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NTD4860N-1G

Onsemi

NTD4860N-1G by Onsemi

NTD4860N-1G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 25V DS Breakdown Voltage, 130A IDM, and 0.0111 ohm RDS(on). With an EAS of 84.5 mJ and operating up to 175 °C, it is ideal for high-power switching circuits.

Median Price

$0.256

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,475 parts In-Stock

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-

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$0.251

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$0.208

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$0.186

8,475

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$0.251

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$0.186

Verical

USA . 8,475 parts In-Stock

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$0.260

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$0.260

Distributors (In-Stock)

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Digiode

USA . 1,610 parts In-Stock

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$0.196

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$0.196

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Vyrian

USA . 7,428 parts In-Stock

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Corphita

USA . 1,453 parts In-Stock

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$0.185

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Corohmni

South Africa . 57 parts In-Stock

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$0.206

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57

$0.206

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$1.842

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$1.676

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$1.510

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-

2,500

$1.842

$1.676

$1.510

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AZTECH Wire

Italy . 527 parts In-Stock

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$10.310

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527

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Continental Prestige Electronics

USA . 8,475 parts In-Stock

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$0.189

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8,475

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TANS Electronics

Latvia . 7,770 parts In-Stock

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Problanco Electronics

Mexico . 7,568 parts In-Stock

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SupplyDigital Components

Austria . 7,328 parts In-Stock

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Kepictronics

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Kulean Microsystems

USA . 2,164 parts In-Stock

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UHIMA Technologies

Türkiye . 764 parts In-Stock

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Overview

Unlock the power of efficient switching with the NTD4860N-1G by Onsemi. Crafted with precision and expertise, this N-channel power field effect transistor offers reliable performance in various applications. Experience enhanced functionality and seamless operation with its built-in diode configuration. With a maximum pulsing drain current of 130A and a minimum breakdown voltage of 25V, this transistor is designed to deliver optimal results. Trust Onsemi's reputation for quality and innovation, and elevate your projects to new levels of success with the NTD4860N-1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, ensuring durability and reliability in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower ON resistance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for the efficient management of reverse current flow and provides added protection to the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and can be easily controlled, making them suitable for switching applications.

Maximum Power Dissipation (Abs): 50 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliable performance.

Maximum Operating Temperature: 175 °C

The high operating temperature allows this FET to be used in demanding applications and environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NTD4860N-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

84.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

10.4 A

Maximum Drain-Source On Resistance:

.0111 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

130 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4860N-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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