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NLV74HC174ANG

Onsemi

NLV74HC174ANG by Onsemi

NLV74HC174ANG by Onsemi is a 6-bit latch with positive edge trigger, operating b/w -55 to 125 °C. It has a supply voltage range of 2-6 V and AEC-Q100 screening level. Ideal for military applications due to its CMOS technology and through-hole terminal form.

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1k+

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Vyrian

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Kulean Microsystems

USA . 4,109 parts In-Stock

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Corphita

USA . 1,226 parts In-Stock

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TANS Electronics

Latvia . 847 parts In-Stock

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UHIMA Technologies

Türkiye . 778 parts In-Stock

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Corohmni

South Africa . 458 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

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Overview

Looking for a high-quality latch and flip-flop solution? Look no further than the NLV74HC174ANG by Onsemi. With AEC-Q100 screening level and military-grade temperature grade, this product offers reliability and durability like no other. Perfect for applications requiring true output polarity and positive edge triggering, this component is a must-have for any project. Trust Onsemi to deliver top-notch performance and value with the NLV74HC174ANG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to impact, making the product reliable for long-term use.

Screening Level: AEC-Q100

This indicates that the product meets automotive industry standards for reliability and quality, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy and efficient mounting in a circuit or system.

No. of Bits: 6

Having 6 bits allows for a higher resolution and more precise operation.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard electronic systems.

No. of Terminals: 16

Having 16 terminals provides flexibility in connectivity and ensures compatibility with various circuit designs.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for easy integration into a circuit layout.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended use.

Trigger Type: POSITIVE EDGE

The positive edge trigger ensures precise and accurate timing for triggering the latch or flip-flop.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, the product can operate in cold environments without issues.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in wiring configurations and allows for easy integration into various systems.

Maximum Seated Height: 4.44 mm

The low seated height allows for compact designs and space-saving installations.

Width: 7.62 mm

The moderate width ensures compatibility with standard spacing requirements in electronic systems.

Output Polarity: TRUE

True output polarity simplifies logic operations and ensures compatibility with other components in the system.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage allows for operation in low-power applications or systems with limited power supply.

Length: 19.175 mm

The length of the product is suitable for standard mounting configurations and allows for easy placement in a circuit.

Temperature Grade: MILITARY

With military-grade temperature tolerance, the product can operate in extreme conditions and harsh environments without failure.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in operation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and durable connections in a circuit board, ensuring reliability and stability.

Terminal Pitch: 2.54 mm

With a standard terminal pitch, the product can be easily integrated into various circuit designs and configurations.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V allows for operation in systems with higher power requirements without risk of damage.

Technical Specifications

Latches & Flip-Flops NLV74HC174ANG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Screening Level:

AEC-Q100

Maximum Seated Height:

4.44 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

NLV74HC174ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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