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NTGS3433T1G

Onsemi

NTGS3433T1G by Onsemi

NTGS3433T1G by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A IDM and 0.075 ohm RDS(ON), operating in ENHANCEMENT MODE with -55 to 150 °C temperature range. Suitable for surface mount design, it has a small outline package style and built-in diode configuration.

Median Price

$0.265

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 163,782 parts In-Stock

1+ parts

-

100+ parts

$0.286

1k+ parts

$0.238

10k+ parts

$0.212

163,782

-

$0.286

$0.238

$0.212

Verical

USA . 161,900 parts In-Stock

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$0.265

161,900

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$0.265

DigiKey

USA . 159,000 parts In-Stock

1+ parts

-

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$0.240

159,000

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$0.240

Distributors (In-Stock)

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Digiode

USA . 826 parts In-Stock

1+ parts

$0.223

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-

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826

$0.223

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Vyrian

USA . 2,307 parts In-Stock

1+ parts

$0.235

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2,307

$0.235

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ComSIT Distribution GmbH

Germany . 1,905 parts In-Stock

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1,905

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Distributors (Availability)

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Corphita

USA . 2,227 parts In-Stock

1+ parts

$0.212

100+ parts

-

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2,227

$0.212

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Corohmni

South Africa . 360 parts In-Stock

1+ parts

$0.235

100+ parts

-

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360

$0.235

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Component Stockers USA

USA . 151,367 parts In-Stock

1+ parts

$0.240

100+ parts

$0.230

1k+ parts

$0.210

10k+ parts

$0.210

151,367

$0.240

$0.230

$0.210

$0.210

Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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90,000

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Perfect Parts

USA . 53,088 parts In-Stock

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53,088

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Kepictronics

USA . 39,815 parts In-Stock

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39,815

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QUARKTWIN TECHNOLOGY LTD

USA . 15,288 parts In-Stock

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15,288

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TANS Electronics

Latvia . 6,370 parts In-Stock

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6,370

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Problanco Electronics

Mexico . 4,269 parts In-Stock

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4,269

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Kulean Microsystems

USA . 4,125 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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2,700

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Assy Fe

Spain . 2,058 parts In-Stock

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2,058

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SupplyDigital Components

Austria . 1,241 parts In-Stock

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1,241

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UHIMA Technologies

Türkiye . 486 parts In-Stock

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486

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Overview

Experience the power of innovation with the NTGS3433T1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Power Field Effect Transistors (FET) like no other. With its P-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Its high-quality design ensures reliable performance while its compact package style makes it easy to integrate into your projects. Trust Onsemi to provide you with the value, benefits, and advantages you need to take your creations to the next level. Elevate your designs with the NTGS3433T1G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability for the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high current capabilities, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching operations and protects the circuit from reverse voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid switching frequencies with ease.

Surface Mount: YES

The surface mount capability makes it easy to integrate this FET into compact electronic designs.

Minimum DS Breakdown Voltage: 12 V

With a minimum breakdown voltage of 12V, this FET can withstand higher voltages without failing.

Maximum Pulsed Drain Current (IDM): 20 A

The high pulsed drain current rating of 20A allows this FET to handle peak current demands efficiently.

Maximum Drain Current (Abs) (ID): 1.65 A

The maximum continuous drain current of 1.65A ensures reliable performance under normal operating conditions.

Maximum Power Dissipation (Abs): 1 W

With a maximum power dissipation of 1W, this FET can handle moderate power loads effectively.

Maximum Drain Current (ID): 2.35 A

The higher maximum drain current rating of 2.35A allows for increased power handling capabilities.

Maximum Drain-Source On Resistance: 0.075 ohm

The low drain-source on resistance of 0.075 ohms minimizes power loss and improves efficiency.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures stable performance even in extreme conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTGS3433T1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

1.65 A

Maximum Drain Current (ID):

2.35 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

200 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

235 ns

Maximum Turn On Time (ton):

60 ns

Trade Compliance

NTGS3433T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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