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NTLUD4C26NTAG

Onsemi

NTLUD4C26NTAG by Onsemi

NTLUD4C26NTAG by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features 2 ELEMENTS in a SQUARE package with 30V DS Breakdown Voltage and 22A IDM. Ideal for high-power switching circuits requiring fast operation and low on-resistance.

Median Price

$0.818

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,494 parts In-Stock

1+ parts

-

100+ parts

$0.326

1k+ parts

$0.270

10k+ parts

$0.241

5,494

-

$0.326

$0.270

$0.241

DigiKey

USA . 4,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.310

10k+ parts

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4,356

-

-

$1.310

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Flip Electronics (Authorized)

USA . 3,956 parts In-Stock

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-

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3,956

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Distributors (In-Stock)

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Digiode

USA . 386 parts In-Stock

1+ parts

$0.254

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-

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386

$0.254

-

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Vyrian

USA . 2,072 parts In-Stock

1+ parts

$1.310

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-

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2,072

$1.310

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LIBRA Elektronik GmbH

Germany . 111,432 parts In-Stock

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111,432

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Chip Stock

USA . 38,050 parts In-Stock

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38,050

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HZD GmbH

Germany . 4,000 parts In-Stock

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4,000

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Flip Electronics

USA . 2,756 parts In-Stock

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2,756

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Distributors (Availability)

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Corphita

USA . 93 parts In-Stock

1+ parts

$0.240

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-

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93

$0.240

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Corohmni

South Africa . 191 parts In-Stock

1+ parts

$1.310

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191

$1.310

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Futuretech Components

Singapore . 70,000 parts In-Stock

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70,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 8,233 parts In-Stock

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8,233

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TANS Electronics

Latvia . 7,875 parts In-Stock

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7,875

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Problanco Electronics

Mexico . 6,303 parts In-Stock

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6,303

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SupplyDigital Components

Austria . 5,810 parts In-Stock

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5,810

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Perfect Parts

USA . 3,293 parts In-Stock

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3,293

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UHIMA Technologies

Türkiye . 112 parts In-Stock

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112

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Overview

Discover the power and efficiency of the NTLUD4C26NTAG Power FET by Onsemi. With a focus on quality and reliability, Onsemi is a trusted manufacturer in the industry. This N-CHANNEL transistor provides seamless switching applications with its separate, 2-element configuration and built-in diode. Ideal for a wide range of uses, this compact transistor offers customers value and performance like never before. Upgrade your electronic projects with the NTLUD4C26NTAG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-resistance and higher current-carrying capacity compared to P-channel FETs, making them suitable for various high-performance applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Allows for efficient power management and design flexibility in circuits requiring multiple channels with the added benefit of a built-in diode for protection.

Transistor Application: SWITCHING

Optimized for switching applications, providing fast switching speeds, low power loss, and high efficiency in power management.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Pulsed Drain Current (IDM): 22 A

Capable of handling high current pulses, making it suitable for applications with transient power demands.

Maximum Power Dissipation (Abs): 1.7 W

Can dissipate heat effectively, ensuring stable operation and preventing overheating issues.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without compromising performance, suitable for industrial applications.

Maximum Drain-Source On Resistance: 0.021 ohm

Low ON-resistance results in reduced power losses and improved efficiency in power conversion.

Technical Specifications

Power Field Effect Transistors (FET) NTLUD4C26NTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

4.8 A

Maximum Drain-Source On Resistance:

.021 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

27 pF

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLUD4C26NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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