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NLV74AC74DR2G

Onsemi

NLV74AC74DR2G by Onsemi

NLV74AC74DR2G by Onsemi is a dual-function latches & flip-flops IC with 16ns propagation delay. Operating at -40 to 85°C, it has a supply voltage range of 2-6V and comes in a small outline package. Ideal for industrial applications requiring positive edge triggering and complementary output polarity.

Median Price

$0.212

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 32,500 parts In-Stock

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-

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32,500

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Rochester

USA . 27,388 parts In-Stock

1+ parts

-

100+ parts

$0.243

1k+ parts

$0.201

10k+ parts

$0.179

27,388

-

$0.243

$0.201

$0.179

Verical

USA . 23,529 parts In-Stock

1+ parts

-

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$0.224

23,529

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$0.224

DigiKey

USA . 2,500 parts In-Stock

1+ parts

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$0.199

2,500

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$0.199

Mouser Electronics

USA . 2,439 parts In-Stock

1+ parts

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$0.185

2,439

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$0.185

Distributors (In-Stock)

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Vyrian

USA . 1,794 parts In-Stock

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$0.185

100+ parts

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1,794

$0.185

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Digiode

USA . 2,205 parts In-Stock

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$0.189

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2,205

$0.189

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Flip Electronics

USA . 32,500 parts In-Stock

1+ parts

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32,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,541 parts In-Stock

1+ parts

$0.179

100+ parts

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1,541

$0.179

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Corohmni

South Africa . 201 parts In-Stock

1+ parts

$0.185

100+ parts

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201

$0.185

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Microchip USA

USA . 4,205 parts In-Stock

1+ parts

$1.529

100+ parts

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4,205

$1.529

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SupplyDigital Components

Austria . 8,337 parts In-Stock

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8,337

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Kulean Microsystems

USA . 4,632 parts In-Stock

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4,632

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TANS Electronics

Latvia . 2,799 parts In-Stock

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2,799

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Problanco Electronics

Mexico . 2,469 parts In-Stock

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2,469

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UHIMA Technologies

Türkiye . 441 parts In-Stock

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441

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Vigor

Singapore . 195 parts In-Stock

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195

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Overview

Enhance your electronic designs with the NLV74AC74DR2G by Onsemi, a top-quality latches & flip-flops component that guarantees reliability and precision. Manufactured by Onsemi, a trusted leader in the industry, this product offers superior performance and durability. Ideal for a wide range of applications, this versatile component ensures seamless operation and efficiency. Elevate your projects with the NLV74AC74DR2G and experience the value and benefits it brings to your creations. Trust in Onsemi for excellence in every design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environments.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation onto circuit boards.

No. of Functions: 2

Having 2 functions in one device provides flexibility and efficiency in circuit design.

Package Shape: RECTANGULAR

Rectangular shape saves space and allows for efficient placement on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operates at a widely used voltage level, making it compatible with many systems.

No. of Terminals: 14

Having 14 terminals allows for connectivity to multiple components, expanding the functionality.

Propagation Delay (tpd): 16 ns

Low propagation delay ensures fast response time, crucial for time-sensitive applications.

Maximum Operating Temperature: 85 °C

High operating temperature range makes it suitable for industrial applications where heat can be a concern.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise control and timing in digital circuits.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting options on the PCB.

Maximum Seated Height: 1.75 mm

Low seated height saves space and allows for compact designs.

Width: 3.9 mm

Narrow width enables dense packing of components on the board.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies logic operations and signal processing.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage allows for operation even in low-power systems.

Maximum Time At Peak Reflow Temperature (s): 30

Long reflow time window facilitates manufacturing and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints during manufacturing.

Length: 8.65 mm

Compact length allows for space-saving designs in compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates ruggedness and reliability in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Terminal Pitch: 1.27 mm

Standard terminal pitch ensures compatibility with commonly used PCB layouts.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage allows for operation in systems with higher voltage requirements.

Technical Specifications

Latches & Flip-Flops NLV74AC74DR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

16 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV74AC74DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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