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NTL4502NT1

Onsemi

NTL4502NT1 by Onsemi

NTL4502NT1 by Onsemi is a N-CHANNEL FET with 4 separate elements, built-in diode, and 24V DS breakdown voltage. Ideal for switching applications, it has a max pulsed drain current of 32A and 0.013 ohm max drain-source resistance. Operating in enhancement mode, it features a peak reflow temp of 235 °C and can handle up to 11.4A drain current.

Median Price

$1.738

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 912 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.390

10k+ parts

$1.310

912

-

$1.560

$1.390

$1.310

DigiKey

USA . 912 parts In-Stock

1+ parts

-

100+ parts

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$2.050

10k+ parts

-

912

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-

$2.050

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Verical

USA . 912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.738

10k+ parts

$1.637

912

-

-

$1.738

$1.637

Distributors (In-Stock)

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Digiode

USA . 283 parts In-Stock

1+ parts

$1.644

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283

$1.644

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Vyrian

USA . 5,052 parts In-Stock

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5,052

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Inventory MP

USA . 1,925 parts In-Stock

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1,925

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Bristol Electronics

USA . 1,925 parts In-Stock

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1,925

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Distributors (Availability)

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Corphita

USA . 73 parts In-Stock

1+ parts

$1.557

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73

$1.557

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Corohmni

South Africa . 191 parts In-Stock

1+ parts

$1.730

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191

$1.730

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AZTECH Wire

Italy . 1,216 parts In-Stock

1+ parts

$21.390

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1,216

$21.390

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SupplyDigital Components

Austria . 8,339 parts In-Stock

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TANS Electronics

Latvia . 6,211 parts In-Stock

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Problanco Electronics

Mexico . 5,128 parts In-Stock

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Kulean Microsystems

USA . 2,985 parts In-Stock

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2,985

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Continental Prestige Electronics

USA . 912 parts In-Stock

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$1.590

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912

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$1.590

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UHIMA Technologies

Türkiye . 412 parts In-Stock

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412

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Overview

Enhance the performance of your power switching applications with the NTL4502NT1 by Onsemi. Manufactured with top-notch quality, this N-channel power FET offers 4 separate elements with built-in diode, making it a reliable choice for various switching tasks. Its square package shape and no-lead terminal form ensure easy installation, while its enhancement mode operation guarantees efficient functionality. With a maximum pulsed drain current of 32A and a low on-resistance of 0.013 ohm, this chip carrier-style transistor provides exceptional value and benefits to customers looking for high-performance components. Choose the NTL4502NT1 for superior power management solutions.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching speeds, making this product a good choice for applications requiring high performance.

Minimum DS Breakdown Voltage: 24 V

With a minimum breakdown voltage of 24 V, this FET can handle higher voltages, providing reliability and safety in various circuit applications.

Maximum Pulsed Drain Current (IDM): 32 A

The high maximum pulsed drain current allows this FET to handle peak loads effectively, making it suitable for applications where high transient currents are present.

Avalanche Energy Rating (EAS): 80 mJ

The high avalanche energy rating of 80 mJ ensures that this FET can withstand energy spikes during switching, making it a durable and robust component in demanding environments.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can operate effectively in high-temperature environments, ensuring reliability and performance under tough conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTL4502NT1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (ID):

11.4 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

No. of Elements:

4

No. of Terminals:

16

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

32 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTL4502NT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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