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NLV74HCT74ADG

Onsemi

NLV74HCT74ADG by Onsemi

NLV74HCT74ADG by Onsemi is a dual-function latch & flip-flop with 36ns propagation delay. Operating b/w -55 to 125 °C, it has a supply voltage range of 4.5-5.5V and is ideal for military-grade applications requiring positive edge triggering in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,355 parts In-Stock

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Digiode

USA . 1,143 parts In-Stock

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AZTECH Wire

Italy . 1,132 parts In-Stock

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TANS Electronics

Latvia . 7,412 parts In-Stock

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Kulean Microsystems

USA . 6,232 parts In-Stock

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SupplyDigital Components

Austria . 4,939 parts In-Stock

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Problanco Electronics

Mexico . 2,921 parts In-Stock

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Corphita

USA . 1,765 parts In-Stock

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Vigor

Singapore . 668 parts In-Stock

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Corohmni

South Africa . 427 parts In-Stock

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UHIMA Technologies

Türkiye . 194 parts In-Stock

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Microchip USA

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Overview

Experience the seamless functionality and reliability of the NLV74HCT74ADG latches & flip-flops by Onsemi. With a reputation for top-notch quality and cutting-edge technology, Onsemi delivers products that surpass industry standards. Ideal for various applications, this product offers customers unparalleled value with its efficient performance and innovative design. Trust in Onsemi to provide you with the best solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Provides multiple functions in a single component, increasing functionality and versatility for various applications.

Nominal Supply Voltage: 5V

Works efficiently at standard voltage levels, ensuring compatibility with most electronic systems.

Trigger Type: POSITIVE EDGE

Allows for precise timing and control of the latch or flip-flop operation, enhancing the performance of the product.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in demanding industrial or military environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ensuring efficient operation and reliability.

Technical Specifications

Latches & Flip-Flops NLV74HCT74ADG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

36 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV74HCT74ADG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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