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NTLUS4195PZTBG

Onsemi

NTLUS4195PZTBG by Onsemi

NTLUS4195PZTBG by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage and 17A IDM. Ideal for SWITCHING applications, it features 0.09 ohm RDS(ON) and operates in ENHANCEMENT MODE. This SMALL OUTLINE transistor has SILICON element material and TIN terminal finish.

Median Price

$0.267

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

21,000

-

$0.277

$0.230

$0.205

Verical

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.257

21,000

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-

-

$0.257

Distributors (In-Stock)

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Digiode

USA . 2,199 parts In-Stock

1+ parts

$0.217

100+ parts

-

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2,199

$0.217

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Vyrian

USA . 4,430 parts In-Stock

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4,430

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Distributors (Availability)

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Corphita

USA . 2,443 parts In-Stock

1+ parts

$0.205

100+ parts

-

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2,443

$0.205

-

-

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Corohmni

South Africa . 414 parts In-Stock

1+ parts

$0.228

100+ parts

-

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414

$0.228

-

-

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AZTECH Wire

Italy . 494 parts In-Stock

1+ parts

$12.780

100+ parts

-

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494

$12.780

-

-

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Continental Prestige Electronics

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.209

10k+ parts

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21,000

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-

$0.209

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TANS Electronics

Latvia . 5,061 parts In-Stock

1+ parts

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5,061

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Problanco Electronics

Mexico . 2,504 parts In-Stock

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2,504

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Kulean Microsystems

USA . 537 parts In-Stock

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537

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SupplyDigital Components

Austria . 382 parts In-Stock

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382

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UHIMA Technologies

Türkiye . 290 parts In-Stock

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290

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Overview

Discover the power of the NTLUS4195PZTBG by Onsemi, a top-quality P-CHANNEL Power Field Effect Transistor with a built-in diode. Ideal for switching applications, this transistor boasts a maximum pulsed drain current of 17A and a minimum DS breakdown voltage of 30V. With its small outline package and surface-mount capability, this transistor is perfect for compact designs. Trust in Onsemi's reputation for reliability and innovation to bring you the best in semiconductor technology. Upgrade your electronics with the NTLUS4195PZTBG and experience enhanced performance and efficiency like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability, ensuring that the FET can withstand various environmental conditions and handling.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high input impedance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better control and protection against back EMF or reverse voltage, enhancing the reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching speeds and efficient operation in various electronic circuits.

Surface Mount: YES

Being surface mountable makes installation easier and more space-efficient, perfect for compact electronic devices.

Minimum DS Breakdown Voltage: 30 V

The minimum breakdown voltage of 30V ensures that the FET can handle high voltage applications without the risk of damage.

Package Shape: SQUARE

The square package shape allows for easy mounting and integration into circuit layouts, maximizing space efficiency.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, providing good performance and stability in various operating conditions.

Maximum Drain Current (ID): 2 A

With a maximum drain current of 2A, this FET can handle moderate to high current loads in a circuit, providing flexibility in design.

Technical Specifications

Power Field Effect Transistors (FET) NTLUS4195PZTBG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

17 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLUS4195PZTBG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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