Loading...

NTLUS4195PZTAG

Onsemi

NTLUS4195PZTAG by Onsemi

NTLUS4195PZTAG by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a max IDM of 17A and ID of 2A, this MOSFET has 0.09 ohm RDS(ON) for efficient operation. Its small outline package makes it suitable for surface mount designs.

Median Price

$0.257

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

45,000

-

$0.277

$0.230

$0.205

DigiKey

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.240

45,000

-

-

-

$0.240

Verical

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.257

45,000

-

-

-

$0.257

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,561 parts In-Stock

1+ parts

$0.217

100+ parts

-

1k+ parts

-

10k+ parts

-

1,561

$0.217

-

-

-

Vyrian

USA . 1,652 parts In-Stock

1+ parts

$0.228

100+ parts

-

1k+ parts

-

10k+ parts

-

1,652

$0.228

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 44,679 parts In-Stock

1+ parts

$0.194

100+ parts

-

1k+ parts

-

10k+ parts

-

44,679

$0.194

-

-

-

Corphita

USA . 1,594 parts In-Stock

1+ parts

$0.205

100+ parts

-

1k+ parts

-

10k+ parts

-

1,594

$0.205

-

-

-

Corohmni

South Africa . 105 parts In-Stock

1+ parts

$0.228

100+ parts

-

1k+ parts

-

10k+ parts

-

105

$0.228

-

-

-

Component Stockers USA

USA . 27,160 parts In-Stock

1+ parts

$0.240

100+ parts

$0.220

1k+ parts

$0.200

10k+ parts

$0.200

27,160

$0.240

$0.220

$0.200

$0.200

Continental Prestige Electronics

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.209

10k+ parts

-

45,000

-

-

$0.209

-

Kulean Microsystems

USA . 2,977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,977

-

-

-

-

Problanco Electronics

Mexico . 2,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,003

-

-

-

-

SupplyDigital Components

Austria . 1,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,520

-

-

-

-

TANS Electronics

Latvia . 1,008 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,008

-

-

-

-

UHIMA Technologies

Türkiye . 62 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

62

-

-

-

-

Overview

Elevate your power management needs with the NTLUS4195PZTAG by Onsemi. Crafted with precision and expertise, this P-Channel Power FET offers unparalleled performance in switching applications. With a single configuration and built-in diode, this transistor delivers seamless operation and efficiency. Experience the benefits of enhanced mode operation, high pulsed drain current, and low on-resistance for optimal power handling. Trust in Onsemi's reputation for quality and reliability, making the NTLUS4195PZTAG the perfect choice for your power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high efficiency and low power consumption, making them suitable for battery-operated devices or other applications where power efficiency is key.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protects the circuit against back EMF, making the product reliable and easy to use in various applications.

Transistor Application: SWITCHING

Being specifically designed for switching applications, this FET offers fast switching speed and low losses, making it a great choice for applications requiring rapid on/off cycles.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and improving overall product reliability.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage of 30V ensures the FET can handle a wide range of voltages, making it versatile and reliable in various operating conditions.

Maximum Pulsed Drain Current (IDM): 17 A

The high pulsed drain current rating of 17A allows for handling high current spikes or surges, making the FET suitable for demanding applications.

Maximum Drain Current (ID): 2 A

With a maximum drain current of 2A, this FET is suitable for low to medium power applications where moderate current handling is required.

Maximum Drain-Source On Resistance: 0.09 ohm

The low drain-source on resistance of 0.09 ohm results in minimal power loss and heat dissipation, contributing to high efficiency and performance of the FET.

Technical Specifications

Power Field Effect Transistors (FET) NTLUS4195PZTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

17 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLUS4195PZTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 4