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NLV74VHC74DTR2G

Onsemi

NLV74VHC74DTR2G by Onsemi

NLV74VHC74DTR2G by Onsemi is a dual-function latch with 17.5ns propagation delay and 110MHz min fmax. It operates b/w -55 to 125 °C, suitable for military-grade applications requiring positive edge triggering in compact designs.

Median Price

$0.249

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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Rochester

USA . 2,626 parts In-Stock

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$0.286

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$0.237

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$0.211

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$0.211

Verical

USA . 2,626 parts In-Stock

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$0.264

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DigiKey

USA . 2,500 parts In-Stock

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Mouser Electronics

USA . 956 parts In-Stock

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Digiode

USA . 1,572 parts In-Stock

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Vyrian

USA . 439 parts In-Stock

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Flip Electronics

USA . 5,000 parts In-Stock

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Corphita

USA . 2,138 parts In-Stock

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$0.211

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Corohmni

South Africa . 217 parts In-Stock

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$0.232

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Component Stockers USA

USA . 3,138 parts In-Stock

1+ parts

$0.630

100+ parts

$0.390

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$0.240

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3,138

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Microchip USA

USA . 5,148 parts In-Stock

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TANS Electronics

Latvia . 5,971 parts In-Stock

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Problanco Electronics

Mexico . 5,759 parts In-Stock

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Kulean Microsystems

USA . 3,312 parts In-Stock

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SupplyDigital Components

Austria . 996 parts In-Stock

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Vigor

Singapore . 367 parts In-Stock

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UHIMA Technologies

Türkiye . 177 parts In-Stock

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Overview

Discover the innovative NLV74VHC74DTR2G by Onsemi, a top-quality latches & flip-flops component that offers unparalleled reliability and performance. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. From its small outline to its superior technology, customers can trust in the value and benefits it provides. Upgrade your projects with the NLV74VHC74DTR2G and experience the advantages firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

No. of Functions: 2

Provides versatility and flexibility in operation, allowing for multiple functions to be performed by the latch or flip-flop.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with a wide range of systems and applications.

Propagation Delay (tpd): 17.5 ns

Fast propagation delay enables quick response times, crucial for time-sensitive operations.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise timing and accuracy in capturing input signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for a slightly higher supply voltage tolerance, providing added protection against power spikes or fluctuations.

Technical Specifications

Latches & Flip-Flops NLV74VHC74DTR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

17.5 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

110 MHz

Trade Compliance

NLV74VHC74DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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