V and a maximum pulsed drain current of 369A, this transistor ensures optimal efficiency and durability. Say goodbye to power interruptions and hello to seamless operation with the NTY100N10TBD. Trust in the quality of Onsemi and revolutionize your power systems today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation, making the product suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching capabilities, making it ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design by integrating a diode, saving space and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in controlling power flow.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, the product can handle high voltage levels, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into various electronic systems.

Terminal Form: THROUGH-HOLE

Enables easy soldering onto PCBs, providing a secure and stable connection.

Operating Mode: ENHANCEMENT MODE

Offers enhanced control over the transistor's conductivity, allowing for efficient power management.

Maximum Pulsed Drain Current (IDM): 369 A

Can handle high pulse currents, making it suitable for applications requiring brief periods of high power.

Avalanche Energy Rating (EAS): 500 mJ

Provides protection against high-energy spikes, ensuring reliability in demanding environments.

No. of Terminals: 3

Simplifies the connection process and reduces the likelihood of errors during installation.

Package Style (Meter): IN-LINE

Facilitates convenient mounting and alignment within electronic systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Delivers high performance and efficiency in power management applications.

Maximum Operating Temperature: 150 °C

Capable of withstanding high temperatures, ensuring stable performance in challenging environments.

Transistor Element Material: SILICON

Silicon-based construction offers reliability and efficiency in power switching applications.

Terminal Finish: TIN LEAD

Provides a stable and low-resistance connection, ensuring reliable performance over time.

Maximum Drain Current (ID): 123 A

Capable of handling high continuous currents, making it suitable for power distribution applications.

Maximum Drain-Source On Resistance: 0.01 ohm

Low on-resistance ensures efficient power flow and minimal power loss during operation.

Terminal Position: SINGLE

Simplifies the installation process and ensures a clear and organized connection setup.

Technical Specifications

Power Field Effect Transistors (FET) NTY100N10TBD attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

500 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

123 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-264AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

369 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTY100N10TBD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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