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NTGS3433T1

Onsemi

NTGS3433T1 by Onsemi

The Onsemi NTGS3433T1 is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 20A and 0.075 ohm RDS(ON), operating in ENHANCEMENT MODE. With a small outline package style and GULL WING terminals, it offers fast switching speeds for efficient power management.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50,930 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

50,930

-

$0.119

$0.099

$0.088

DigiKey

USA . 50,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.100

50,930

-

-

-

$0.100

Verical

USA . 50,930 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.110

50,930

-

-

-

$0.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 255 parts In-Stock

1+ parts

$0.078

100+ parts

-

1k+ parts

-

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255

$0.078

-

-

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Digiode

USA . 2,339 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

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2,339

$0.093

-

-

-

Cyclops Electronics Ltd

UK . 204 parts In-Stock

1+ parts

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204

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 135 parts In-Stock

1+ parts

$0.078

100+ parts

-

1k+ parts

-

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135

$0.078

-

-

-

Corphita

USA . 562 parts In-Stock

1+ parts

$0.088

100+ parts

-

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-

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562

$0.088

-

-

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Continental Prestige Electronics

USA . 50,930 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.078

10k+ parts

-

50,930

-

-

$0.078

-

Problanco Electronics

Mexico . 5,433 parts In-Stock

1+ parts

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5,433

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A-Z Elektronik GmbH

Germany . 4,788 parts In-Stock

1+ parts

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4,788

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TANS Electronics

Latvia . 2,871 parts In-Stock

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2,871

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Kulean Microsystems

USA . 1,478 parts In-Stock

1+ parts

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1,478

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SupplyDigital Components

Austria . 1,192 parts In-Stock

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1,192

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Kepictronics

USA . 204 parts In-Stock

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204

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UHIMA Technologies

Türkiye . 37 parts In-Stock

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37

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Overview

Enhance your electronic projects with the NTGS3433T1 by Onsemi, a high-quality P-Channel Power FET with a built-in diode for efficient switching applications. Manufactured by Onsemi, known for their reliable components, this transistor offers a maximum pulsed drain current of 20A and a low on-resistance of 0.075 ohm, ensuring optimal performance. Ideal for various applications, this transistor is versatile and practical. Upgrade your projects today with the NTGS3433T1 and experience the benefits of superior quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high current-carrying capability, making this product efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current flow protection, adding an extra layer of reliability to the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching speeds and efficient operation.

Surface Mount: YES

Being surface-mountable makes it easy to integrate this FET into compact electronic designs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 12 V

The 12V breakdown voltage ensures that the FET can handle high voltages without breakdown, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and mounting of the FET on circuit boards, enhancing ease of use.

Terminal Form: GULL WING

The gull-wing terminal form simplifies soldering and provides a secure connection, aiding in the reliability of the overall circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are known for their ease of control and high switching speeds, making this product ideal for various applications.

Maximum Pulsed Drain Current (IDM): 20 A

With a high pulsed drain current rating of 20A, this FET can handle high current loads without overheating, making it reliable for demanding applications.

Maximum Drain Current (Abs) (ID): 1.65 A

The 1.65A maximum drain current ensures stable operation under normal conditions, making this FET suitable for a wide range of applications.

No. of Terminals: 6

Having 6 terminals allows for versatile connections and configurations, adding flexibility to the use of this FET in different circuit designs.

Maximum Power Dissipation (Abs): 1 W

With a maximum power dissipation of 1W, this FET can handle moderate power levels effectively without overheating, ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enhances the overall compactness of the electronic design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency, making this FET a reliable choice for various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high-temperature environments, ensuring stable operation under varying conditions.

Transistor Element Material: SILICON

Silicon is a widely used material for transistors due to its reliability and performance, making this FET a durable and efficient choice.

Maximum Turn On Time (ton): 60 ns

The fast turn-on time of 60ns ensures quick response and efficient switching performance, making this FET suitable for high-speed applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this FET can operate in cold environments without compromising performance, adding versatility to its use.

Maximum Turn Off Time (toff): 235 ns

The 235ns turn-off time ensures fast switching speeds, reducing the switching loss and improving efficiency in various applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and ensures a reliable electrical connection, enhancing the overall performance and lifespan of the FET.

Maximum Drain Current (ID): 2.35 A

With a maximum drain current of 2.35A, this FET can handle high current loads effectively, making it suitable for power-intensive applications.

Maximum Drain-Source On Resistance: 0.075 ohm

The low drain-source on resistance of 0.075 ohm minimizes power loss and improves efficiency in switching applications, making this FET a reliable choice.

Terminal Position: DUAL

Having dual terminal positions allows for versatile installation and connection options, adding flexibility to the use of this FET in different circuit layouts.

Maximum Feedback Capacitance (Crss): 200 pF

The feedback capacitance of 200pF helps in reducing signal distortion and improving overall circuit performance, making this FET ideal for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NTGS3433T1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

1.65 A

Maximum Drain Current (ID):

2.35 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

200 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

235 ns

Maximum Turn On Time (ton):

60 ns

Trade Compliance

NTGS3433T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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