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NLV74HC259ADTR2G

Onsemi

NLV74HC259ADTR2G by Onsemi

NLV74HC259ADTR2G by Onsemi is a 16-terminal latch with 175ns propagation delay, operating b/w -55 to 125 °C. Ideal for military applications, it has a supply voltage range of 2-6V and AEC-Q100 screening level for automotive use.

Median Price

$0.208

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 35,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.340

35,000

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$0.340

Flip Electronics (Authorized)

USA . 35,000 parts In-Stock

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35,000

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Rochester

USA . 2,240 parts In-Stock

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-

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$0.201

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$0.167

10k+ parts

$0.148

2,240

-

$0.201

$0.167

$0.148

Verical

USA . 2,240 parts In-Stock

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$0.208

2,240

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$0.208

Distributors (In-Stock)

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Digiode

USA . 2,377 parts In-Stock

1+ parts

$0.157

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2,377

$0.157

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Vyrian

USA . 870 parts In-Stock

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$0.165

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870

$0.165

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Flip Electronics

USA . 35,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 743 parts In-Stock

1+ parts

$0.148

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743

$0.148

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Corohmni

South Africa . 332 parts In-Stock

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$0.165

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332

$0.165

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Component Stockers USA

USA . 1,347 parts In-Stock

1+ parts

$0.170

100+ parts

$0.160

1k+ parts

$0.140

10k+ parts

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1,347

$0.170

$0.160

$0.140

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Vigor

Singapore . 193 parts In-Stock

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$0.360

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193

$0.360

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Kulean Microsystems

USA . 8,186 parts In-Stock

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Microchip USA

USA . 6,660 parts In-Stock

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Problanco Electronics

Mexico . 5,426 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,274 parts In-Stock

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Continental Prestige Electronics

USA . 2,240 parts In-Stock

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$0.198

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TANS Electronics

Latvia . 1,495 parts In-Stock

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1,495

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SupplyDigital Components

Austria . 1,165 parts In-Stock

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UHIMA Technologies

Türkiye . 894 parts In-Stock

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894

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Overview

Unlock the potential of your electronic designs with the NLV74HC259ADTR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unmatched quality and reliability in every product. The NLV74HC259ADTR2G falls under the category of Latches & Flip-Flops, offering versatile applications in various electronic circuits. With a nominal supply voltage of 5V and a low propagation delay of 175 ns, this product ensures optimal performance in any project. Experience the value and benefits of Onsemi's cutting-edge technology with the NLV74HC259ADTR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch & flip-flop lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Being surface mountable, it allows for easy installation on PCBs, saving space and enhancing overall product design.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the latch & flip-flop meets the stringent automotive quality standards, making it reliable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides a stable power source for the latch & flip-flop, ensuring consistent performance.

Propagtion Delay (tpd): 175 ns

With a low propagation delay of 175ns, this latch & flip-flop offers fast operation, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C enables the latch & flip-flop to withstand elevated temperatures, ideal for harsh environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures the latch & flip-flop remains functional even in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the latch & flip-flop energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops NLV74HC259ADTR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

175 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

4.4 mm

Trade Compliance

NLV74HC259ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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