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NLV74HC174ADG

Onsemi

NLV74HC174ADG by Onsemi

NLV74HC174ADG by Onsemi is a 6-bit latch with positive edge trigger, operating at -55 to 125 °C. It has a max frequency of 20MHz and load capacitance of 50pF. Suitable for military applications due to AEC-Q100 screening level.

Median Price

$0.445

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,824 parts In-Stock

1+ parts

-

100+ parts

$0.445

1k+ parts

$0.369

10k+ parts

$0.329

1,824

-

$0.445

$0.369

$0.329

Farnell

UK . 1,824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.363

10k+ parts

-

1,824

-

-

$0.363

-

Verical

USA . 1,824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.461

10k+ parts

$0.411

1,824

-

-

$0.461

$0.411

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,677 parts In-Stock

1+ parts

$0.347

100+ parts

-

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1,677

$0.347

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-

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Vyrian

USA . 3,829 parts In-Stock

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3,829

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,743 parts In-Stock

1+ parts

$0.309

100+ parts

-

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-

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-

1,743

$0.309

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-

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Corphita

USA . 1,815 parts In-Stock

1+ parts

$0.328

100+ parts

-

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-

1,815

$0.328

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-

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Vigor

Singapore . 768 parts In-Stock

1+ parts

$0.350

100+ parts

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768

$0.350

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Corohmni

South Africa . 268 parts In-Stock

1+ parts

$0.363

100+ parts

-

1k+ parts

-

10k+ parts

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268

$0.363

-

-

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Component Stockers USA

USA . 2,667 parts In-Stock

1+ parts

$0.370

100+ parts

$0.350

1k+ parts

$0.310

10k+ parts

-

2,667

$0.370

$0.350

$0.310

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AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$16.450

100+ parts

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819

$16.450

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Kulean Microsystems

USA . 6,602 parts In-Stock

1+ parts

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6,602

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Problanco Electronics

Mexico . 5,038 parts In-Stock

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SupplyDigital Components

Austria . 2,014 parts In-Stock

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2,014

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Continental Prestige Electronics

USA . 1,824 parts In-Stock

1+ parts

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100+ parts

$0.287

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1,824

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$0.287

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TANS Electronics

Latvia . 931 parts In-Stock

1+ parts

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931

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UHIMA Technologies

Türkiye . 352 parts In-Stock

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352

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Microchip USA

USA . 194 parts In-Stock

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194

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Overview

Unlock endless possibilities with the NLV74HC174ADG by Onsemi. Manufactured with precision and expertise, this latches & flip-flops category product offers unrivaled quality and reliability. Its versatile applications make it a must-have for various projects. With a compact design and high performance, this product ensures seamless operation and efficiency. Experience the value and benefits of this exceptional product, providing customers with a competitive edge in the market. Choose the NLV74HC174ADG for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and reducing assembly time.

Screening Level: AEC-Q100

AEC-Q100 standard ensures high reliability and quality, making this latch suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with most electronic systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this latch can withstand demanding industrial environments.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures precise timing control and reliable operation in digital circuits.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the latch energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops NLV74HC174ADG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV74HC174ADG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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