Loading...

NTMFS4C01NT1G

Onsemi

NTMFS4C01NT1G by Onsemi

NTMFS4C01NT1G by Onsemi is a N-CHANNEL FET with 303A max drain current and 3.2W power dissipation. Ideal for high-power applications, it operates at up to 150 °C and features METAL-OXIDE SEMICONDUCTOR technology for efficient performance in surface mount configurations.

Median Price

$3.220

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,134 parts In-Stock

1+ parts

$3.220

100+ parts

$3.020

1k+ parts

$2.730

10k+ parts

-

4,134

$3.220

$3.020

$2.730

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 68 parts In-Stock

1+ parts

$2.907

100+ parts

-

1k+ parts

-

10k+ parts

-

68

$2.907

-

-

-

Vyrian

USA . 7,444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,444

-

-

-

-

Prism Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 307 parts In-Stock

1+ parts

$2.754

100+ parts

-

1k+ parts

-

10k+ parts

-

307

$2.754

-

-

-

Corohmni

South Africa . 277 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

-

10k+ parts

-

277

$3.060

-

-

-

AZTECH Wire

Italy . 618 parts In-Stock

1+ parts

$15.240

100+ parts

-

1k+ parts

-

10k+ parts

-

618

$15.240

-

-

-

RC Electronics

USA . 16,467 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,467

-

-

-

-

Problanco Electronics

Mexico . 8,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,174

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,457

-

-

-

-

TANS Electronics

Latvia . 6,623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,623

-

-

-

-

SupplyDigital Components

Austria . 6,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,020

-

-

-

-

Kulean Microsystems

USA . 4,997 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,997

-

-

-

-

Perfect Parts

USA . 4,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,456

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

UHIMA Technologies

Türkiye . 632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

632

-

-

-

-

Kepictronics

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Overview

Unleash the power of innovation with the NTMFS4C01NT1G by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product. This Power Field Effect Transistor (FET) offers exceptional performance and efficiency, making it perfect for a wide range of applications. From automotive to industrial settings, this N-CHANNEL FET is a game-changer. Experience the value and benefits of superior technology with the NTMFS4C01NT1G - unleash your potential today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high switching speeds and low on-state resistance, making them ideal for power applications.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces component count, making the product more cost-effective and reliable.

Surface Mount: YES

Surface mount technology allows for compact and space-saving circuit designs, making the product suitable for smaller electronic devices.

Maximum Drain Current (Abs) (ID): 303 A

With a high maximum drain current capacity, this FET can handle large power loads without overheating, ensuring reliable performance.

Maximum Power Dissipation (Abs): 3.2 W

The low maximum power dissipation helps in reducing heat generation and improves efficiency of the device.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high efficiency and low gate capacitance, allowing for fast switching speeds and enhanced performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature tolerance ensures stable and reliable operation even in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and ensures a secure electrical connection, improving the overall durability of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature ensures quick and efficient soldering, reducing manufacturing time and costs.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the FET can withstand the soldering process without any damage, ensuring a reliable assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4C01NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

303 A

Maximum Drain Current (ID):

303 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS4C01NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20